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IPC-T-50N Cover Image

IPC-T-50 - Revision N - Standard Only

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Document #:
IPC-T-50
Revision
N
Product Type
Standard Only
Released:  11/30/2021
Language
English
Current Revision
IPC-T-50N document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing English as a second language could understand the subtleties of the meaning. IPC-T-50N contains over 550 new or revised terms, including new terminology for via structures, surface mount device...
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IPC-1782 - Revision B - Standard Only

Standard for Manufacturing and Supply Chain Traceability of Electronic Products

Document #:
IPC-1782
Revision
B
Product Type
Standard Only
Released:  10/20/2023
Language
English
Current Revision
IPC-1782B establishes minimum requirements for manufacturing and supply chain traceability based on perceived risk. IPC-1782B applies to all products, processes, assemblies, parts, components, equipment used and other items as defined by users and suppliers in the manufacture of printed board assemblies, as well as mechanical assembly and printed board fabrication. IPC-1782B is applicable both for...

IPC-2581 - Revision C - Standard Only

Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

Document #:
IPC-2581
Revision
C
Product Type
Standard Only
Released:  11/20/2020
Language
English
Current Revision
The IPC-2581C standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most...

IPC-9850 - Revision A - Standard Only

Surface Mount Placement Equipment Characterization

Document #:
IPC-9850
Revision
A
Product Type
Standard Only
Released:  12/21/2011
Language
English
Current Revision
This standard establishes the parameters, procedures and methodologies used to measure and report pick and place machine accuracy as a relationship to placement speed for a range of SMT component sizes and configurations. Purchase of this standard includes support documentation, report forms and the test material drawings in DWG format.
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IPC-2591 - Version 1.7 - Standard Only

Connected Factory Exchange (CFX)

Document #:
IPC-2591
Revision
1.7
Product Type
Standard Only
Released:  08/24/2023
Language
English
Current Revision
This standard establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. This standard applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semiautomated and manual, and is applicable to related mechanical assembly and...
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IPC-1756 - Standard Only

Manufacturing Process Data Management

Document #:
IPC-1756
Revision
Original Version
Product Type
Standard Only
Released:  04/05/2010
Language
English
Current Revision
IPC-1756 establishes the requirements for exchanging manufacturing data between suppliers and customers for electrical and electronic products. IPC-1756 establishes 23 fields for declaration of manufacturing data supported by Scriba and other tools developed for use between users and suppliers. The type of manufacturing information includes sensitivity to moisture and high temperature, different...
IPC/DAC-2552 Cover Image

IPC-DAC-2552 - Standard Only

General Electronic Components Model Based Definition (MBD) Standard

Document #:
IPC/DAC-2552
Revision
Original Version
Product Type
Standard Only
Released:  08/02/2022
Language
English
Current Revision
The IPC/DAC-2552 standard was developed jointly with the Digital Association of China (DAC), with the purpose to use Model Based Definition (MBD) to realize efficient and high-quality digital design of board-level assembly, support electronic assembly virtual manufacturing, and enabling the digitalization from requirement to product realization for printed board assemblies. The IPC/DAC-2552...
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IPC-2501 - Standard Only

Definition for Web-Based Exchange of XML Data

Document #:
IPC-2501
Revision
Original Version
Product Type
Standard Only
Released:  07/01/2003
Language
English
Current Revision
IPC-2501 establishes the governing semantics and an XML based syntax for shop floor communication between electronic assembly equipment and associated software applications. This standard outlines the communication architecture and supporting XML messages. The standard also describes a messaging interface that is based upon an architecture whereby a single logical middleware server (the Message...
IPC-HERMES-9852 V. 1.5 Cover Image

IPC/HERMES-9852 - Version 1.5 - Standard Only

The Global Standard for Machine-to-Machine Communication in SMT Assembly

Document #:
IPC/HERMES-9852
Revision
1.5
Product Type
Standard Only
Released:  01/13/2023
Language
English
Current Revision
The IPC-HERMES-9852 is an open industry standard, developed by the Hermes Standard Initiative and approved by IPC. The IPC-HERMES-9852 provides a state-of-the-art communication protocol for machine-to-machine communication for surface-mount technology. Specifically, IPC-HERMES-9852, version 1.5 provides additional alignment with IPC-2591 (IPC-CFX). Used with IPC-2591, Connected Factory Exchange...
IPC-Hermes-9852 V 1.4 Cover Image

IPC/HERMES-9852 - Version 1.4 - Standard Only

The Global Standard for Machine-to-Machine Communication in SMT Assembly

Document #:
IPC/HERMES-9852
Revision
1.4
Product Type
Standard Only
Released:  04/13/2022
Language
English
Current Revision
The IPC-Hermes-9552 v. 1.4 is an open industry standard, developed by The Hermes Initiative and approved by IPC. The IPC-Hermes-9542 provide a state-of-the-art communication protocol for machine-to-machine communication for surface-mount technology (SMT). Specifically, IPC-HERMES-9852, version 1.4 provides additional alignment with IPC-2591 (IPC-CFX). Used with IPC-2591, Connected Factory Exchange...
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IPC-J-STD-048 - Standard Only

Notification Standard for Product Discontinuance

Document #:
IPC-J-STD-048
Revision
Original Version
Product Type
Standard Only
Released:  05/02/2015
Language
English
Current Revision
This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. The goal of this notification standard is to better enable customers to manage and mitigate the disruption caused by the discontinuation of a product and to ensure continuity of supply. This standard establishes the requirements for timely customer notification of planned...

IPC-T-50 - Revision M - Standard Only

Termes et Définitions pour les Circuits Électroniques Imprimés et Assemblés

Document #:
IPC-T-50
Revision
M
Product Type
Standard Only
Released:  06/30/2015
Language
French
Current Revision
Ce document essentiel pour l’industrie fournit des descriptions et des illustrations de la terminologie de l’industrie d’assemblage électronique afin d’aider les utilisateurs et leur clients à casser les barrières linguistiques. La révision M contient plus de 220 termes nouveaux ou révisés, incluant la nouvelle terminologie pour les procédés de tropicalisation, d’enrobage et d’encapsulation, la...
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IPC-T-50 - Revision N - Standard Only

电子电路互连与封装术语及定义

Document #:
IPC-T-50
Revision
N
Product Type
Standard Only
Released:  01/13/2023
Language
Chinese
Current Revision
IPC-T-50N-CN文件旨在为电子行业中常用的词汇和术语提供其定义。本文件所规定的定义充分详细地阐明了术语，以便以英语为第二语言的读者能够理解含义的细微之处。IPC-T-50N-CN包含550多个新的或修订的术语，包括通孔结构、表面贴装器件类型、焊料凸点、焊料合金、焊接、退润湿、电路板制造工艺和测试的新术语。

IPC-T-50 - Revision K - Standard Only

Begriffe und Definitionen für Leiterplatten und elektronische Baugruppen

Document #:
IPC-T-50
Revision
K
Product Type
Standard Only
Released:  02/03/2015
Language
German
Current Revision
Das unentbehrliche Nachschlagewerk für alle Verantwortlichen entlang der Wertschöpfungskette von elektronischen Produkten. Die Revision K enthält auf mehr als 120 Seiten, mehr als 220 neue und überarbeitete Begriffe und bildliche Darstellungen. Beispiele: Access Hole, Accelerated Equivalent Soak, Capture Land, Micro Via Technology, Plating Thief, Etchback, Resin Recession, Tape Automated Bonding...
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IPC-HERMES-9852 - Standard Only

表面贴装技术组装中机器对机器通信的全球标准

Document #:
IPC/HERMES-9852
Revision
Original Version
Product Type
Standard Only
Released:  01/20/2020
Language
Chinese
Current Revision
这个开放的行业标准是由Hermes标准倡议小组开发并获得IPC批准的国际标准，它为用于表面贴装技术（SMT）的机器对机器通信提供了最新的通信协议。 具体来说，IPC-HERMES-9852版本1.2提供了从标准版本1.1开始的电气SMEMA接口替代，并扩展了该接口以传达诸如已处理印制板的唯一标识符，通知印制板的第一台机器的设备标识符，条形码之类的信息，传送带速度以及有关产品类型的特定信息。 IPC-HERMES-9852与IPC-2591，互联工厂交互一起使用，可以帮助任何规模的电子制造商将其公司与智能制造和工业4.0相结合。
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IPC-2591 - Version 1.3 - Standard Only

互联工厂数据交换 (CFX)

Document #:
IPC-2591
Revision
1.3
Product Type
Standard Only
Released:  09/21/2021
Language
Chinese
Current Revision
该标准建立了制造过程和装配制造相关主机系统之间全方位信息交换的要求。 本标准适用于印制板组件制造中所有可执行过程之间的通信，自动、半自动和手动，适用于相关的机械装配和交易过程。 IPC-2591 版本 1.3 提供了多个 IPC-CFX 消息的更新以及按设备类型划分的强制性和可选 IPC-CFX 消息。 请访问 www.ipc-cfx.org，获取有关 IPC-CFX 实施的设备验证系统的软件开发人员资源和信息。
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IPC-2591 - Standard Only

Connected Factory Exchange (CFX)-JP

Document #:
IPC-2591
Revision
Original Version
Product Type
Standard Only
Released:  09/27/2019
Language
Japanese
Current Revision
本標準は、製造工程とそれに関連する組立品製造用のホストシステム間との全方向的な情報交換に関する要件を規定している。 本標準は、自動化、半自動化、および手動によるプリント基板組立品製造におけるすべての実行可能な工程間の通信に適用され、関連する機械的組立ておよびトランザクション処理にも適用可能である。 2019年8月翻訳

IPC-2591 - Standard Only

Échanges au sein d’une usine connectée (CFX)

Document #:
IPC-2591
Revision
Original Version
Product Type
Standard Only
Released:  09/25/2019
Language
French
Current Revision
La présente norme établit les exigences relatives à l’échange omnidirectionnel d’informations entre les procédés de fabrication et les systèmes hôtes associés dans la fabrication des assemblages. Cette norme s’applique à la communication entre tous les procédés exécutables présents dans la fabrication d’assemblages de circuits imprimés, automatisés, semi-automatisés et manuels, et aux procédés d...

IPC-2591 - Standard Only

Datenaustausch in der vernetzten Fabrik (CFX)

Document #:
IPC-2591
Revision
Original Version
Product Type
Standard Only
Released:  07/11/2019
Language
German
Current Revision
Diese Richtlinie legt die Anforderungen für den omnidirektionalen Informationsaustausch zwischen Fertigungsprozessen und zugehörigen Leitsystemen für die Baugruppenmontage fest. Diese Richtlinie gilt für die Kommunikation zwischen allen ausführbaren Prozessen bei der Herstellung von Leiterplatten-Baugruppen (automatisiert, halbautomatisiert und manuell) und gilt für die zugehörigen mechanischen...
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IPC-1782 - Standard Only

电子产品的制造和供应链可追溯性标准

Document #:
IPC-1782
Revision
Original Version
Product Type
Standard Only
Released:  04/12/2019
Language
Chinese
Current Revision
缺乏统一的元器件可追溯性标准已经导致不必要的资源消耗（例如时间、人力、金钱等）来跟踪事件或部件的来源，并补救相关质量、可靠性等问题。标准缺失也导致难以一致地创建和适当地执行必要的合同。 本标准建立了制造商和供应链可追溯性的最低要求，此要求是基于供需双方协商确定（AABUS）的感知风险。本标准适用于所有产品，制程，组件，部件，元器件，所使用的设备以及由供需双方在印制电路板组件制造以及机械组装中定义的其他项目。
1-21 of 21

Coming Soon

IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)

IPC-2294: Design Standard for Printed Electronics on Rigid Substrates

IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards

J-STD-609C: Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-HERMES-9852 Version 1.6: The Global Standard for Machine-to-Machine Communication in SMT Assembly