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IPC-6012E-AM1 Cover Image

IPC-6012 - Revision E - Amendment 1

Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
E
Product Type
Amendment
Released:  04/20/2022
Language
English
Current Revision
IPC-6012E-AM1 is an Amendent to the IPC-6012E that clarifes the distinction between receding and dewetting solder in reflowed SPb or HASL coatings. The Amendment also provides amended criteria for minimum external conductor thickness of the finished printed board and new acceptance criteria for the minimum thickness of internal plated layers

IPC-J-STD-006 - Revision C - Amendment 1

Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

Document #:
IPC-J-STD-006
Revision
C
Product Type
Amendment
Released:  11/02/2017
Language
English
Current Revision
The IPC-J-STD-006C-AM1 amendment provides better detail of a solder alloy's maximum allowed deviation about the nominal level of the element's mass than was provided in past alloy standards. The IPC-J-STD-006C-AM1 amendment provided information on negative effects of adding rare earth elements to specific, heavy tin-containing, lead-free solder alloys and propensity of tin whisker formation...
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IPC-4554 - Amendment 1

Specification for Immersion Tin Plating for Printed Circuit Boards

Document #:
IPC-4554
Revision
Original Version
Product Type
Amendment
Released:  09/01/2013
Language
English
Current Revision
IPC-4554, "Specification for Immersion Tin Plating for Printed Circuit Boards," is the third document in a series of specifications [the first two are: IPC-4552 which addresses electroless nickel/immersion gold (ENIG) and IPC-4553 which addresses immersion silver (IAg)] that set the requirements for printed circuit board surface finishes that are alternates to eutectic tin-lead. IPC-4554, a full...
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IPC-4821 - Amendment 1

Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

Document #:
IPC-4821
Revision
Original Version
Product Type
Amendment
Released:  05/01/2006
Language
English
Current Revision
IPC-4821 Amendment 1 provides the update of IPC-CF-148 to the correct IPC-4563, references the IPC-TM-650, Method 2.5.7.2 for correct Hi-Pot testing of these thin materials, uses proper reference for visual inspection by inspectors and finally, updated the first five material specification sheets (IPC-4821/1 through IPC-4821/5) that now show Effective Dates of April 2010. The Specification Sheet...

IPC-6012 - Revision E - Amendment 1

刚性印制板的鉴定及性能规范- 修订本1

Document #:
IPC-6012
Revision
E
Product Type
Amendment
Released:  10/28/2022
Language
Chinese
Current Revision
IPC-6012E-AM1是IPC-6012E的修订本，澄清了再流焊SnPb或HASL镀层中退润湿和焊料回缩之间的区别。 该修订本还为成品印制板的最小外部导体厚度提供了修订标准，并为内部电镀层的最小厚度提供了新的接受标准。
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IPC-6012 - Revision D - Amendment 1

Sert Baskı Devre Kartları İçin Kalifikasyon ve Performans Spesifikasyonu

Document #:
IPC-6012
Revision
D
Product Type
Amendment
Released:  01/25/2019
Language
Turkish
Current Revision
Bu döküman; kaplı delikiçine sahip olan veya olmayan tek yüzlü, çift yüzlü baskı devre kartları ve kör/gömülü geçiş deliklerine sahip olan veya olmayan çok katmanlı baskı devre kartları ile metal çekirdekli kartları içeren sert baskı devre kartlarının kalifikasyonunu ve performansını kapsamaktadır. Son kaplama ve yüzey kaplama gereklilikleri, iletkenler, delikler/geçiş delikleri, kabul testlerinin...
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IPC-9121 - Amendment 1

印制板制造工艺问题解答 修订本1

Document #:
IPC-9121
Revision
Original Version
Product Type
Amendment
Released:  10/08/2020
Language
Chinese
Current Revision
本手册可供任何生产制造或采购印制板的人员作为基本资源。数百张真实的全彩色照片聚焦了650多个印刷电路板工艺缺陷，每个缺陷都有其分析原因和纠正措施。IPC-9121是取代1997年12月发布 的IPC-PE-740A中的PCB部分。2016年3月发布9121英文母标准，2018年年4月发布修订本1，修订本1于2020年4月翻译。详情参见目录。
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Coming Soon

IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

IPC-2294: Design Standard for Printed Electronics on Rigid Substrates

IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates

J-STD-005B: Requirements for Soldering Pastes

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards

J-STD-609C: Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

J-STD-004D: Requirements for Soldering Fluxes

IPC-4413: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards

IPC-HERMES-9852 Version 1.6: The Global Standard for Machine-to-Machine Communication in SMT Assembly