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Lead-free electronics continues to be a concern of the aerospace, defense, and high performance products (ADHP) industries. This is primarily due to the lack of data and knowledge to: thoroughly categorize performance under harsh service conditions and provide a level of confidence in reliability assessments of Pb-free electronics equal to those for traditional tin-lead electronics. To help close...
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IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards