Historical Revision


IPC-J-STD-006B-AM1&2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

Amendments 1 & 2 to IPC J-STD-006B make the following nine changes to the basic document:

1. Correct some editorial mistakes in the document's text,

2. Add reference to IPC/JEDEC J-STD-609, Lead-Free and Leaded Marking, Symbols and Labels,

3. Clarify the meaning of those alloys that are designated as lead-free,

4. Provide guidance to suppliers how to designate and mark lead-free alloys,

5. Correct the required maximum levels of lead (Pb) and antimony (Sb) allowed as impurities in section 3.3 Alloy Impurities,
6. Transfer all information references on solder powder particle size distribution and solder paste products to IPC J-STD-005, Requirements for Solder Pastes,

7. Remove Table 3-1 "Particle Size Distributions of Standard Solder Powders",

8. Change the information contained in Table A-1 "Composition and Temperature Characteristics of Lead-free Solder Alloys" (contained within Appendix A "Solder Alloys"), and

9. Establish a consistent maximum contaminant level requirement within Appendix B-1 for the elements of silver (Ag), lead (Pb) and antimony (Sb). 

Published Date
DoD Adopted
ANSI Approved