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IPC-J-STD-001 and IPC-A-610 - Revision H - Addendum - Automotive

Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610H Acceptability of Electronic Assemblies

Document #:
IPC-J-STD-001 and IPC-A-610
Revision
H
Product Type
Addendum
Released:  03/08/2022
Language
English
Current Revision
IPC J-STD-001HA/IPC-A-610HA is the automotive addendum to J-STD-001H and IPC-A-610H. It provides criteria to ensure the reliability of soldered automotive electrical and electronic assemblies in the field under harsh environments and considers automated high-volume production. IPC J-STD-001HA/IPC-A-610HA addendum is not a standalone document, and it must be used in conjunction with J-STD-001H and...
IPC-A-610HC Cover Image

IPC-A-610 - Revision H - Addendum - Telecom

Telecom Addendum to IPC-A-610 Revision H Acceptability of Electronic Assemblies

Document #:
IPC-A-610
Revision
H
Product Type
Addendum
Released:  04/27/2023
Language
English
Current Revision
The IPC-A-610HC Telecom Addendum to IPC-A-610H Acceptability of Electronic Assemblies provides specific requirements for telecommunications products when it is specifically required by procurement documentation. Information in this document either supplements or replaces specifically identified requirements of IPC-A-610 Revision H by providing additional requirements to ensure that electrical and...
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IPC-J-STD-001 - Revision H - Addendum - Space and Military

Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies

Document #:
IPC-J-STD-001
Revision
H
Product Type
Addendum
Released:  05/13/2021
Language
English
Current Revision
IPC J-STD-001HS space and military addendum, supplements or replaces specifically identified requirements of IPC J-STD-001H requirements for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications.
IPC-A-620E Space Cover Image

IPC/WHMA-A-620 - Revision E - Addendum - Space and Military

Space and Military Applications Electronic Hardware Addendum to IPC/WHMA-A-620

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Addendum
Released:  11/28/2023
Language
English
Current Revision
IPC/WHMA-A-620E-S space addendum provides additional requirements to IPC/WHMA-A-620E standard to ensure the reliability of cable and wire harness assemblies that must survive the vibration and thermal excursions encountered getting to and operating in the military and space environments. IPC/WHMA-A-620E-S cannot be used as a standalone document. It must be used with the base standard IPC/WHMA-A...

IPC-T-50 - Revision M - Standard Only

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Document #:
IPC-T-50
Revision
M
Product Type
Standard Only
Released:  05/26/2015
Language
English
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision M contains over 220 new or revised terms, including new terminology for conformal coatings, potting and encapsulation processes, stencil design, statistical process control, and flexible printed board...
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IPC-A-610 - Revision G - Addendum - Rail Transit

Rail Transit Addendum to IPC-A-610G Acceptability of Electronic Assemblies

Document #:
IPC-A-610
Revision
G
Product Type
Addendum
Released:  05/31/2022
Language
English
Current Revision
IPC-A-610G-R rail transit addendum provides additional requirements to IPC-A-610G base standard, specifying a standardized set of acceptance criteria unique to electronic assemblies used in the rigorous micro-environment under high mechanical and environmental stresses associated with high railway equipment, to ensure industry-specific high reliability and environmental adaptability of electronic...

IPC-T-50 - Revision K - Standard Only

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Document #:
IPC-T-50
Revision
K
Product Type
Standard Only
Released:  07/17/2013
Language
English
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision K contains more than 220 new or revised terms, including new terminology for thermal properties, etchback, assembly processing, hole drilling, and microvia technology. Also includes commonly used industry...
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IPC-J-STD-001 - Revision J - Redline Standard

Requirements for Soldered Electrical and Electronic Assemblies - Redline

Document #:
IPC-J-STD-001
Revision
J
Product Type
Redline Standard
Released:  04/11/2024
Language
English
Current Revision
The IPC J-STD-001H to IPC J-STD-001J Redline Comparison Document is a redline document showing the changes from J-STd-001H to J-STD-001J. The IPC J-STD-001H to IPC J-STD-001J Redline Comparison Document is only available in digital format and provides a side-by-side comparison of the two documents.

IPC-A-610 - Revision H - Standard Only

Acceptability of Electronic Assemblies

Document #:
IPC-A-610
Revision
H
Product Type
Standard Only
Released:  10/07/2020
Language
English
IPC-A-610H is the most widely used electronics assembly acceptance standard in the electronics industry. IPC-A-610H standard includes a general update to the document, introduces several new surface mount component types and removes target conditions. Participants from 29 countries provided their input and expertise to bring this document to the electronics industry. This is a must-have for...

IPC-J-STD-001 - Revision H - Standard Only

Requirements for Soldered Electrical and Electronic Assemblies

Document #:
IPC-J-STD-001
Revision
H
Product Type
Standard Only
Released:  10/07/2020
Language
English
IPC-J-STD-001H is recognized globally for its criteria on soldering processes and materials. Updated with participants from 27 countries providing input and expertise, the IPC-J-STD-001H standard brings the latest criteria to the industry including guidance on the use of x-ray to inspect through-hole solder conditions that are not visible by any other means. IPC-J-STD-001H is a must-have for those...
IPC-A-610J - Cover Image

IPC-A-610 - Revision J - Redline Standard

Acceptability for Electronic Assemblies

Document #:
IPC-A-610
Revision
J
Product Type
Redline Standard
Released:  04/11/2024
Language
English
Current Revision
IPC-A-610H to IPC-A-610J redline document shows the changes from IPC-A-610H to IPC-A-610J in a side-by-side comparison of the two documents. The IPC-A-610J redline is only available in electronic format, it is not available in hardcopy. As a comparison document it does not replace the standard.
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IPC/WHMA-A-620 - Revision C - Addendum - Rail Transit

Rail Transit Addendum to IPC/WHMA-A-620C

Document #:
IPC/WHMA-A-620
Revision
C
Product Type
Addendum
Released:  05/31/2022
Language
English
Current Revision
IPC/WHMA-A-620C-R rail transit addendum provides additional requirements to IPC/WHMA-A-620C standard, describing materials, methods, tests, and acceptance criteria for producing crimped, mechanically secured, and soldered interconnections. It also provides the related assembly activities associated with cable and harness assemblies in rail transit industry, to ensure the high reliability and...
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IPC-A-610 - Revision H - Redline Standard

Acceptability of Electronic Assemblies - Redline

Document #:
IPC-A-610
Revision
H
Product Type
Redline Standard
Released:  10/07/2020
Language
English
Current Revision
IPC-A-610H Redline document shows the changes from IPC-A-610G to IPC-A-610H in a side-by-side comparison of the two documents. The IPC-A-610H redline is only available in electronic format, it is not available in hardcopy
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IPC-J-STD-001 - Revision H - Redline Standard

Requirements for Soldered Electrical and Electronic Assemblies - Redline

Document #:
IPC-J-STD-001
Revision
H
Product Type
Redline Standard
Released:  10/07/2020
Language
English
Current Revision
IPC-J-STD-001H redline shows the changes from J-STD-001G to J-STD-001H in a side-by-side comparison of the documents. The IPC-J-STD-001H redline is only available in electronic format, hardcopy is not available. NOTE: J-STD-001G Am 1 is not included in this redline.
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IPC-T-50 - Revision J - Standard Only

SUPERSEDED BY T-50K

Document #:
IPC-T-50
Revision
J
Product Type
Standard Only
Released:  10/18/2011
Language
English
This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers. Revision J contains nearly 400 new or revised terms, including new terminology for chip scale and area array packaging, cable and wire harness technology, assembly processing, moisture sensitive components, and...
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IPC-2591 - Version 1.7 - Standard Only

Connected Factory Exchange (CFX)

Document #:
IPC-2591
Revision
1.7
Product Type
Standard Only
Released:  08/24/2023
Language
English
Current Revision
This standard establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. This standard applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semiautomated and manual, and is applicable to related mechanical assembly and...
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IPC/WHMA-A-620 - Revision E - Redline Standard

Requirements and Acceptance for Cable and Wire Harness Assemblies

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Redline Standard
Released:  03/06/2023
Language
English
Current Revision
IPC/WHMA-A-620E-RL is a redline document showing the difference from IPC/WHMA-A-620D to IPC/WHMA-A-620E. IPC/WHMA-A-620E-RL provides a side-by-side comparison of the two documents and includes the figures and tables. The document shows deleted/changed text in the IPC/WHMA-A-620D pages and new/revised text in the IPC/WHMA-A-620E pages. Due to the complexity of this document, it is only available in...
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IPC/WHMA-A-620 - Standard Only

IPC/WHMA-A-620 Test Data Tables

Document #:
IPC/WHMA-A-620
Revision
Original Version
Product Type
Standard Only
Released:  01/01/2012
Language
English
Current Revision
These tables are from IPC/WHMA-A-620 Revision B Chapter 19 Testing. They are provided in an electronic format that permits users to edit the tables to add user-specific criteria. These files are authorized for copying/reproduction.

IPC-7527 - Standard Only

Requirements for Solder Paste Printing

Document #:
IPC-7527
Revision
Original Version
Product Type
Standard Only
Released:  05/17/2012
Language
English
Current Revision
This standard is a collection of visual quality acceptability criteria for solder paste printing. It provides a standardized language for solder paste characterization. It provides users with common descriptions and potential causes for solder paste deposits. The standard provides valuable insights to the solder paste printing operations which can be used in troubleshooting of the printing process...
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IPC-SMEMA 7 - Standard Only

SMEMA7 - Fluid Dispensing Terms and Definitions

Document #:
IPC-SMEMA 7
Revision
Original Version
Product Type
Standard Only
Released:  02/12/2007
Language
English
Current Revision
This document is intended to clarify terms used in the area of fluid dispensing. As is often the case, different terms are used by different manufacturers to convey a similar meaning. Common interchangeable terms are shown in parenthesis and the reader should not infer one term is preferred over the other.
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IPC-2501 - Standard Only

Definition for Web-Based Exchange of XML Data

Document #:
IPC-2501
Revision
Original Version
Product Type
Standard Only
Released:  07/01/2003
Language
English
Current Revision
IPC-2501 establishes the governing semantics and an XML based syntax for shop floor communication between electronic assembly equipment and associated software applications. This standard outlines the communication architecture and supporting XML messages. The standard also describes a messaging interface that is based upon an architecture whereby a single logical middleware server (the Message...
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IPC/EIA-J-STD-028 - Standard Only

Performance Standard for Construction of Flip Chip and Chip Scale Bumps

Document #:
IPC/EIA-J-STD-028
Revision
Original Version
Product Type
Standard Only
Released:  08/01/1999
Language
English
Current Revision
This standard establishes construction detail requirements for bumps and other terminal structures used for Flip Chip Scale carriers. The specific standards for different terminations are appropriately matched to a particular interconnection process and include such diverse terminations as solder bumps, columns, non-melting stand-offs and conductive polymer deposits. The document articulates a set...
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IPC-9703 - Standard Only

IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

Document #:
IPC/JEDEC-9703
Revision
Original Version
Product Type
Standard Only
Released:  03/18/2009
Language
English
Current Revision
Establishes mechanical drop and shock and test guidelines for assessing solder joint reliability of printed board assemblies from system to component level. This document addresses methods to define mechanical shock use-conditions, methods to define system level, system printed board level and component test board level testing that correlate to such use conditions and guidance on the use of...
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JEDEC/IPC-JP002 - Standard Only

JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

Document #:
JEDEC/IPC-JP002
Revision
Original Version
Product Type
Standard Only
Released:  03/01/2006
Language
English
Current Revision
This document will provide insight into the theory behind tin whisker formation as it is known today and, based on this knowledge, potential mitigation practices that may delay the onset of, or prevent tin whisker formation. The potential effectiveness of various mitigation practices will also be briefly discussed. References behind each of the theories and mitigation practices are provided. It...
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Coming Soon

IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)

IPC-2294: Design Standard for Printed Electronics on Rigid Substrates

IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards

J-STD-609C: Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-8401: Guidelines for In-Mold Electronics

IPC-HERMES-9852 Version 1.6: The Global Standard for Machine-to-Machine Communication in SMT Assembly