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Document #:

IPC-4821

Revision

Original Version

Product Type

Standard Only

Released: 05/01/2006

Language

English

This document describes materials that can be used for the fabrication of embedded passive capacitor devices within the finished printed circuit board substrate. For this document, embedded passive devices and the phrase embedded passives are considered to be equivalent. It provides information on general designations and associated characteristics of embedded passive device (EPD) capacitor...

Document #:

IPC-4556

Revision

Original Version

Product Type

Standard Only

Released: 02/05/2013

Language

English

This specification sets the requirements for the use of electroless nickel/electroless palladium/immersion gold (ENEPIG) as a surface finish for printed boards. It establishes requirements for ENEPIG deposit thicknesses for applications including soldering, wire bonding and as a contact finish. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing...

Document #:

IPC-4554

Revision

Original Version

Product Type

Standard with amendment(s)

Released: 08/10/2012

Language

English

IPC-4554, Specification for Immersion Tin Plating for Printed Circuit Boards, is included in the IPC-455X series of specifications that set the requirements for printed board surface finishes that are alternates to non-coplanar finishes, most often referred to as tin-lead HASL finish. This specification is a full-color document that is intended for use by the supplier or printed board fabricator...

Document #:

IPC-7092

Revision

Original Version

Product Type

Standard Only

Released: 02/18/2015

Language

English

This document describes the design and assembly challenges for implementing passive and active components, in either formed or placed methodology, into a printed board. It provides useful and practical information to decision makers of formed or placed, passive or active components and helps establish inspection techniques, testing processes, and reliability validations. Users will also learn...

Document #:

IPC-7091

Revision

Original Version

Product Type

Standard Only

Released: 09/25/2017

Language

English

The IPC-7091 intends to provide useful and practical information to those who are designing, developing or using 3D-packaged semiconductor components or those who are considering 3D package implementation. The 3D semiconductor package may include multiple die elements—some homogeneous and some heterogeneous. The package may also include several discrete passive SMT devices, some of which are...

Document #:

IPC-4552

Revision

Original Version

Product Type

Standard with amendment(s)

Released: 06/26/2013

Language

English

In answer to numerous industry requests for guidance on electroless nickel/immersion gold (ENIG), IPC-4552 was developed. Containing full color photographs, this specification sets the requirements for the use of ENIG as a surface finish for printed boards. It includes requirements for ENIG deposit thicknesses based on performance criteria. It is an invaluable resource for use by suppliers, board...

Document #:

IPC-7526

Revision

Original Version

Product Type

Standard Only

Released: 02/13/2007

Language

English

Cleaning of stencils and misprinted PCBs has taken an increasingly important role in surface mount technology. Fine and ultra-fine pitch lands, together with other advanced packages, place new demands on stencil cleaning. Paste volume is a critical issue for fine, ultra-fine, chip-scale, BGA and flip-chip components. Insufficient solder due to clogging of stencil apertures is a primary cause of...

Document #:

IPC-2231

Revision

Original Version

Product Type

Standard Only

Released: 05/14/2019

Language

English

The IPC-2231 standard provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability, Environment, Reuse) process for layout of printed board assemblies that utilize surface mount and through hole devices.

Document #:

IPC-9121

Revision

Original Version

Product Type

Standard Only

Released: 02/01/2016

Language

English

This handbook is an essential resource for anyone involved in manufacturing or purchasing PCBs. Hundreds of real-world, full-color photos spotlight more than 650 PCB process defects, with causes and corrective actions for each. IPC-9121 supersedes the PCB sections of IPC-PE-740A. Released March 2016

Document #:

IPC-J-STD-013

Revision

Original Version

Product Type

Standard Only

Released: 07/01/1996

Language

English

This document establishes the requirements and interactions necessary for printed board assembly processes for interconnecting high performance/high pin count IC packages. Includes information on design principles, material selection, board fabrication, assembly technology, testing strategy and reliability expectations based on end-use environments. Developed by IPC, EIA, MCNC and Sematech. 96...

Document #:

IPC-7094

Revision

Original Version

Product Type

Standard Only

Released: 03/18/2009

Language

English

Implementing flip chip technology in a direct chip attach (DCA) assembly presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7094 delivers useful and practical information to anyone who is currently using or contemplating developing products that employ the very complex and high density methods needed for the flip chip technology. The concepts have become...

Document #:

IPC-7093

Revision

Original Version

Product Type

Standard Only

Released: 03/28/2011

Language

English

This standard describes the design and assembly challenges for implementing Bottom Termination surface mount Components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body. The BTCs in this document include all types and forms of bottom-only termination components intended for surface mounting. This includes such industry descriptive...

Document #:

IPC-7711/21

Revision

Product Type

Redline Standard

Released: 05/30/2017

Language

English

This is a redline document showing the changes from IPC-7711/21B to IPC-7711/21C. This 790+ page document provides a side-by-side comparison of the two documents and includes the figures. The document shows the deleted/changed text in the IPC-7711/21B pages and the new/revised text in purple highlights in the IPC-7711/21C pages. Yellow pop-up boxes are also present in the IPC-7711/21C pages to...

Document #:

IPC-T-50

Revision

Product Type

Standard Only

Released: 09/19/2016

Language

Chinese

本文件是电子互连行业不可或缺的术语标准。该文件图文并茂，可帮助用户及其客户克服语言上的沟通障碍。M版本包含超过220多条新术语或修订术语，包括敷形涂覆、灌封和封装工艺、模板设计、统计工艺控制和挠性印制板技术。也包括通用行业缩写词。

Document #:

IPC-4552

Revision

Original Version

Product Type

Amendment

Released: 06/12/2012

Language

English

Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards Amendment 1 to IPC-4552 replaces the Table 3-1 Requirements of Electroless Nickel Immersion Gold Plating plus also replaces all of sections 3.2.1 Immersion Nickel Thickness and 3.2.2 Immersion Gold Thickness in the original release of the IPC-4552. The Amendment 1 permits the use of thinner gold (≥4 µm...

Document #:

IPC-4552

Revision

Original Version

Product Type

Amendment

Released: 09/01/2012

Language

English

Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards Amendment 2 to IPC-4552 is a new section in the original release of the IPC-4552. The Amendment 2 provides the “rules” by which any rework and/or repair of a printed board's ENIG surface finish is allowed. Effective September 2012.

Document #:

IPC-9121

Revision

Original Version

Product Type

Amendment

Released: 09/01/2019

Language

English

The amendment 2 to IPC-9121 provides new troubleshooting topics on hole quality, laser drilling, microvias, drill smear, electroless nickel, organic solderability preservative (OSP) and rigid-flex boards.

Document #:

IPC-9121

Revision

Original Version

Product Type

Amendment

Released: 04/02/2018

Language

English

IPC-9121 AM1 is an amendment to IPC-9121 which provides updates to the Hole Preparation/Protection and Interconnect Formation sections, covering troubleshooting topics and guidance on nonconductive plugging paste, microvias and pattern plating rim voids. IPC-9121 AM1 also includes a new section on Flexible Circuits.

Document #:

IPC-T-50

Revision

Product Type

Standard Only

Released: 09/17/2009

Language

Chinese

Description in English 本文件是电子互连行业不可或缺的一份术语标准。该文件图文并茂，可帮助用户及其客户克服语言上的沟通障碍。H版本包含200多条新术语或修订术语，新术语涉及球栅阵列和芯片尺寸封装、导通孔保护、导体图形、组装工艺、基材和选择性电镀工艺等。还包括通用工业缩写词和根据技术分类排序的术语索引，以便于查找。全文276页，于 2008年7月公布。

Document #:

IPC-4103

Revision

Original Version

Product Type

Amendment

Released: 11/01/2015

Language

English

The Amendment 2 to IPC-4103A-WAM1 made four fundamental changes to the base standard: All references to the epoxy curative of DICY (dicyandiamide) were removed; Opaque foreign inclusions were more specifically defined and limited; The optional properties of thermal conductivity for both laminates and bonding layers were added; and The dielectric constant (permittivity) ranges were specifically...

Document #:

IPC-TM-650

Revision

Original Version

Product Type

Development Packet

Released: 06/06/2012

Language

English

Current Revision

This document has been created to help define criteria that will yield better test methods for use by the electronics and related industries. Key objectives to validating a new test method procedure are covered, including the usage of objective evidence to verify that the elements defined within a method fulfill the intended use and that the method yields repeatable and reproducible results when...

Document #:

IPC-1601

Revision

Original Version

Product Type

Standard Only

Released: 08/30/2010

Language

German

Current Revision

BeschreibunginEnglisch Der einzige Industrie-Standard für das Handling, die Verpackung und Lagerung von Leiterplatten. Die Anwendung dieser Richtlinie soll Leiterplatten schützen vor Verunreinigung, mechanischer Beschädigung, Verschlechterung der Lötbarkeit und Feuchteaufnahme. Berücksichtigt werden Verpackungsmaterialien- und methoden, Produktionsumgebung, Handling und Transport der Produkte...

Document #:

IPC-2231

Revision

Original Version

Product Type

Standard Only

Released: 04/09/2020

Language

Chinese

Current Revision

本文件提供了制定最佳实践方法的指南，用于在开发正式DFX（面向可制造性、可制作性、可组装性、可测试性、成本、可靠性、环境、重用性设计）的过程中对采用表面贴装和通孔器件的印制板组件进行布局。

Document #:

IPC-7092

Revision

Original Version

Product Type

Standard Only

Released: 01/20/2020

Language

Chinese

Current Revision

本标准描述了在印制板中以成形或放置方式实现的有源和无源元器件在设计和组装方面的挑战。包括内部电子元器件的完整结构可用于表面贴装和／或通孔元器件连接。在组装过程中，多层结构变成准备为进一步加工的完整产品，它可由有机、无机（陶瓷）或两类兼有的材料制成。

Document #:

IPC-4556

Revision

Original Version

Product Type

Standard Only

Released: 11/26/2018

Language

Chinese

Current Revision

本规范规定了使用化学镍/钯/浸金（ENEPIG）作为印制板表面处理的要求。本规范规定了ENEPIG应用于焊接、金属线键合和接触面涂覆层的沉积厚度规格。本规范适用于化学药水供应商、印制板制造商、电子制造服务业（EMS）和原始设备制造商（OEM）。ENEPIG是沉积在以铜为基底金属上的一个三层的表面处理。它是一种多功能的表面处理，适用于焊接和金、铝和铜金属线键合。它也适合作为软薄膜和钢凸圆接触的配合表面。其它应用包括使用低插入力（LIF）和零插入力（ZIF）板边连接器和压入式应用。化学钯层形成的扩散阻挡层，阻碍镍扩散到金表面。浸金防止钯层在加工前与污染物反应，否则可能会影响连接制程，如金属线键合和焊接。全文共82页，2013年发布。2018年10月翻译。