This is the German Language version of IPC-J-STD-020D.

Updated with extended support for components used for lead free assembly! This standard identifies the classification levels of nonhermetic solid state surface mount devices that are sensitive to moisture-induced stress.

It is used to determine which classification level should be used for initial reliability qualification. These devices can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during solder reflow attachment. Developed by IPC and JEDEC. 13 pages. Released June 2007