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Document #:

IPC-T-50

Revision

Product Type

Standard Only

Released: 10/18/2011

Language

English

This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers. Revision J contains nearly 400 new or revised terms, including new terminology for chip scale and area array packaging, cable and wire harness technology, assembly processing, moisture sensitive components, and...

Document #:

IPC/WHMA-A-620

Revision

Product Type

Standard Only

Released: 01/21/2020

Language

English

IPC/WHMA-A-620D is the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies. IPC/WHMA-A-620D describes materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities associated with cable and harness assemblies. IPC/WHMA-A-620D was developed by IPC and...

Document #:

IPC/WHMA-A-620

Revision

Original Version

Product Type

Standard Only

Released: 01/01/2012

Language

English

Current Revision

These tables are from IPC/WHMA-A-620 Revision B Chapter 19 Testing. They are provided in an electronic format that permits users to edit the tables to add user-specific criteria. These files are authorized for copying/reproduction.

Document #:

IPC-0040

Revision

Original Version

Product Type

Standard Only

Released: 05/01/2003

Language

English

Current Revision

This document addresses the implementation of optical and optoelectronic packaging technologies. The areas discussed include: technology choices, design considerations, material properties, component mounting and interconnecting structures, assembly processes, testing, application, rework, and reliability of completed optoelectronic products. Optoelectronic packaging technologies include active...

Document #:

IPC-7527

Revision

Original Version

Product Type

Standard Only

Released: 05/17/2012

Language

English

Current Revision

This standard is a collection of visual quality acceptability criteria for solder paste printing. It provides a standardized language for solder paste characterization. It provides users with common descriptions and potential causes for solder paste deposits. The standard provides valuable insights to the solder paste printing operations which can be used in troubleshooting of the printing process...

Document #:

IPC-A-610

Revision

Product Type

Standard Only

Released: 10/31/2017

Language

English

IPC-A-610 is the most widely used electronics assembly acceptance document. Updated with participants from 17 countries providing input and expertise, this document brings the latest criteria along with many new and revised graphics to the industry. This is a must-have for inspectors, operators and others with an interest in the acceptance criteria for electronic assemblies. IPC-A-610 is developed...

Document #:

IPC-5262

Revision

Original Version

Product Type

Standard Only

Released: 10/17/2022

Language

English

Current Revision

The IPC-5262 prescribes the minimum design, critical process and acceptance requirements for the application of polymeric materials to electrical/electronic components, modules, printed wiring assemblies and other elements thereof. The intent of IPC-5262 is to establish a baseline of requirements, procedures, practices and process attributes based on lessons learned and best practices that have...

Document #:

IPC-2591

Revision

1.7

Product Type

Standard Only

Released: 08/24/2023

Language

English

Current Revision

This standard establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. This standard applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semiautomated and manual, and is applicable to related mechanical assembly and...

Document #:

IPC-SMEMA 7

Revision

Original Version

Product Type

Standard Only

Released: 02/12/2007

Language

English

Current Revision

This document is intended to clarify terms used in the area of fluid dispensing. As is often the case, different terms are used by different manufacturers to convey a similar meaning. Common interchangeable terms are shown in parenthesis and the reader should not infer one term is preferred over the other.

Document #:

IPC-S-816

Revision

Original Version

Product Type

Standard Only

Released: 07/01/1993

Language

English

Current Revision

Why waste time looking for answers? This handy, easy-to-use troubleshooting guide lists all types of processing problems and solutions for surface mount assembly. Covers bridging, skips, misalignment, placement and more. 38 pages. Released July 1993.

Document #:

IPC-TM-650

Revision

Original Version

Product Type

Standard Only

Language

English

Current Revision

Contains over 150 industry approved test techniques and procedures for chemical, mechanical, electrical, and environmental tests on all forms of printed boards and connectors. New and updated test methods are available for download at https://www.ipc.org/test-methods.

Document #:

IPC-D-279

Revision

Original Version

Product Type

Standard Only

Released: 07/01/1996

Language

English

Current Revision

Establishes design concepts, guidelines and procedures for reliable printed wiring assemblies. Focuses on SMT or mixed technology PWAs, specifically addressing the interconnect structure and the solder joint itself. Discusses substrates, components, attachment materials, coatings and assembly processes and testing considerations. In addition, this document contains detailed appendices covering...

Document #:

IPC-1331

Revision

Original Version

Product Type

Standard Only

Released: 03/01/2000

Language

English

Current Revision

This voluntary standard establishes minimum requirements for the design, installation, operation and maintenance of electrically heated process equipment in order to minimize electrical hazards and prevent fires that may occur in combustible tanks, tank liners and drying equipment.

Document #:

IPC-1756

Revision

Original Version

Product Type

Standard Only

Released: 04/05/2010

Language

English

Current Revision

IPC-1756 establishes the requirements for exchanging manufacturing data between suppliers and customers for electrical and electronic products. IPC-1756 establishes 23 fields for declaration of manufacturing data supported by Scriba and other tools developed for use between users and suppliers. The type of manufacturing information includes sensitivity to moisture and high temperature, different...

Document #:

IPC/EIA-J-STD-028

Revision

Original Version

Product Type

Standard Only

Released: 08/01/1999

Language

English

Current Revision

This standard establishes construction detail requirements for bumps and other terminal structures used for Flip Chip Scale carriers. The specific standards for different terminations are appropriately matched to a particular interconnection process and include such diverse terminations as solder bumps, columns, non-melting stand-offs and conductive polymer deposits. The document articulates a set...

Document #:

IPC/JEDEC-9703

Revision

Original Version

Product Type

Standard Only

Released: 03/18/2009

Language

English

Current Revision

Establishes mechanical drop and shock and test guidelines for assessing solder joint reliability of printed board assemblies from system to component level. This document addresses methods to define mechanical shock use-conditions, methods to define system level, system printed board level and component test board level testing that correlate to such use conditions and guidance on the use of...

Document #:

IPC-9191

Revision

Original Version

Product Type

Standard Only

Released: 11/01/1999

Language

English

Current Revision

IPC-9191 reflects the principals of statistical process control (SPC) represented by ISO/DIS 11462-1, Guidelines for Implementation of Statistical Process Control (SPC) -- Part 1: Elements of SPC. This document outlines the SPC philosophy, implementation strategies, tools, and techniques used for relating process control and capability to final product requirements. Supersedes IPC-PC-90.

Document #:

IPC/DAC-2552

Revision

Original Version

Product Type

Standard Only

Released: 08/02/2022

Language

English

Current Revision

The IPC/DAC-2552 standard was developed jointly with the Digital Association of China (DAC), with the purpose to use Model Based Definition (MBD) to realize efficient and high-quality digital design of board-level assembly, support electronic assembly virtual manufacturing, and enabling the digitalization from requirement to product realization for printed board assemblies. The IPC/DAC-2552...

Document #:

IPC-4781

Revision

Original Version

Product Type

Standard Only

Released: 05/30/2008

Language

English

Current Revision

The industry's first specification for the evaluation of a legend and/or marking ink material for the determination of acceptability of use in a standard printed board system. IPC-4781 provides coverage for adhesion, material qualification and testing, resistances to solvents, requirements for resistance to lead-free solders, and electrical requirements. 17 pages. Released May 2008.

Document #:

IPC-SM-785

Revision

Original Version

Product Type

Standard Only

Released: 11/01/1992

Language

English

Current Revision

Guidelines for accelerated reliability testing of surface mount solder attachments when evaluating and extrapolating the results of these tests towards actual use environments of electronic assemblies. 50 pages. Released November 1992.

Document #:

IPC-CA-821

Revision

Original Version

Product Type

Standard Only

Released: 01/01/1995

Language

English

Current Revision

Covers requirements and test methods for thermally conductive dielectric adhesives used to bond components in place. Permanent, removable and self-shimming adhesives are addressed. 18 pages. Released January 1995.

Document #:

IPC-2501

Revision

Original Version

Product Type

Standard Only

Released: 07/01/2003

Language

English

Current Revision

IPC-2501 establishes the governing semantics and an XML based syntax for shop floor communication between electronic assembly equipment and associated software applications. This standard outlines the communication architecture and supporting XML messages. The standard also describes a messaging interface that is based upon an architecture whereby a single logical middleware server (the Message...

Document #:

IPC-9111

Revision

Original Version

Product Type

Standard Only

Released: 02/13/2019

Language

English

Current Revision

The IPC-9111 handbook is a valuable resource for anyone involved in manufacturing or purchasing printed board assemblies. Issues in the assembly process are presented along with possible causes and actions to take to resolve them. Photos are provided throughout the document to assist the reader. IPC-9111 supersedes the printed board assembly sections of IPC-PE-740A.

Document #:

IPC/HERMES-9852

Revision

1.5

Product Type

Standard Only

Released: 01/13/2023

Language

English

Current Revision

The IPC-HERMES-9852 is an open industry standard, developed by the Hermes Standard Initiative and approved by IPC. The IPC-HERMES-9852 provides a state-of-the-art communication protocol for machine-to-machine communication for surface-mount technology. Specifically, IPC-HERMES-9852, version 1.5 provides additional alignment with IPC-2591 (IPC-CFX). Used with IPC-2591, Connected Factory Exchange...

Document #:

IPC-J-STD-001

Revision

Product Type

Standard Only

Released: 10/31/2017

Language

English

J-STD-001 is recognized globally for its criteria on soldering processes and materials. Updated with participants from 18 countries providing input and expertise, this document brings the latest criteria along with new graphics to the industry for ease of use and comprehension. This is a must-have for those in the electronics industry with an interest in the process and acceptance criteria for...