Products
IPC-HDBK-9798 provides guidelines and supporting information for manufacturing electronic assemblies using compliant press-fit technology. The intent is to explain the ‘‘how-to’’ and ‘‘why’’ information, and fundamentals for these processes. This handbook is supporting the IPC-9797 standard.
Coming Soon
IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards