Menu
Close
Contact IPC

Addendum

Your results

Document #

Language

Products

no-image-available

IPC-6018 - Revision C - Addendum - Space and Military

高频（微波）印制板的鉴定及性能规范航天和军事航空电子应用补充标准

Document #:
IPC-6018
Revision
C
Product Type
Addendum
Released:  09/24/2019
Language
Chinese
Current Revision
本补充标准提供的要求，是对已发布的IPC-6018C 中要求的补充和某些情况下的替代， 以确保用于航天和军事航空电子设备中的印制电路板能够在振动、静态测试和热循环环境条件下的可靠性。2016年7月发布，2019年8月翻译。.
no-image-available

IPC/WHMA-A-620 - Revision C - Addendum - Rail Transit

线缆及线束组件的要求与验收轨道交通补充标准Rail Transit Addendum to IPC/WHMA-A-620C

Document #:
IPC/WHMA-A-620
Revision
C
Product Type
Addendum
Released:  06/22/2022
Language
Chinese
Current Revision
IPC/WHMA-A-620C-R 轨道交通补充标准提供了对 IPC/WHMA-A-620C 标准的补充要求，描述了用于轨道交通行业的线缆、线束及其组件的相关要求，如生产压接、机械固定和焊接互连的材料、方法、测试和验收标准等，以保证其在高速铁路环境下电缆线束及其组件的高度可靠性和环境适应性。
26-27 of 27

Coming Soon

IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)

IPC-2294: Design Standard for Printed Electronics on Rigid Substrates

IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards

J-STD-609C: Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-8401: Guidelines for In-Mold Electronics

IPC-HERMES-9852 Version 1.6: The Global Standard for Machine-to-Machine Communication in SMT Assembly