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IPC-7091A Cover Image

IPC-7091 - Revision A - Standard Only

Design and Assembly Process Implementation of 3D Components

Document #:
IPC-7091
Revision
A
Product Type
Standard Only
Released:  01/13/2023
Language
English
Current Revision
This document describes the design and assembly challenges and ways to address those challenges for implementing 3D component technology. Recognizing the effects of combining multiple uncased semiconductor die elements in a single-package format can impact individual component characteristics and can dictate suitable assembly methodology. The information contained in this standard focuses on...

IPC-4553 - Revision A - Standard Only

Specification for Immersion Silver Plating for Printed Boards

Document #:
IPC-4553
Revision
A
Product Type
Standard Only
Released:  06/16/2009
Language
English
Current Revision
This specification sets requirements based on performance criteria for the use of Immersion Silver (IAg) as a surface finish for printed circuit boards. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) companies and original equipment manufacturers (OEM). IAg is a thin immersion deposit over copper. It is a multifunctional surface...
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IPC-QL-653 - Revision A - Standard Only

Certification of Facilities that Inspect/Test Printed Boards, Components & Materials

Document #:
IPC-QL-653
Revision
A
Product Type
Standard Only
Released:  11/01/1997
Language
English
Current Revision
This specification establishes the certification requirements for facilities that inspect/test printed boards, components and materials. This specification is intended to provide a minimum standardized basis for evaluating or auditing a technically oriented inspection/testing facility. Revised November 1997. 15 pages.
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IPC-1730 - Revision A - Standard Only

Laminator Qualification Profile

Document #:
IPC-1730
Revision
A
Product Type
Standard Only
Released:  06/30/2000
Language
English
Current Revision
IPC-1730A is a tool used to categorize a laminate manufacturer's capabilities, which furnishes customer access to detailed information. Used for single or multiple sites or locations, IPC-1730A simplifies auditing processes and reduces the frequency of audits, decreasing paperwork and improving efficiency. The program includes a description, approval and certification profile and a quality profile...

IPC-7094 - Revision A - Standard Only

Design and Assembly Process Implementation for Flip Chip and Die-Size Components

Document #:
IPC-7094
Revision
A
Product Type
Standard Only
Released:  02/14/2018
Language
English
Current Revision
IPC-7094A describes the design and assembly challenges for implementing flip chip technology in a direct chip attach (DCA) assembly. The effect of bare-die or die-size components in a flip chip format has an impact on component characteristics and dictates the appropriate assembly methodology. The IPC-7094A standard focuses on design, assembly methodology, critical inspection, repair and...

IPC-9201 - Revision A - Standard Only

Surface Insulation Resistance Handbook

Document #:
IPC-9201
Revision
A
Product Type
Standard Only
Released:  09/19/2007
Language
English
Current Revision
Surface Insulation Resistance (SIR) testing is a tool used not only for characterization testing of production processes such as solder masks, soldering flux, and conformal coatings, but also for examining the electrochemical reactions at each stage of the electronic assembly production process. This handbook covers the terminology, theories, test procedures and test vehicles of SIR testing...
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IPC/JEDEC-J-STD-609 - Revision B - Standard Only

Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes

Document #:
IPC/JEDEC-J-STD-609
Revision
B
Product Type
Standard Only
Released:  11/01/2016
Language
English
Current Revision
This standard provides a marking and labeling system that aids in assembly, rework, repair and recycling and provides for the identification of: those assemblies that are assembled with lead-containing or lead-free solder; components that have lead-containing or lead-free second level interconnect terminal finishes and materials; the maximum component temperature not to be exceeded during assembly...

IPC-4411 - Revision A - Standard Only

Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

Document #:
IPC-4411
Revision
A
Product Type
Standard Only
Released:  11/01/2003
Language
English
Current Revision
Covers the nomenclature, definitions and requirements for reinforcement made from nonwoven para-aramid fibers. Para-aramid reinforcement is primarily used in PCBs for HDI and high speed/high frequency applications. IPC-4411A also includes specification sheets, which can be used when selecting and purchasing nonwoven para-aramid reinforcement. Includes the incorporation of 14 new nonwoven para...
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IPC-PE-740 - Revision A - Standard Only

Troubleshooting for Printed Board Manufacture and Assembly

Document #:
IPC-PE-740
Revision
A
Product Type
Standard Only
Released:  12/01/1997
Language
English
Current Revision
This is the document all process engineers must have! Useful for day-to-day problem solving, it contains case histories of problems and corrective action in the design, manufacture, assembly and testing of printed wiring products. Each section has been updated to reflect today's manufacturing challenges. Sections address documentation, phototooling, raw materials, mechanical operations, hole...
IPC-6012E-AM1 Cover Image

IPC-6012 - Revision E - Amendment 1

Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
E
Product Type
Amendment
Released:  04/20/2022
Language
English
Current Revision
IPC-6012E-AM1 is an Amendent to the IPC-6012E that clarifes the distinction between receding and dewetting solder in reflowed SPb or HASL coatings. The Amendment also provides amended criteria for minimum external conductor thickness of the finished printed board and new acceptance criteria for the minimum thickness of internal plated layers

IPC-6012 - Revision E - Addendum - Space and Military

Space and Military Avionics Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
E
Product Type
Addendum
Released:  04/24/2020
Language
English
Current Revision
The IPC-6012ES space addendum provides exceptions to Class 3 requirements of the IPC-6012E for use in space and military avionics product. Exceptions include changes to acceptance criteria and/or sample size and test frequency for production lot acceptance testing. The IPC-6012ES covers requirements for rigid printed boards to survive vibration, extreme thermal cycling and ground testing...
IPC-6012EA Cover Image

IPC-6012 - Revision E - Addendum - Automotive

Automotive Applications Addendum to IPC-6012E Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
E
Product Type
Addendum
Released:  11/30/2021
Language
English
Current Revision
The IPC-6012EA Addendum, when required by procurement documentation/drawings, supplements or replaces specifically identified requirements of IPC-6012 revision E, for rigid printed boards that must survive the vibration and thermal cycling environments of electronic interconnects within the automotive industry. The addendum includes updated requirements for lifted lands, pattern feature accuracy...
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IPC-6012 - Revision F - Addendum - Space and Military

Space and Military Avionics Applications Addendum to IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
F
Product Type
Addendum
Released:  02/23/2024
Language
English
Current Revision
The IPC-6012FS space addendum provides exceptions to IPC Performance Class 3 requirements of the IPC-6012F for use in space and military avionics product. Exceptions include changes to acceptance criteria and/or sample size and test frequency for production lot acceptance testing. The IPC-6012FS covers requirements for rigid printed boards to survive vibration, extreme thermal cycling and ground...

IPC-6012 - Revision E - Addendum - Medical

Medical Applications Addendum to IPC-6012E Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
E
Product Type
Addendum
Released:  09/10/2020
Language
English
Current Revision
The IPC-6012EM Addendum, when required by procurement documentation/drawings, supplements or replaces specifically identified requirements of IPC-6012E, for rigid printed boards that must meet requirements to high reliability medical device applications. IPC-6012EM is the only global industry-consensus standard for Medical Applications to Qualification and Performance Specifications for Rigid...
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IPC-6013 - Revision E - Addendum - Medical

Medical Applications Addendum to IPC-6013E Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

Document #:
IPC-6013
Revision
E
Product Type
Addendum
Released:  04/12/2022
Language
English
Current Revision
The IPC-6013EM Addendum, when required by procurement documentation/drawings, supplements or replaces specifically identified requirements of IPC-6013E, for flexible/rigid-flexible printed boards that must meet requirements to high reliability medical device applications. IPC-6013EM is the only global industry-consensus standard addendum for Medical Applications to Qualification and Performance...

IPC-T-50 - Revision M - Standard Only

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Document #:
IPC-T-50
Revision
M
Product Type
Standard Only
Released:  05/26/2015
Language
English
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision M contains over 220 new or revised terms, including new terminology for conformal coatings, potting and encapsulation processes, stencil design, statistical process control, and flexible printed board...

IPC-T-50 - Revision K - Standard Only

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Document #:
IPC-T-50
Revision
K
Product Type
Standard Only
Released:  07/17/2013
Language
English
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision K contains more than 220 new or revised terms, including new terminology for thermal properties, etchback, assembly processing, hole drilling, and microvia technology. Also includes commonly used industry...
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IPC-T-50 - Revision J - Standard Only

SUPERSEDED BY T-50K

Document #:
IPC-T-50
Revision
J
Product Type
Standard Only
Released:  10/18/2011
Language
English
This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers. Revision J contains nearly 400 new or revised terms, including new terminology for chip scale and area array packaging, cable and wire harness technology, assembly processing, moisture sensitive components, and...
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IPC-4555 - Standard Only

Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards

Document #:
IPC-4555
Revision
Original Version
Product Type
Standard Only
Released:  05/31/2022
Language
English
Current Revision
The IPC-4555 standard covers the requirements and testing for organic solderability preservatives (OSP) processes for printed boards to be used primarily for electrical and electronic circuits. Details for lead free soldering are covered in IPC-4555

IPC-1602 - Standard Only

Standard for Printed Board Handling and Storage

Document #:
IPC-1602
Revision
Original Version
Product Type
Standard Only
Released:  04/07/2020
Language
English
Current Revision
The IPC-1602 standard provides requirements intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging materials types and methods, production environment, handling and transport of product, and establishing baking profiles for moisture removal. IPC-1602 is now providing requirements that can be called...

IPC-SM-840 - Revision E - Standard Only

Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials

Document #:
IPC-SM-840
Revision
E
Product Type
Standard Only
Released:  12/22/2010
Language
English
Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system. IPC-SM-840 provides two classes of requirements, T and H, to reflect functional performance requirements and testing severity based on industry/end use requirements. Coverage is given to adhesion, material qualification...
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IPC-OI-645 - Standard Only

Standard for Visual Optical Inspection Aids

Document #:
IPC-OI-645
Revision
Original Version
Product Type
Standard Only
Released:  10/01/1993
Language
English
Current Revision
Establishes requirements, definitions and certification provisions for optical inspection aids. Defines inspection grades to be used as accept/reject criteria for optical inspection aids. 40 pages. Released October 1993.
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Coming Soon

IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)

IPC-2294: Design Standard for Printed Electronics on Rigid Substrates

IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards

J-STD-609C: Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-8401: Guidelines for In-Mold Electronics

IPC-HERMES-9852 Version 1.6: The Global Standard for Machine-to-Machine Communication in SMT Assembly