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Document #:

IPC-2615

Revision

Original Version

Product Type

Standard Only

Released: 07/01/2000

Language

English

Current Revision

The definitive standard on printed board dimensioning and tolerancing is finally here! IPC-2615 comprehensively covers dimensioning and tolerancing of electronic packaging and is consistent with other IPC printed board standards such as IPC-6012A and IPC-2221A. The document includes fundamental dimensioning and tolerancing rules, positional, profile, orientation and form tolerances and detailed...

Document #:

IPC-5262

Revision

Original Version

Product Type

Standard Only

Released: 10/17/2022

Language

English

Current Revision

The IPC-5262 prescribes the minimum design, critical process and acceptance requirements for the application of polymeric materials to electrical/electronic components, modules, printed wiring assemblies and other elements thereof. The intent of IPC-5262 is to establish a baseline of requirements, procedures, practices and process attributes based on lessons learned and best practices that have...

Document #:

IPC-2251

Revision

Original Version

Product Type

Standard Only

Released: 11/01/2003

Language

English

Current Revision

This guideline addresses the major factors influencing the design of high-speed circuitry. Considerations include electrical noise, electromagnetic interference, signal propagation time, impedance, thermo-mechanical environmental protection, and heat dissipation. Supersedes IPC-D-317A. Key improvements over the IPC-D-317A document include updated impedance models for embedded microstrip, centered...

Document #:

IPC-2612

Revision

Original Version

Product Type

Standard Only

Released: 04/30/2010

Language

English

Current Revision

This standard establishes the requirements for the documentation of electronic diagrams used as the foundation for defining the electrical interconnectivity of electronic products. The description pertains to either schematic diagrams, logic diagrams or Boolean truth tables and includes methodology for defining circuit flow, electrical or functional restrictions, or maintenance test procedures...

Document #:

IPC-2612-1

Revision

Original Version

Product Type

Standard Only

Released: 04/30/2010

Language

English

Current Revision

This standard establishes the requirements for generation of electronic symbols used in the documentation of electronic diagrams that define the electrical interconnectivity of electronic products. The descriptions pertain to schematic symbols, logic symbols or Boolean truth tables required to define the circuit configuration. Where appropriate, the standard also includes methodology for defining...

Document #:

IPC-D-279

Revision

Original Version

Product Type

Standard Only

Released: 07/01/1996

Language

English

Current Revision

Establishes design concepts, guidelines and procedures for reliable printed wiring assemblies. Focuses on SMT or mixed technology PWAs, specifically addressing the interconnect structure and the solder joint itself. Discusses substrates, components, attachment materials, coatings and assembly processes and testing considerations. In addition, this document contains detailed appendices covering...

Document #:

IPC-2225

Revision

Original Version

Product Type

Standard Only

Released: 05/01/1998

Language

English

Current Revision

Used in conjunction with IPC-2221A, IPC-2225 establishes the requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of Single Chip Module (SCM-L), MCM or MCM-L assemblies. Key concepts include adhesive interconnection information, typical die attach materials, microvia material properties and relationships with DFM and DFE. 44 pages. Released...

Document #:

IPC-2316

Revision

Original Version

Product Type

Standard Only

Released: 03/01/2007

Language

English

Current Revision

IPC-2316 offers printed board users and designers the necessary information for incorporating formed and placed embedded passive components into their applications. The history of embedded passive technologies is given along with full coverage of embedded resistors, capacitors and inductors. In addition, it also assists the user in understanding some of the physical, electrical and thermal...

Document #:

IPC-2315

Revision

Original Version

Product Type

Standard Only

Released: 06/01/2000

Language

English

Current Revision

Published jointly with the Japan Printed Circuits Association, IPC/JPCA-2315 provides an easy to follow tutorial on the selection of HDI and microvia design rules and structures. Addresses various considerations when designing an HDI printed wiring board including design examples and processes, selection of materials, general descriptions, and various microvia technologies. Offers designers and...

Document #:

IPC-A-311

Revision

Original Version

Product Type

Standard Only

Released: 03/01/1996

Language

English

Current Revision

Covers the information and data to be collected during the generation and use of phototools to improve artwork quality, thereby improving yields downstream. It also helps establish and maintain ISO 9000 certification and SPC by facilitating troubleshooting, standardizing the process for both experienced and inexperienced operators and by identifying process improvements for the ultimate...

Document #:

IPC-D-322

Revision

Original Version

Product Type

Standard Only

Released: 09/01/1984

Language

English

Current Revision

Defines guidelines for choosing sizes of printed wiring boards using standard fabrication panel sizes. 4 pages. Reaffirmed September 1991.

Document #:

IPC-D-351

Revision

Original Version

Product Type

Standard Only

Released: 08/01/1985

Language

English

Current Revision

Describes an intelligent, digital format for transfer of drawings between printed wiring board designers, manufacturers and customers. Also conveys additional requirements, guidelines and examples necessary to provide the data structures and concepts for drawing description in digital form. Supplements ANSI/IPC-D-350. Pertains to four basic types of drawings: master drawings, schematics, assembly...

Document #:

IPC-D-352

Revision

Original Version

Product Type

Standard Only

Released: 08/01/1985

Language

English

Current Revision

Describes the relationship between elements used in electromechanical design and packaging of printed boards. Includes descriptions for logical and physical elements necessary as input to a design system, as well as the network of interconnection description between the various electronic parts. Provides the capability of describing all elements in their final form upon design completion. The...

Document #:

IPC-D-355

Revision

Original Version

Product Type

Standard Only

Released: 01/01/1995

Language

English

Current Revision

Describes an intelligent, digital data transfer format for describing component mounting information. Supplements IPC-D-350 and is for designers and assemblers. Data included are pin location, component orientation, etc. This document is frozen; no future updates are planned. 33 pages. Released January 1995.

Document #:

IPC-D-422

Revision

Original Version

Product Type

Standard Only

Released: 09/01/1982

Language

English

Current Revision

Contains backplane design information from the fabrication and assembly perspective. Includes sections on design and documentation; fabrication; assembly; repair; and inspection. 17 pages. Revised September 1982.

Document #:

IPC-D-354

Revision

Original Version

Product Type

Standard Only

Released: 02/01/1987

Language

English

Current Revision

Describes the usage of libraries within the processing and generation of information files. The data contained within covers both the definition and usage of internal (existing within the information file) and external libraries. The libraries can be used to make generated data more compact and facilitate data exchange and archival. The subroutines within a library can be used one or more times...

Document #:

IPC-T-50

Revision

Product Type

Standard Only

Released: 06/30/2015

Language

French

Current Revision

Ce document essentiel pour l’industrie fournit des descriptions et des illustrations de la terminologie de l’industrie d’assemblage électronique afin d’aider les utilisateurs et leur clients à casser les barrières linguistiques. La révision M contient plus de 220 termes nouveaux ou révisés, incluant la nouvelle terminologie pour les procédés de tropicalisation, d’enrobage et d’encapsulation, la...

Document #:

IPC-T-50

Revision

Product Type

Standard Only

Released: 01/13/2023

Language

Chinese

Current Revision

IPC-T-50N-CN文件旨在为电子行业中常用的词汇和术语提供其定义。本文件所规定的定义充分详细地阐明了术语，以便以英语为第二语言的读者能够理解含义的细微之处。IPC-T-50N-CN包含550多个新的或修订的术语，包括通孔结构、表面贴装器件类型、焊料凸点、焊料合金、焊接、退润湿、电路板制造工艺和测试的新术语。

Document #:

IPC-T-50

Revision

Product Type

Standard Only

Released: 02/03/2015

Language

German

Current Revision

Das unentbehrliche Nachschlagewerk für alle Verantwortlichen entlang der Wertschöpfungskette von elektronischen Produkten. Die Revision K enthält auf mehr als 120 Seiten, mehr als 220 neue und überarbeitete Begriffe und bildliche Darstellungen. Beispiele: Access Hole, Accelerated Equivalent Soak, Capture Land, Micro Via Technology, Plating Thief, Etchback, Resin Recession, Tape Automated Bonding...

Document #:

IPC-7095

Revision

Product Type

Standard with amendment(s)

Released: 09/19/2019

Language

Chinese

Current Revision

IPC-7095D在设计，组装，检查和维修过程中实施球栅阵列（BGA）和细节距球栅阵列（FBGA）技术提出了了一些独特的挑战。它为使用或正在考虑使用BGA的用户提供有用和实用的信息。它还介绍了如何使用BGA成功实现印刷电路板组件的稳健设计和装配流程，以及解决BGA组装过程中可能出现的一些常见异常的方法。由于焊球中合金，焊球形状，封装程序等的改变，许多问题变得尤为重要。D版主要重点是为组装后出现的一些新的机械失效问题如坑裂或层压缺陷提供信息。除了提供BGA检查和维修的指引外，本标准还解决了与BGA相关的可靠性问题和无铅焊点的使用标准。该标准中有许多X射线和内窥镜的照片和插图以确认行业中BGA组装工艺的实施中的遇到的一些情况。

Document #:

IPC-2223

Revision

Product Type

Standard Only

Released: 08/10/2021

Language

Chinese

Current Revision

IPC-2223与IPC-2221一起使用时，IPC-2223确立了挠性印制板设计以及组件安装和互连结构形式的特定要求。结构中使用的挠性材料由绝缘膜，增强和/或非增强电介质与金属材料组成。 IPC-2223E为制造图纸，孔到边的间距，弯曲区域的导体注意事项，刚性和挠性区域之间的介电厚度以及双行零插入力（ZIF）连接器提供了新的设计指南和要求

Document #:

IPC-7095

Revision

Product Type

Standard with amendment(s)

Released: 06/17/2020

Language

Japanese

Current Revision

IPC-7095D-AM1は、ボールグリッドアレイ(BGA)およびファインピッチBGA(FBGA)技術の設計および組立の実施について記述するものであり、これらのパッケージを使用したプリント基板の設計と組立に関連する検査、リペアおよび信頼性の問題に焦点を当てている。 IPC-7095D-AM1は、BGAを使用している、もしくは使用を検討している本書読者に対し、有用で実用的な情報を提供するものである。またIPC-7095D-AM1では、BGAを使用するプリント基板組立のためのロバスト設計と組立プロセスの正しい方法について説明するとともに、BGAの組立中に発生する可能性のある一般的な異常について、トラブルシューティングの方法を説明している。

Document #:

IPC-2222

Revision

Product Type

Standard Only

Released: 03/08/2021

Language

French

Current Revision

Utilisée conjointement avec la norme IPC-2221, la norme IPC-2222B établit les exigences spécifiques pour la conception de circuits imprimés organiques rigides et autres formes d’installations de composants et de structures dʼinterconnexion. La norme IPC-2222B sʼapplique aux circuits simple face, double face ou multicouche. Les concepts clés de la norme IPC-2222B sont les propriétés des stratifiés...

Document #:

IPC-7351

Revision

Product Type

Standard Only

Released: 06/30/2010

Language

German

Current Revision

Dieses bekannte Dokument deckt das Anschlussflächen-Design für alle Typen von passiven und aktiven Bauteilen ab, inklusive MELFs, SOPs, QFPs, BGAs, QFNs und SONs. Der Standard unterstützt Leiterplatten-Designer mit durchdachten Anschlussflächen-Bezeichnungen, 0°-Drehlage der Bauteile für CAD-Systeme und drei unterschiedlichen Anschlussflächen-Geometrien (Design-Produzierbarkeitsstufen) für jedes...

Document #:

IPC-2141

Revision

Product Type

Errata

Released: 01/01/2018

Language

English

Current Revision

This is a list of reported errata to the printed copies of IPC-2141A. Pen and ink changes should be made in accordance with your company's document control policies.