Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards Amendment 2 to IPC-4552 is a new section in the original release of the IPC-4552. The Amendment 2 provides the “rules” by which any rework and/or repair of a printed board's ENIG surface finish is allowed. Effective September 2012.
This is a list of reported errata to the printed copies of IPC-A-600H. Pen and ink changes should be made in accordance with your company's document control policies.
IPC-9121 AM1 is an amendment to IPC-9121 which provides updates to the Hole Preparation/Protection and Interconnect Formation sections, covering troubleshooting topics and guidance on nonconductive plugging paste, microvias and pattern plating rim voids. IPC-9121 AM1 also includes a new section on Flexible Circuits.
The IPC-1791-Am1 provides revisions and clarifications for requirements pertaining to CAGE Code, citizenship, security, foreign person access, traceability records and NIST SP 800-171 compliance.
The Amendment 2 to IPC-4103A-WAM1 made four fundamental changes to the base standard: All references to the epoxy curative of DICY (dicyandiamide) were removed; Opaque foreign inclusions were more specifically defined and limited; The optional properties of thermal conductivity for both laminates and bonding layers were added; and The dielectric constant (permittivity) ranges were specifically...
This is a list of reported errata to the printed copies of IPC/ECA J-STD-002D. Pen and ink changes should be made in accordance with your company's document control policies.