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IPC-T-50N Cover Image

IPC-T-50 - Revision N - Standard Only

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Document #:
IPC-T-50
Revision
N
Product Type
Standard Only
Released:  11/30/2021
Language
English
Current Revision
IPC-T-50N document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing English as a second language could understand the subtleties of the meaning. IPC-T-50N contains over 550 new or revised terms, including new terminology for via structures, surface mount device...

IPC-SM-840 - Revision E - Standard Only

Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials

Document #:
IPC-SM-840
Revision
E
Product Type
Standard Only
Released:  12/22/2010
Language
English
Current Revision
Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system. IPC-SM-840 provides two classes of requirements, T and H, to reflect functional performance requirements and testing severity based on industry/end use requirements. Coverage is given to adhesion, material qualification...

IPC-SM-817 - Revision A - Standard Only

General Requirements for Dielectric Surface Mount Adhesives

Document #:
IPC-SM-817
Revision
A
Product Type
Standard Only
Released:  12/23/2014
Language
English
Current Revision
Provides requirements for dielectric adhesives to hold components in place from the mounting to the soldering process and identifies test methods to ensure their long term properties. 9 pages. Released December 2014.

IPC-CC-830 - Revision C - Standard Only

Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

Document #:
IPC-CC-830
Revision
C
Product Type
Standard Only
Released:  01/15/2019
Language
English
Current Revision
The IPC-CC-830C standard establishes qualification and conformance requirements for electrical insulating compounds (conformal coatings). It has been designed and constructed with the intent of obtaining maximum confidence in the materials with minimum test redundancy. The IPC-CC-830C standard covers: • The qualification and qualification retention of the conformal coating material (Table 3-1...

IPC-CH-65 - Revision B - Standard Only

Guidelines for Cleaning of Printed Boards and Assemblies

Document #:
IPC-CH-65
Revision
B
Product Type
Standard Only
Released:  07/25/2011
Language
English
Current Revision
This document includes lead free, no-clean, and environmental friendly chemistries. This is a collection of information on electronic board and assembly cleaning in a single location. This major revision explains the relationship between materials, processes, and contaminants in fabrication and assembly operations. It also addresses cleanliness assessment and process control in relation to...

IPC-4591 - Revision A - Standard Only

Requirements for Printed Electronics Functional Conductive Materials

Document #:
IPC-4591
Revision
A
Product Type
Standard Only
Released:  01/01/2018
Language
English
Current Revision
The IPC-4591A standard establishes the classification system and the qualification and quality conformance requirements for functional conductive materials used in printed electronics applications. It provides companies that procure functional materials for printed electronics with the necessary technical structure to design and manufacture products meeting conformance to industry-determined...

IPC-T-50 - Revision M - Standard Only

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Document #:
IPC-T-50
Revision
M
Product Type
Standard Only
Released:  05/26/2015
Language
English
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision M contains over 220 new or revised terms, including new terminology for conformal coatings, potting and encapsulation processes, stencil design, statistical process control, and flexible printed board...

IPC-T-50 - Revision K - Standard Only

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Document #:
IPC-T-50
Revision
K
Product Type
Standard Only
Released:  07/17/2013
Language
English
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision K contains more than 220 new or revised terms, including new terminology for thermal properties, etchback, assembly processing, hole drilling, and microvia technology. Also includes commonly used industry...
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IPC-T-50 - Revision J - Standard Only

SUPERSEDED BY T-50K

Document #:
IPC-T-50
Revision
J
Product Type
Standard Only
Released:  10/18/2011
Language
English
This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers. Revision J contains nearly 400 new or revised terms, including new terminology for chip scale and area array packaging, cable and wire harness technology, assembly processing, moisture sensitive components, and...
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IPC-TM-650 - Standard Only

Test Methods Manual

Document #:
IPC-TM-650
Revision
Original Version
Product Type
Standard Only
Language
English
Current Revision
Contains over 150 industry approved test techniques and procedures for chemical, mechanical, electrical, and environmental tests on all forms of printed boards and connectors. New and updated test methods are available for download at https://www.ipc.org/test-methods.
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IPC-SM-840 - Revision D - Standard Only

Qualification and Performance<br>Specification of Permanent Solder Mask

Document #:
IPC-SM-840
Revision
D
Product Type
Standard Only
Released:  04/30/2007
Language
English
Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system. IPC-SM-840 provides two classes of requirements, T and H, to reflect functional performance requirements and testing severity based on industry/end use requirements. Coverage is given to adhesion, material qualification...

IPC-6903 - Standard Only

Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry)

Document #:
IPC-6903
Revision
D
Product Type
Standard Only
Released:  10/29/2015
Language
English
This standard provides industry-approved terms and definitions to create a common language for users and suppliers to develop electronics products that utilize printed electronics alone or as additive processes combined with traditional rigid, flexible and rigid-flex PWB assemblies Released October 2015.

IPC-CC-830 - Revision B - Standard with Amendment 1

Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

Document #:
IPC-CC-830
Revision
B
Product Type
Standard with amendment(s)
Released:  10/23/2008
Language
English
This is the industry standard for qualification and quality conformance of conformal coating. Its intent is to show how to obtain maximum information with minimum test redundancy. Includes requirements and evaluations of material properties using standardized test vehicles. Amendment 1 updates include new qualification, retention and conformance inspection requirements for FTIR, MIR and hydrolytic...

IPC-T-50 - Revision M - Standard Only

Termes et Définitions pour les Circuits Électroniques Imprimés et Assemblés

Document #:
IPC-T-50
Revision
M
Product Type
Standard Only
Released:  06/30/2015
Language
French
Current Revision
Ce document essentiel pour l’industrie fournit des descriptions et des illustrations de la terminologie de l’industrie d’assemblage électronique afin d’aider les utilisateurs et leur clients à casser les barrières linguistiques. La révision M contient plus de 220 termes nouveaux ou révisés, incluant la nouvelle terminologie pour les procédés de tropicalisation, d’enrobage et d’encapsulation, la...
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IPC-T-50 - Revision N - Standard Only

电子电路互连与封装术语及定义

Document #:
IPC-T-50
Revision
N
Product Type
Standard Only
Released:  01/13/2023
Language
Chinese
Current Revision
IPC-T-50N-CN文件旨在为电子行业中常用的词汇和术语提供其定义。本文件所规定的定义充分详细地阐明了术语，以便以英语为第二语言的读者能够理解含义的细微之处。IPC-T-50N-CN包含550多个新的或修订的术语，包括通孔结构、表面贴装器件类型、焊料凸点、焊料合金、焊接、退润湿、电路板制造工艺和测试的新术语。

IPC-T-50 - Revision K - Standard Only

Begriffe und Definitionen für Leiterplatten und elektronische Baugruppen

Document #:
IPC-T-50
Revision
K
Product Type
Standard Only
Released:  02/03/2015
Language
German
Current Revision
Das unentbehrliche Nachschlagewerk für alle Verantwortlichen entlang der Wertschöpfungskette von elektronischen Produkten. Die Revision K enthält auf mehr als 120 Seiten, mehr als 220 neue und überarbeitete Begriffe und bildliche Darstellungen. Beispiele: Access Hole, Accelerated Equivalent Soak, Capture Land, Micro Via Technology, Plating Thief, Etchback, Resin Recession, Tape Automated Bonding...

IPC-SM-840 - Revision E - Standard Only

永久性阻焊剂和挠性覆盖材料的鉴定和性能规范

Document #:
IPC-SM-840
Revision
E
Product Type
Standard Only
Released:  11/20/2012
Language
Chinese
Current Revision
简要介绍 （英文） 建立了液态和干膜阻焊材料的评估要求，以及确定其用在一个标准的印制板系统上的可接受性要求。IPC-SM-840提供了两个等级的要求，T级和H级，以反映基于行业/最终用户要求对功能性的要求及测试严格程度的差别。覆盖了附着力、材料鉴定、耐溶剂、以及电气要求。E版本包含了挠性覆盖材料的要求，在已蚀刻的导体和其他导电图形上提供挠性的介质保护层。共19页。2010年12月发布。2012年10月翻
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IPC-4591 - Revision A - Standard Only

印刷电子功能导电材料要求

Document #:
IPC-4591
Revision
A
Product Type
Standard Only
Released:  12/18/2018
Language
Chinese
Current Revision
本标准建立了应用于印刷电子的功能导电材料的分类体系，以及鉴定和质量符合性要求。本标准的目的是为印刷电子产品的从业人员提供必要的技术架构，以便设计和制造符合行业既定标准的产品。
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IPC-6903 - Revision A - Standard Only

印刷电子设计与生产的术语及定义

Document #:
IPC-6903
Revision
A
Product Type
Standard Only
Released:  12/18/2018
Language
Chinese
Current Revision
IPC-6903A标准提供了62个印刷电子行业设计和制造相关的术语及定义。IPC-6903A标准为全球印刷电子行业提供一个共同的语言和知识
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IPC-SM-817 - Revision A - Standard Only

表面実装用誘電体接着剤に関する一般要求事項

Document #:
IPC-SM-817
Revision
A
Product Type
Standard Only
Released:  09/14/2022
Language
Japanese
Current Revision
本書は、実装からはんだ付工程までにおける部品固定用として、また、プリント配線板の一部として長期的に適用される誘電体接着剤に関し、その要求事項と試験方法を提供するものである。9ページ。2014年12月発行。翻訳年 <2022年7月> 目次を見る。
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IPC-CC-830 - Revision C - Standard Only

プリント配線板組立用電気絶縁化合物の認定および性能

Document #:
IPC-CC-830
Revision
C
Product Type
Standard Only
Released:  03/12/2021
Language
Japanese
Current Revision
規格「IPC-CC-830C」は、電気絶縁化合物 (コンフォーマルコーティング) の認定および適合要件について確立するものである。これは、最小限の冗長テストで材料の最大の信頼性を得ることを目的として、設計および構築されてきたものである。規格「IPC-CC-830C」は次の項目を対象とする： フォーマルコーティング剤の認定および認定の維持 (表3-1、コラムAおよびB)。 コンフォーマルコーティング剤の特性に関する品質適合性 (表3-1、コラムC)。 本規格においてコンフォーマルコーティングという用語は、プリント配線板組立に使用される保護コーティングのタイプを指す場合に用いられる。コンフォーマルコーティングは単に機械的な支持をもたらすものではなく、湿気および汚染から基板を保護し、電気絶縁を付与することを目的としている。
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Coming Soon

IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)

IPC-2294: Design Standard for Printed Electronics on Rigid Substrates

IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards

J-STD-609C: Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-8401: Guidelines for In-Mold Electronics

IPC-HERMES-9852 Version 1.6: The Global Standard for Machine-to-Machine Communication in SMT Assembly