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IPC-J-STD-001 - Revision H - Addendum - Space and Military

Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies

Document #:
IPC-J-STD-001
Revision
H
Product Type
Addendum
Released:  05/13/2021
Language
English
Current Revision
IPC J-STD-001HS space and military addendum, supplements or replaces specifically identified requirements of IPC J-STD-001H requirements for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications.
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IPC-J-STD-001 and IPC-A-610 - Revision H - Addendum - Automotive

Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610H Acceptability of Electronic Assemblies

Document #:
IPC-J-STD-001 and IPC-A-610
Revision
H
Product Type
Addendum
Released:  03/08/2022
Language
English
Current Revision
IPC J-STD-001HA/IPC-A-610HA is the automotive addendum to J-STD-001H and IPC-A-610H. It provides criteria to ensure the reliability of soldered automotive electrical and electronic assemblies in the field under harsh environments and considers automated high-volume production. IPC J-STD-001HA/IPC-A-610HA addendum is not a standalone document, and it must be used in conjunction with J-STD-001H and...
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IPC-6012 - Revision F - Addendum - Space and Military

Space and Military Avionics Applications Addendum to IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
F
Product Type
Addendum
Released:  02/23/2024
Language
English
Current Revision
The IPC-6012FS space addendum provides exceptions to IPC Performance Class 3 requirements of the IPC-6012F for use in space and military avionics product. Exceptions include changes to acceptance criteria and/or sample size and test frequency for production lot acceptance testing. The IPC-6012FS covers requirements for rigid printed boards to survive vibration, extreme thermal cycling and ground...
IPC-6012EA Cover Image

IPC-6012 - Revision E - Addendum - Automotive

Automotive Applications Addendum to IPC-6012E Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
E
Product Type
Addendum
Released:  11/30/2021
Language
English
Current Revision
The IPC-6012EA Addendum, when required by procurement documentation/drawings, supplements or replaces specifically identified requirements of IPC-6012 revision E, for rigid printed boards that must survive the vibration and thermal cycling environments of electronic interconnects within the automotive industry. The addendum includes updated requirements for lifted lands, pattern feature accuracy...
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IPC-6012 - Revision D - Addendum with Amendment 1 - Automotive

Automotive Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
D
Product Type
Addendum with amendment(s)
Released:  12/01/2018
Language
English
The IPC-6012DA-WAM1 Addendum, when required by procurement documentation/drawings, supplements or replaces specifically identified requirements of IPC-6012D, Revision D, for rigid printed boards that must survive the vibration and thermal cycling environments of electronic interconnects within the automotive industry. The amendment changes to this document includes updated requirements for lifted...

IPC-J-STD-001 - Revision F - Addendum with Amendment 1 - Space and Military

Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies

Document #:
IPC-J-STD-001
Revision
F
Product Type
Addendum with amendment(s)
Released:  02/01/2017
Language
English
This addendum supplements J-STD-001F for soldered assemblies that must survive the vibration and thermal cyclic environments associated with space hardware. It is to be used with J-STD-001FS WAM 1.
IPC-6018DS

IPC-6018 - Revision D - Addendum - Space and Military

Space and Military Avionics Applications Addendum to IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

Document #:
IPC-6018
Revision
D
Product Type
Addendum
Released:  08/04/2022
Language
English
The IPC-6018DS addendum supplements or replaces specifically identified requirements of IPC-6018D, for high frequency (microwave) printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics. The IPC-6018DS addendum incorporates new requirements in areas such as copper wrap plating, dewetting, pad/land anomalies, copper cap plating...

IPC-J-STD-001 - Revision F - Addendum - Space and Military

Space Applications Electronic Hardware Addendum to J-STD-001F

Document #:
IPC-J-STD-001
Revision
F
Product Type
Addendum
Released:  02/12/2015
Language
English
This Addendum supplements or replaces specifically identified requirements of IPC J-STD-001, Revision F, for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space.
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IPC-J-STD-001 - Revision E - Addendum - Space and Military

Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic Assemblies

Document #:
IPC-J-STD-001
Revision
E
Product Type
Addendum
Released:  12/01/2010
Language
English
When specifically required by procurement documentation, this Addendum supplements or replaces specifically identified requirements of IPC J-STD-001, Revision E of April 2010 by providing additional requirements to ensure the reliability of soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments getting to and operating in space. The required...

IPC-6012 - Revision E - Addendum - Space and Military

Space and Military Avionics Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
E
Product Type
Addendum
Released:  04/24/2020
Language
English
The IPC-6012ES space addendum provides exceptions to Class 3 requirements of the IPC-6012E for use in space and military avionics product. Exceptions include changes to acceptance criteria and/or sample size and test frequency for production lot acceptance testing. The IPC-6012ES covers requirements for rigid printed boards to survive vibration, extreme thermal cycling and ground testing...

IPC-J-STD-001 - Revision G - Addendum - Space and Military

Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies

Document #:
IPC-J-STD-001
Revision
G
Product Type
Addendum
Released:  04/16/2018
Language
English
The IPC-J-STD-001GS space addendum supplements or replaces specifically identified requirements of IPC J-STD-001G for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications.

IPC-6012 - Revision D - Addendum - Automotive

Automotive Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
D
Product Type
Addendum
Released:  04/01/2016
Language
English
This Addendum, when required by procurement documentation/drawings, supplements or replaces specifically identified requirements of IPC-6012D, Revision D, for rigid printed boards that must survive the vibration and thermal cycling environments of electronic interconnects within the automotive industry.

IPC-J-STD-001 and IPC-A-610 - Revision G - Addendum - Automotive

Automotive Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610G Acceptability of Electronic Assemblies

Document #:
IPC-J-STD-001 and IPC-A-610
Revision
G
Product Type
Addendum
Released:  03/18/2020
Language
English
The IPC J-STD-001GA/IPC-A-610GA automotive addendum to J-STD-001G and IPC-A-610G provides criteria to ensure the reliability of mission-critical soldered automotive electrical and electronic assemblies in the field under harsh environments and considers the conditions of automated high-volume production. The IPC J-STD-001GA/IPC-A-610GA addendum is not a standalone document. The addendum requires...

IPC-6012 - Revision D - Addendum - Space and Military

Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
D
Product Type
Addendum
Released:  09/22/2015
Language
English
This Addendum supplements or replaces specifically identified requirements of IPC-6012D, Revision D, for rigid printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics

IPC-6018 - Revision C - Addendum - Space and Military

Space and Military Avionics Applications Addendum to IPC-6018C Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

Document #:
IPC-6018
Revision
C
Product Type
Addendum
Released:  08/09/2016
Language
English
This Addendum supplements or replaces specifically identified requirements of IPC-6018C, for high frequency (microwave) printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics.
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IPC-J-STD-001 - Revision H - Addendum - Space and Military

Ergänzung Elektronik-Hardware für Raumfahrt- und Militäranwendungen zu IPC J-STD-001H Anforderungen an gelötete elektrische und elektronische Baugruppen

Document #:
IPC-J-STD-001
Revision
H
Product Type
Addendum
Released:  06/22/2022
Language
German
Current Revision
Die Richtlinie IPC J-STD-001HS-DE Ergänzung für Raumfahrt-Anwendungen ergänzt oder ersetzt spezifisch identifizierte Anforderungen von IPC J-STD-001H-DE für gelötete elektrische und elektronische Baugruppen, die Schwingungen und die Umgebungsbedingungen thermischer Zyklen von Raumfahrt und militärischen Anwendungen überstehen müssen.
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IPC-J-STD-001 Revision H - Addendum - Space and Military

はんだ付される電気および電子組立品に関する要求事項：宇宙・軍事用途向け追加規格

Document #:
IPC-J-STD-001
Revision
H
Product Type
Addendum
Released:  10/28/2022
Language
Japanese
Current Revision
IPC-J-STD-001HS 宇宙用追加規格は、宇宙・軍事用途において振動や熱サイクル環境に耐え、動作することが求められる電気・電子組立品に関し、J-STD-001Hの特定要求事項を補完する、もしくは置き換えるものである。
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IPC-J-STD-001 and IPC-A-610 - Revision H - Addendum - Automotive

J-STD-001H（电气与电子组件的焊接要求）与IPC-A-610H（电子组件的可接受性）的汽车补充标准

Document #:
IPC-J-STD-001 and IPC-A-610
Revision
H
Product Type
Addendum
Released:  03/06/2023
Language
Chinese
Current Revision
IPC J-STD-001HA/IPC-A-610HA是J-STD-001H和IPC-A-610H的汽车补充标准。它提供了标准，以确保在恶劣环境下现场焊接的汽车电气和电子组件的可靠性，并考虑了自动化大批量生产。 这份补充标准不能作为单独文件使用，它必须与 J-STD-001H and IPC-A-610H一起使用.
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IPC-J-STD-001 and IPC-A-610 - Revision H - Addendum - Automotive

IPC J-STD-001H はんだ付される電気および電子組立品、およびIPC-A-610H 電子組立品の許容基準：車載用途向け追加規格

Document #:
IPC-J-STD-001 and IPC-A-610
Revision
H
Product Type
Addendum
Released:  06/22/2022
Language
Japanese
Current Revision
IPC J-STD-001HA/IPC-A-610HAは、J-STD-001HおよびIPC-A-610Hの車載用途向け追加規格である。本書は、自動化された大量生産ラインという条件を考慮しながら、過酷な環境下にある車載用電気・電子部品がはんだ付された組立品について、その信頼性を保証するための基準を提供するものである。 IPC J-STD-001HA/IPC-A-610HA(すなわち追加規格)は独立した文書として使用するのではなく、J-STD-001HおよびIPC-A-610Hと併用する必要がある
IPC-J-STD-001HS French Cover Image

IPC-J-STD-001 - Revision H - Addendum - Space and Military

Addendum pour les produits électroniques des applications spatiales et militaires à la norme J-STD-001H, Exigences des Assemblages Électriques et Électroniques Brasés

Document #:
IPC-J-STD-001
Revision
H
Product Type
Addendum
Released:  07/26/2022
Language
French
Current Revision
Le présent Addendum IPC-J-STD-001HS relatif aux applications spatiales et militaires présente des exigences qui complètent ou remplacent des exigences spécifiques de la norme J-STD-001H, pour les assemblages électriques et électroniques brasés qui doivent résister aux vibrations et aux importantes variations thermiques subies dans des applications spatiales et militaires.
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IPC-J-STD-001 and IPC-A-610 - Revision H - Addendum - Automotive

Automotive-Ergänzung zu IPC J-STD-001H-DE Anforderungen an gelötete elektrische und elektronische Baugruppen und IPC-A-610H-DE, Abnahmekriterien für elektronische Baugruppen

Document #:
IPC-J-STD-001 and IPC-A-610
Revision
H
Product Type
Addendum
Released:  08/24/2023
Language
German
Current Revision
001H-DE und IPC-A-610H-DE enthält Kriterien zur Sicherstellung der Zuverlässigkeit gelöteter elektrischer und elektronischer Automotive-Baugruppen im Feld unter rauen Umgebungsbedingungen und berücksichtigt die Bedingungen einer automatisierten Großserienproduktion. Die Ergänzung IPC J-STD-001HA-DE/IPC-A-610HA-DE ist kein eigenständiges Dokument. Diese Ergänzung fordert, dass sie in Verbindung mit...
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IPC-6012 - Revision E - Addendum - Automotive

リジッドプリント板の認定および性能仕様車載用途向け追加規格

Document #:
IPC-6012
Revision
E
Product Type
Addendum
Released:  06/14/2022
Language
Japanese
Current Revision
購入仕様書/図面でIPC-6012EA追加規格の適用を要求される場合、本追加規格は、振動および熱サイクル環境に耐えることが求められるリジッドプリント板に対し、IPC-6012E-リビジョンEに記載する具体的な特定要件を補完する、もしくは置き換えるものである。今回の本文書の改訂では、次の要求事項への更新が行われた：ランド浮き、パターン形状精度、絶縁体除去(例：ウィッキング)、ソルダマスク厚さ、清浄度、適合性と信頼性試験。
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Coming Soon

IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)

IPC-2294: Design Standard for Printed Electronics on Rigid Substrates

IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards

J-STD-609C: Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-8401: Guidelines for In-Mold Electronics

IPC-HERMES-9852 Version 1.6: The Global Standard for Machine-to-Machine Communication in SMT Assembly