The IPC-WP-026 white paper explores blockchain as an emerging technology that has a core strength in providing an immutable, auditable, transparent and secure environment for data exchanges. These advantages make it a prime candidate for implementation in the electronics industry. The IPC-WP-026 white paper explores blockchain and its limitations and challenges. It also provides a few directions...
IPC-WP-024 is a white paper which discusses the issues associated with reliability of smart textiles (e-textiles structures) following multiple washing cycles and emphasizes efforts that industry and research laboratories must undertake to make e-textile structures more robust and able to be washed similarly to everyday textile products (e.g., underwear, clothing, home textiles and technical...
This white paper is a benchmarking exercise of e-textile integrations, providing an introductory categorization of how the current market sector is using textile-based electrical components to achieve integrated functionality. This peer assessment provides a baseline understanding of e-textile process techniques, requirements and resources within this emerging sector.
This document establishes a standard reporting format for exchange of information between supply chain participants about conflict minerals contained in suppliers' products and supports reporting at the company and product level, as mutually agreed upon between partners.
Addresses the complete process of reengineering new product development processes to incorporate DFX methodologies. Presents the case for a comprehensive analysis of the key business issues and definition of requirements before initiating work to refine or restructure processes. Editor, Dieter Bergman, IPC. 88 pages. Released by the Surface Mount Council, April 1997.
Status of the technology discussion on the various methodologies for mounting and interconnecting active devices to a variety of substrate materials is summarized in this document. Reviews mounting techniques of tape automated bonding (TAB), chip on board (COB) and flip chip. Examinations of the most commonly used substrate options of laminate, ceramic and silicon are also reviewed. Editor: John...
"Is Your RFP D.O. A." was presented at the IPC Conference for the PCB Industry: Critical Issues for the Military Market in December 2011 by Steve DeWaters, president, Penumbra Strategies, Inc. The author describes the procedures of the military in preparing an RFP and evaluating the proposals. He also describes the procedures to create an effective response to the RFP and some of the pitfalls of...
Amendment 1 to IPC-1755 Conflict Minerals Data Exchange establishes a standard reporting format for exchange of information between supply chain participants about conflict minerals contained in suppliers' products. IPC-1755 supports reporting at the company and product level, as mutually agreed upon between partners. 30 pages. Released April 2015. Please "Add to Cart" to download this item. You...
IPC-1754 WAM 1 Materials and Substances Declaration for Aerospace and Defense and Other Industries establishes the requirements for exchanging material and substance data for products between suppliers and their customers for Aerospace and Defense, Heavy Equipment and other industries. This standard covers the process for exchanging data on chemical substances (“Substances”) that may be present in...
IPC-9121 AM1 is an amendment to IPC-9121 which provides updates to the Hole Preparation/Protection and Interconnect Formation sections, covering troubleshooting topics and guidance on nonconductive plugging paste, microvias and pattern plating rim voids. IPC-9121 AM1 also includes a new section on Flexible Circuits.
The Amendment 2 to IPC-4103A-WAM1 made four fundamental changes to the base standard: All references to the epoxy curative of DICY (dicyandiamide) were removed; Opaque foreign inclusions were more specifically defined and limited; The optional properties of thermal conductivity for both laminates and bonding layers were added; and The dielectric constant (permittivity) ranges were specifically...
This document details the test procedures, test results and team conclusions for the IPC Cleaning and Cleanliness Testing Program, Phase 3, Low Solids Flux in Ambient Air. This effort has been part of a multi-stage program to investigate material and process alternatives to the use of chlorofluorocarbons (CFCs) in electronics manufacturing. This Phase 3 effort has been dedicated to characterizing...
This original research was a cooperative effort between the EMPF and IPC, released as EMPF-RR-0013 in 1993 for better understanding of ionic cleanliness testing. The IPC Ionic Conductivity/Ion Chromatography Test Task Group has validated its continued importance and relevance to the cleaning community and IPC-TR-583 is the result. It includes how solvent temperature influences the final...
IPC-CC-830 - Revision B - Standard with Amendment 1
This is the industry standard for qualification and quality conformance of conformal coating. Its intent is to show how to obtain maximum information with minimum test redundancy. Includes requirements and evaluations of material properties using standardized test vehicles. Amendment 1 updates include new qualification, retention and conformance inspection requirements for FTIR, MIR and hydrolytic...
Amendment 1 to IPC/WHMA-A-620B This amendment provides resolution to some internal conflicts, aligns common criteria to other IPC standards, and corrects some editorial errors. This amendment is only to be used in conjunction with IPC/WHMA-A-620 Revision B, October 2012. Follow your company policy and procedures to make pen and ink changes or notations to the published IPC/WHMA-A-620 Revision B...