Covers the information requirements for the procurement of material, box build, assembly, system integration, inspection, test, burn-in, delivery and/or distribution of electronic assemblies. 5 pages. Released January 2004.
Products
This is the document all process engineers must have! Useful for day-to-day problem solving, it contains case histories of problems and corrective action in the design, manufacture, assembly and testing of printed wiring products. Each section has been updated to reflect today's manufacturing challenges. Sections address documentation, phototooling, raw materials, mechanical operations, hole...
Covers the requirements for copper/invar/copper (CIC), copper/molybdenum/ copper (CMC) and three-layer composites for use in electronic applications.
This document provides the designer/user with guideline information related to the use of pressure sensitive adhesives (PSAs) for fabrication and assembly of flexible, rigid or rigid-flex printed boards, membrane switches and component attachments. It also provides information on adhesive types available, their inherent strengths, weaknesses, limitations and correct processes needed for creating...
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision M contains over 220 new or revised terms, including new terminology for conformal coatings, potting and encapsulation processes, stencil design, statistical process control, and flexible printed board...
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision K contains more than 220 new or revised terms, including new terminology for thermal properties, etchback, assembly processing, hole drilling, and microvia technology. Also includes commonly used industry...
IPC-J-STD-001H is recognized globally for its criteria on soldering processes and materials. Updated with participants from 27 countries providing input and expertise, the IPC-J-STD-001H standard brings the latest criteria to the industry including guidance on the use of x-ray to inspect through-hole solder conditions that are not visible by any other means. IPC-J-STD-001H is a must-have for those...
IPC-A-610H is the most widely used electronics assembly acceptance standard in the electronics industry. IPC-A-610H standard includes a general update to the document, introduces several new surface mount component types and removes target conditions. Participants from 29 countries provided their input and expertise to bring this document to the electronics industry. This is a must-have for...
This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers. Revision J contains nearly 400 new or revised terms, including new terminology for chip scale and area array packaging, cable and wire harness technology, assembly processing, moisture sensitive components, and...
This standard is the first of its kind for IPC; the first acceptability standard for electronic enclosures. It contains acceptability criteria that pertain to the "box build" of the assembly process. This standard has been written to direct manufacturers and end users of electronic enclosures of electrical and electronic equipment to understand the best practices to meet requirements, ensuring the...
This standard establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. This standard applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semiautomated and manual, and is applicable to related mechanical assembly and...
These tables are from IPC/WHMA-A-620 Revision B Chapter 19 Testing. They are provided in an electronic format that permits users to edit the tables to add user-specific criteria. These files are authorized for copying/reproduction.
Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system. IPC-SM-840 provides two classes of requirements, T and H, to reflect functional performance requirements and testing severity based on industry/end use requirements. Coverage is given to adhesion, material qualification...
This standard is a collection of visual quality acceptability criteria for solder paste printing. It provides a standardized language for solder paste characterization. It provides users with common descriptions and potential causes for solder paste deposits. The standard provides valuable insights to the solder paste printing operations which can be used in troubleshooting of the printing process...
This document is intended to clarify terms used in the area of fluid dispensing. As is often the case, different terms are used by different manufacturers to convey a similar meaning. Common interchangeable terms are shown in parenthesis and the reader should not infer one term is preferred over the other.
Establishes requirements, definitions and certification provisions for optical inspection aids. Defines inspection grades to be used as accept/reject criteria for optical inspection aids. 40 pages. Released October 1993.
IPC-2501 establishes the governing semantics and an XML based syntax for shop floor communication between electronic assembly equipment and associated software applications. This standard outlines the communication architecture and supporting XML messages. The standard also describes a messaging interface that is based upon an architecture whereby a single logical middleware server (the Message...
This standard establishes construction detail requirements for bumps and other terminal structures used for Flip Chip Scale carriers. The specific standards for different terminations are appropriately matched to a particular interconnection process and include such diverse terminations as solder bumps, columns, non-melting stand-offs and conductive polymer deposits. The document articulates a set...
Establishes mechanical drop and shock and test guidelines for assessing solder joint reliability of printed board assemblies from system to component level. This document addresses methods to define mechanical shock use-conditions, methods to define system level, system printed board level and component test board level testing that correlate to such use conditions and guidance on the use of...
This document will provide insight into the theory behind tin whisker formation as it is known today and, based on this knowledge, potential mitigation practices that may delay the onset of, or prevent tin whisker formation. The potential effectiveness of various mitigation practices will also be briefly discussed. References behind each of the theories and mitigation practices are provided. It...
IPC/WHMA-A-620D is the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies. IPC/WHMA-A-620D describes materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities associated with cable and harness assemblies. IPC/WHMA-A-620D was developed by IPC and...
The IPC-5262 prescribes the minimum design, critical process and acceptance requirements for the application of polymeric materials to electrical/electronic components, modules, printed wiring assemblies and other elements thereof. The intent of IPC-5262 is to establish a baseline of requirements, procedures, practices and process attributes based on lessons learned and best practices that have...
J-STD-001 is recognized globally for its criteria on soldering processes and materials. Updated with participants from 18 countries providing input and expertise, this document brings the latest criteria along with new graphics to the industry for ease of use and comprehension. This is a must-have for those in the electronics industry with an interest in the process and acceptance criteria for...
IPC-A-610 is the most widely used electronics assembly acceptance document. Updated with participants from 17 countries providing input and expertise, this document brings the latest criteria along with many new and revised graphics to the industry. This is a must-have for inspectors, operators and others with an interest in the acceptance criteria for electronic assemblies. IPC-A-610 is developed...
IPC JEDEC J-STD-020 is used to determine what moisture-sensitivity-level (MSL) classification level should be used so that surface mount devices (SMDs) can be properly packaged, stored and handled to avoid subsequent thermal and mechanical damage during the assembly solder reflow attachment and/or repair operation. J-STD-020 covers components to be processed at higher temperatures for lead-free...
Coming Soon
IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards