Standard Only

Your results

Products

Document #:

IPC-8497

Revision

Original Version

Product Type

Standard Only

Released: 12/01/2005

Language

English

Current Revision

This standard describes the methods of inspecting and cleaning all optical interfaces so that interconnectivity integrity of the optical signal is maintained. The information provided focuses on techniques and methods to accomplish maximum quality of the interface and describes methods of contamination prevention. The target audience for this standard are Manufacturing Operators, Manufacturing...

Document #:

IPC-D-279

Revision

Original Version

Product Type

Standard Only

Released: 07/01/1996

Language

English

Current Revision

Establishes design concepts, guidelines and procedures for reliable printed wiring assemblies. Focuses on SMT or mixed technology PWAs, specifically addressing the interconnect structure and the solder joint itself. Discusses substrates, components, attachment materials, coatings and assembly processes and testing considerations. In addition, this document contains detailed appendices covering...

Document #:

IPC-9641

Revision

Original Version

Product Type

Standard Only

Released: 07/10/2013

Language

English

Current Revision

Printed board flatness is largely affected by a change in intrinsic properties through exposure to variances in temperature. The worst case deviation of the printed board from flatness may be at room temperature, peak temperature during reflow, or at any temperature in between. Printed board flatness must therefore be characterized during the entire reflow thermal cycle, and not solely at room...

Document #:

ECA/IPC/JEDEC-J-STD-075

Revision

Original Version

Product Type

Standard Only

Released: 09/03/2008

Language

English

Current Revision

J-STD-075 picks up where J-STD-020 left off by providing test methods to classify worst-case thermal process limitations for electronic components. Classification is referenced to common industry wave and reflow solder profiles including lead-free processing. The classifications represent maximum process sensitivity levels and do not establish rework conditions or recommended processes for an...

Document #:

IPC-6013

Revision

Product Type

Standard Only

Released: 09/01/2017

Language

English

The IPC-6013D covers qualification and performance requirements for flexible printed boards designed to IPC-2221 and IPC-2223. The flexible printed board may be single-sided, double-sided, multilayer or rigid-flex multilayer. All of these constructions may include stiffeners, PTHs, microvias, and blind/buried vias. IPC-6013D incorporates new and updated requirements for final finishes, rigid-to...

Document #:

IPC-6012

Revision

Product Type

Standard Only

Released: 09/22/2015

Language

English

This specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical...

Document #:

IPC-9194

Revision

Original Version

Product Type

Standard Only

Released: 09/01/2004

Language

English

Current Revision

This guideline standard is intended to aid in interpretation of the requirements in IPC-9191, "General Guidelines for Implementation of Statistical process Control," specifically for printed board assembly (PBA) manufacture. This document and IPC-9191 should be used together; the standards are cross-referenced to each other in the Appendices of this guideline. This standard promotes process...

Document #:

IPC/JEDEC-9301

Revision

Original Version

Product Type

Standard Only

Released: 01/15/2019

Language

English

Current Revision

The IPC/JEDEC-9301document is an effort to standardize and document some of the basic tenets of a typical Finite Element Analysis (FEA) model, as well as, to educate new designers (and in some cases even experienced designers) on the basic information and best practices that should be captured and provided to technical reviewers of the results of FEA data.

Document #:

IPC-9199

Revision

Original Version

Product Type

Standard Only

Released: 09/01/2002

Language

English

Current Revision

This document is a tool for a customer or supplier organization's internal audit group to assess a statistical process control (SPC) system against the requirements of IPC-9191. This document should be used by customers and suppliers of any size and for any commodity. This tool can be used to perform an assessment of the use of SPC at both organizational and process levels. The questions in this...

Document #:

IPC-5701

Revision

Original Version

Product Type

Standard Only

Released: 07/01/2003

Language

English

Current Revision

Tackling PCB cleanliness is a tough job; residues on printed circuit boards are directly related to the reliability of the produced hardware and can result in serious failures if not known or monitored. But how do you measure "cleanliness"? How clean is "clean"? The IPC-5701 provides guidance into how these issues should be approached and specified in purchasing documents, addressing levels of...

Document #:

IPC-MS-810

Revision

Original Version

Product Type

Standard Only

Released: 10/01/1993

Language

English

Current Revision

Discusses the many variables and problems associated with the process--from sample removal to micro-etch-- and the variables common to high volume microsection. The process variables and problems are organized so that the reader can research a specific issue or overview the variables of a process area. 31 pages. Released October 1993.

Document #:

IPC-9241

Revision

Original Version

Product Type

Standard Only

Released: 01/13/2017

Language

English

Current Revision

This standard is intended as a guideline in the proper preparation of a metallographic sample (microsection) of a printed board. The finished microsection is used for evaluating the quality of the laminate system and plated structures (e.g. PTHs and vias). Microsection sample preparation is regarded by many as a highly developed skill. The guidelines in this standard discuss the many variables and...

Document #:

IPC-A-610

Revision

Product Type

Standard Only

Released: 04/13/2010

Language

English

IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610E illustrates industry-accepted workmanship criteria for electronics assemblies through full-color photographs and illustrations. Topics include flex attachment, board in board, part on part, lead free, component orientation and soldering criteria for...

Document #:

IPC-MC-790

Revision

Original Version

Product Type

Standard Only

Released: 07/01/1992

Language

English

Current Revision

Provides information on multichip module technology, including parametric data, design and manufacturing information and a proposed categorization of various approaches to multichip interconnect substrate technologies based on dielectric family. 120 pages. Released August 1992.

Document #:

IPC-A-610

Revision

Product Type

Standard Only

Released: 08/28/2014

Language

English

IPC-A-610F Amendment 1 is now available. See Related items. IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610F illustrates industry-accepted workmanship criteria for electronics assemblies through detailed statements reflecting acceptable and defect conditions, supported by full-color photographs and...

Document #:

IPC-9631

Revision

Original Version

Product Type

Standard Only

Released: 12/15/2010

Language

English

Current Revision

IPC-9631 addresses concerns and considerations related to IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation. This document describes how the test method is intended for use and the rationale behind some of the protocols and requirements. This document was developed with the understanding that the test method will require special equipment and the proper set-up and...

Document #:

IPC-9708

Revision

Original Version

Product Type

Standard Only

Released: 12/14/2010

Language

English

Current Revision

Mechanical bend and shock tests are routinely performed on SMT assemblies to ensure that they can sustain anticipated production, handling and end use conditions. The strains and strain rates applied to SMT assemblies during bend and shock testing can lead to a variety of failure modes in the vicinity of the solder joints. This document provides test methods to evaluate the susceptibility of...

Document #:

IPC-CI-408

Revision

Original Version

Product Type

Standard Only

Released: 01/01/1994

Language

English

Current Revision

Provides information on design characteristics and the application of solderless surface mount connectors, including conductive adhesives to aid IC package and board interconnection. 34 pages. Released January 1994.

Document #:

IPC-SM-840

Revision

Product Type

Standard Only

Released: 04/30/2007

Language

English

Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system. IPC-SM-840 provides two classes of requirements, T and H, to reﬂect functional performance requirements and testing severity based on industry/end use requirements. Coverage is given to adhesion, material qualification...

Document #:

IPC-5703

Revision

Original Version

Product Type

Standard Only

Released: 05/17/2013

Language

English

Current Revision

Printed board cleanliness has historically been an unknown factor in the quality assessment of unpopulated (bare) printed boards; this has often been attributed to a lack of understanding of materials and processes. This document addresses the various printed board fabrication processes and how each may impact, directly or indirectly, the final cleanliness of packaged bare printed boards and...

Document #:

IPC-9706

Revision

Original Version

Product Type

Standard Only

Released: 01/14/2014

Language

English

Current Revision

Survey-based study presents data and analysis on the EMS industry, examining trends in sources of revenue, revenue per employee, services offered, markets served, manufacturing technology, capital investment, spending on equipment and materials and market size including forecasts and potential for market expansion. This study is based on data provided by a representative sample of 120 EMS...

Document #:

IPC-5702

Revision

Original Version

Product Type

Standard Only

Released: 06/01/2007

Language

English

Current Revision

Every electronics manufacturer, whether an original equipment manufacturer (OEM) or electronics manufacturing services (EMS) company, must determine if the unpopulated printed boards entering the assembly process have an adequate level of cleanliness. The question of “how clean is clean enough?” is one that has no definitive answer, as there is no "golden number" for board cleanliness. The issue...

Document #:

IPC/WHMA-A-620

Revision

Product Type

Standard Only

Released: 10/02/2017

Language

English

This is the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies, and it includes new sections for safety wiring, safety cable, grommets, and raceways along with updated information across many of the sections. With over 700 photographs and illustrations, this standard describes materials, methods, tests and acceptance criteria for producing crimped...

Document #:

IPC/JEDEC-J-STD-033

Revision

Product Type

Standard Only

Released: 08/01/2014

Language

English

Provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. These procedures provide a minimum shelf life of 12 months...

Document #:

IPC-7711/21

Revision

Product Type

Standard Only

Released: 02/01/2017

Language

English

This guide provides procedures for rework, repair and modification of printed board assemblies. Included in this revision are the procedures previously released as change pages, an updated general information and common procedures section, new procedures for BGAs using focused IR Reflow Systems with integral preheater and general updates to all other procedures.