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Amendment

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Document #:
Revision
C
Product Type
Released:  11/02/2017
Language
English
Current Revision
The J-STD-006C-AM1 amendment provides better detail of a solder alloy's maximum allowed deviation about the nominal level of the element's mass than was provided in past alloy standards. The J-STD-006C-AM1 amendment provides information on negative effects of adding rare earth elements to specific, heavy tin-containing, lead-free solder alloys and propensity of tin whisker formation. Finally, the...
Document #:
Revision
Original Version
Product Type
Released:  05/01/2018
Language
English
Current Revision
IPC/JEDEC-9707-AM1 is an amendment which clarifies that the standard is only applicable to transient bending during short-term test operations. The standard specifies a common method of establishing strain limits of board-level device interconnects under spherical transient bending conditions, the worst-case flexure condition that can occur during conventional printed board/system assembly...