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IPC/WHMA-A-620 - Revision B - Standard Only

módosításokat tartalmazó változat

Document #:
IPC/WHMA-A-620
Revision
B
Product Type
Standard Only
Released:  11/20/2013
Language
Hungarian
A kábel- és huzalköteg-szerelvények követelményeire és elfogadására továbbra is a IPC/WHMA–A–620B az egyetlen általánosan elfogadott szabvány. Az IPC és a Vezetékköteg Gyártók Egyesülete (WHMA) együttesen dolgozott azon, hogy ezen fontos új revízió létrejöhessen. ÚJ! Kibővített elfogadási kritériumokat tartalmaz a fröccsöntésre, kitöltésre, vezetékszigetelést rögzítő krimpelés nélküli krimpelt...
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IPC/WHMA-A-620 - Revision B - Amendment 1

Requirements and Acceptance for Cable and Wire Harness Assemblies

Document #:
IPC/WHMA-A-620
Revision
B
Product Type
Amendment
Released:  11/07/2014
Language
Hebrew
Amendment 1 to IPC/WHMA-A-620B This amendment provides resolution to some internal conflicts, aligns common criteria to other IPC standards, and corrects some editorial errors. This amendment is only to be used in conjunction with IPC/WHMA-A-620 Revision B, October 2012. Follow your company policy and procedures to make pen and ink changes or notations to the published IPC/WHMA-A-620 Revision B...
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IPC/WHMA-A-620 - Revision C - Addendum - Space and Military

航天应用电子部件补充标准

Document #:
IPC/WHMA-A-620
Revision
C
Product Type
Addendum
Released:  04/12/2019
Language
Chinese
IPC/WHMA-A-620C-S为IPC/WHMA-A-620C提供了额外的要求，以确保线缆和线束组件的可靠性。IPC/WHMA-A-620C- S航天补充标准不能作为独立文件使用，它必须与基本标准IPC/WHMA-A-620C一起使用。 2018年7月翻译。
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IPC-A-620 - Revision B - Addendum - Space and Military

航天应用电子部件补充标准

Document #:
IPC/WHMA-A-620
Revision
B
Product Type
Addendum
Released:  04/07/2017
Language
Chinese
本补充标准专用于补充或替代IPC/ WHMA-A-620B中的对应要求，以确保线缆及线束组件在进入太空和在太空中运行时的振动与热循环条件下的工作性能。

IPC-7530 - Standard Only

群焊工艺温度曲线指南（再流焊和波峰焊)

Document #:
IPC-7530
Revision
Original Version
Product Type
Standard Only
Released:  11/18/2016
Language
Chinese
在群焊过程中，所有焊点均达到最低焊接（再流焊）温度是重要的以确保焊料合金和被焊基底金属之间形成冶金结合而达到焊接。冶金结合要求被焊接的两表面以及焊料需达到最低焊接温度并且维持充足的时间，以使焊料表面润湿。本文件提供了适当的温度曲线测试工具与有关温度曲线的各种技术和方法指南。共18页， 于2001年5月发行。
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Coming Soon

IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)

IPC-2294: Design Standard for Printed Electronics on Rigid Substrates

IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards

J-STD-609C: Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-8401: Guidelines for In-Mold Electronics

IPC-HERMES-9852 Version 1.6: The Global Standard for Machine-to-Machine Communication in SMT Assembly