This Addendum supplements or replaces specifically identified requirements of IPC-6012D, Revision D, for rigid printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics
This Addendum supplements or replaces specifically identified requirements of IPC-6018C, for high frequency (microwave) printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics.
Diese Ergänzung modifiziert oder ersetzt, falls in der Beschaffungsdokumentation oder den Zeichnungen gefordert, spezielle Anforderungen von IPC-6012D-DE für starre Leiterplatten, die Vibrationen und thermische Zyklen in den Umgebungsbedingungen für elektronische Verbindungen in der Automobilbranche überstehen müssen. Erschienen im April 2016. Übersetzt im September 2016.
IPC-6012 - Revision D - Addendum - Space and Military
Diese Ergänzung ergänzt oder ersetzt spezielle Anforderungen in IPC-6012D-DE, Ausgabe D für starre Leiterplatten, die Vibrationen, Bodentests und die Umgebungsbedingungen thermischer Zyklen von Raumfahrt und militärischer Luftfahrt bestehen müssen.
Esta adición suplementa o reemplaza específicamente identificado requisitos del IPC-6012D, revisión D, para los tableros impresos rígidos que tienen que sobrevivir a la vibración, ensayos/pruebas en tierra y ambientes cíclicos térmicos de espacio y aviónica militar.
IPC-6012 - Revision D - Addendum - Space and Military
Cet Avenant complète ou remplace les exigences de l’IPC-6012D, version D, spécifiquement identifiées pour les circuits imprimés rigides qui doivent supporter les environnements de vibration, de contrôle sur le terrain et de cyclage thermique du spatial et de l'aéronautique militaire.
The Amendment 1 to IPC-4556 made the following changes to the base specification: a) It added the absolute value of the maximum thickness for the immersion gold of 0.070 μm [2.8 μin] that accompanies the statistically valid minimum immersion gold thickness; b) It added two more photomicrograph images to provide better information on identifying nickel hyper corrosion; c) It added the basis of...
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards Amendment 1 to IPC-4552 replaces the Table 3-1 Requirements of Electroless Nickel Immersion Gold Plating plus also replaces all of sections 3.2.1 Immersion Nickel Thickness and 3.2.2 Immersion Gold Thickness in the original release of the IPC-4552. The Amendment 1 permits the use of thinner gold (≥4 µm...
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards Amendment 2 to IPC-4552 is a new section in the original release of the IPC-4552. The Amendment 2 provides the “rules” by which any rework and/or repair of a printed board's ENIG surface finish is allowed. Effective September 2012.
IPC-9121 AM1 is an amendment to IPC-9121 which provides updates to the Hole Preparation/Protection and Interconnect Formation sections, covering troubleshooting topics and guidance on nonconductive plugging paste, microvias and pattern plating rim voids. IPC-9121 AM1 also includes a new section on Flexible Circuits.
The IPC-1791-Am1 provides revisions and clarifications for requirements pertaining to CAGE Code, citizenship, security, foreign person access, traceability records and NIST SP 800-171 compliance.
The Amendment 2 to IPC-4103A-WAM1 made four fundamental changes to the base standard: All references to the epoxy curative of DICY (dicyandiamide) were removed; Opaque foreign inclusions were more specifically defined and limited; The optional properties of thermal conductivity for both laminates and bonding layers were added; and The dielectric constant (permittivity) ranges were specifically...