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Document #:

IPC/EIA-J-STD-032

Revision

Original Version

Product Type

Standard Only

Released: 06/01/2002

Language

English

Current Revision

This standard, developed jointly by IPC and the Electronic Industries Association (EIA) establishes the construction detail requirements for balls and other terminal structures on Ball Grid Array (BGA) packages. It also establishes a set of designations and expectations for product performance. A large variety of terminal structures are recognized for a wide range of applications ranging from...

Document #:

IPC-TP-1114

Revision

Original Version

Product Type

Standard Only

Released: 01/01/1998

Language

English

Current Revision

Originally developed for J-STD-001B, it is also applicable to current assembly standards. Electronics manufacturers are faced with the difficult task of proving that a candidate manufacturing process can produce acceptable hardware, either to the customer of the product, or for internal quality control. Users have to determine many of the process qualification steps on their own. This document...

Document #:

IPC-4121

Revision

Original Version

Product Type

Standard Only

Released: 01/01/2000

Language

English

Current Revision

IPC-4121 provides industry-approved guidelines for selecting core constructions for multilayer printed wiring boards (PWBs). The specification sheets in the document categorize the different core constructions by laminate type and nominal thickness. The constructions are rated for characteristics such as dielectric constant (DK), dimensional stability (DS), flatness, smoothness and drillability...

Document #:

IPC-MS-810

Revision

Original Version

Product Type

Standard Only

Released: 10/01/1993

Language

English

Current Revision

Discusses the many variables and problems associated with the process--from sample removal to micro-etch-- and the variables common to high volume microsection. The process variables and problems are organized so that the reader can research a specific issue or overview the variables of a process area. 31 pages. Released October 1993.

Document #:

IPC-D-859

Revision

Original Version

Product Type

Standard Only

Released: 12/01/1989

Language

English

Current Revision

This standard covers the requirements and considerations for the design of multilayer hybrid circuits based on industry manufacturing capabilities. 80 pages. Released December 1989.

Document #:

IPC-D-322

Revision

Original Version

Product Type

Standard Only

Released: 09/01/1984

Language

English

Current Revision

Defines guidelines for choosing sizes of printed wiring boards using standard fabrication panel sizes. 4 pages. Reaffirmed September 1991.

Document #:

IPC-2223

Revision

Product Type

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Released: 09/20/2016

Language

English

Used in conjunction with IPC-2221, IPC-2223 establishes the specific requirements for the design of flexible printed boards and forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced dielectric in combination with metallic materials. Revision D provides new design guidance and...

Document #:

IPC-4130

Revision

Original Version

Product Type

Standard Only

Released: 09/01/1998

Language

English

Current Revision

Determines the nomenclature, definitions and requirements for materials made from nonwoven "E" glass fibers. IPC-4130 also includes specification sheets for selecting and purchasing these materials. 14 pages. Released September 1998. Equivalent to IEC Publicly Available Specification (PAS) 62212

Document #:

IPC-QF-143

Revision

Original Version

Product Type

Standard Only

Released: 02/01/1992

Language

English

Current Revision

Covers classification and requirements for finished fabrics woven from quartz fiber yarns that are intended as a reinforcing material in laminated plastics for electrical and electronic use. 13 pages. Released February 1992.

Document #:

IPC-4110

Revision

Original Version

Product Type

Standard Only

Released: 08/01/1998

Language

English

Current Revision

Determines the nomenclature, chemical and physical requirements of paper made from cellulose fibers for PWB fabrication. IPC-4110 also includes specification sheets for selecting and purchasing these materials. 11 pages. Released August 1998.

Document #:

IPC-SG-141

Revision

Original Version

Product Type

Standard Only

Released: 02/01/1992

Language

English

Current Revision

Covers the classification and requirements for finished fabrics woven from "S" glass, electrical grade glass fiber yarns intended as a reinforcing material in laminated plastics for electrical and electronic use. 12 pages. Released February 1992.

Document #:

IPC-A-610

Revision

Product Type

Standard Only

Released: 04/13/2010

Language

English

IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610E illustrates industry-accepted workmanship criteria for electronics assemblies through full-color photographs and illustrations. Topics include flex attachment, board in board, part on part, lead free, component orientation and soldering criteria for...

Document #:

IPC-9241

Revision

Original Version

Product Type

Standard Only

Released: 01/13/2017

Language

English

Current Revision

This standard is intended as a guideline in the proper preparation of a metallographic sample (microsection) of a printed board. The finished microsection is used for evaluating the quality of the laminate system and plated structures (e.g. PTHs and vias). Microsection sample preparation is regarded by many as a highly developed skill. The guidelines in this standard discuss the many variables and...

Document #:

IPC-NC-349

Revision

Original Version

Product Type

Standard Only

Released: 08/01/1985

Language

English

Current Revision

Defines a machine readable input format for Computer Numerical Control (CNC) drilling and routing machine tools used by the printed wiring board industry. The format may be used to transfer drilling and routing information between printed board designers, manufacturers and users or as the output CNC standard from converters that expand higher level design input such as IPC-D-350 data. Provides a...

Document #:

IPC-MC-790

Revision

Original Version

Product Type

Standard Only

Released: 07/01/1992

Language

English

Current Revision

Provides information on multichip module technology, including parametric data, design and manufacturing information and a proposed categorization of various approaches to multichip interconnect substrate technologies based on dielectric family. 120 pages. Released August 1992.

Document #:

IPC-SM-780

Revision

Original Version

Product Type

Standard Only

Released: 07/01/1988

Language

English

Current Revision

This document examines key issues in advanced packaging techniques. Provides information on what types of parts are available, the techniques and processes necessary for their proper use, possible advantages/disadvantages or problems, how to start implementation and where to find additional information. 138 pages. Released March 1988.

Document #:

JEDEC/ECIA/IPC-J-STD-046

Revision

Original Version

Product Type

Standard Only

Released: 11/14/2016

Language

English

Current Revision

This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes.

Document #:

JEDEC/IPC-JP002

Revision

Original Version

Product Type

Standard Only

Released: 03/01/2006

Language

English

Current Revision

This document will provide insight into the theory behind tin whisker formation as it is known today and, based on this knowledge, potential mitigation practices that may delay the onset of, or prevent tin whisker formation. The potential effectiveness of various mitigation practices will also be briefly discussed. References behind each of the theories and mitigation practices are provided. It...

Document #:

IPC-HM-860

Revision

Original Version

Product Type

Standard Only

Released: 01/01/1987

Language

English

Current Revision

Covers the qualification and performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of three or more layers of conductor patterns separated from each other by insulating materials and interconnected by a continuous metallic interlayer connection. The substrate may include passive elements. 66 pages. Released January 1987.

Document #:

IPC-A-610

Revision

Product Type

Standard Only

Released: 08/28/2014

Language

English

IPC-A-610F Amendment 1 is now available. See Related items. IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610F illustrates industry-accepted workmanship criteria for electronics assemblies through detailed statements reflecting acceptable and defect conditions, supported by full-color photographs and...

Document #:

IPC/EIA-J-STD-026

Revision

Original Version

Product Type

Standard Only

Released: 08/01/1999

Language

English

Current Revision

This standard addresses semiconductor flip chip design requirements. Provides information for using standard semiconductor substrates, materials, assembly and test methods with established fabrication, bumping, test and handling practices. Electrical, thermal and mechanical chip design parameters and methodologies are covered in the standard, as well as the reliability aspects associated with...

Document #:

IPC-9631

Revision

Original Version

Product Type

Standard Only

Released: 12/15/2010

Language

English

Current Revision

IPC-9631 addresses concerns and considerations related to IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation. This document describes how the test method is intended for use and the rationale behind some of the protocols and requirements. This document was developed with the understanding that the test method will require special equipment and the proper set-up and...

Document #:

IPC-9708

Revision

Original Version

Product Type

Standard Only

Released: 12/14/2010

Language

English

Current Revision

Mechanical bend and shock tests are routinely performed on SMT assemblies to ensure that they can sustain anticipated production, handling and end use conditions. The strains and strain rates applied to SMT assemblies during bend and shock testing can lead to a variety of failure modes in the vicinity of the solder joints. This document provides test methods to evaluate the susceptibility of...

Document #:

IPC-8701

Revision

Original Version

Product Type

Standard Only

Released: 07/16/2014

Language

English

Current Revision

IPC-8701 presents acceptance guidelines for the solar panel in final module assembly. The intent of this standard is to cover crystalline solar modules.Some of the content may be applicable to other photovoltaic modules such as thin film. The standard reviews and includes acceptance guidelines for incoming and finished frames, frame assembly, sealant, tape, junction box assembly, and bus bar...

Document #:

IPC-CI-408

Revision

Original Version

Product Type

Standard Only

Released: 01/01/1994

Language

English

Current Revision

Provides information on design characteristics and the application of solderless surface mount connectors, including conductive adhesives to aid IC package and board interconnection. 34 pages. Released January 1994.