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IPC-6012EA Cover Image

IPC-6012 - Revision E - Addendum - Automotive

Automotive Applications Addendum to IPC-6012E Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
E
Product Type
Addendum
Released:  11/30/2021
Language
English
Current Revision
The IPC-6012EA Addendum, when required by procurement documentation/drawings, supplements or replaces specifically identified requirements of IPC-6012 revision E, for rigid printed boards that must survive the vibration and thermal cycling environments of electronic interconnects within the automotive industry. The addendum includes updated requirements for lifted lands, pattern feature accuracy...
IPC-A-620E Space Cover Image

IPC/WHMA-A-620 - Revision E - Addendum - Space and Military

Space and Military Applications Electronic Hardware Addendum to IPC/WHMA-A-620

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Addendum
Released:  11/28/2023
Language
English
Current Revision
IPC/WHMA-A-620E-S space addendum provides additional requirements to IPC/WHMA-A-620E standard to ensure the reliability of cable and wire harness assemblies that must survive the vibration and thermal excursions encountered getting to and operating in the military and space environments. IPC/WHMA-A-620E-S cannot be used as a standalone document. It must be used with the base standard IPC/WHMA-A...
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IPC-6012 - Revision F - Addendum - Space and Military

Space and Military Avionics Applications Addendum to IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
F
Product Type
Addendum
Released:  02/23/2024
Language
English
Current Revision
The IPC-6012FS space addendum provides exceptions to IPC Performance Class 3 requirements of the IPC-6012F for use in space and military avionics product. Exceptions include changes to acceptance criteria and/or sample size and test frequency for production lot acceptance testing. The IPC-6012FS covers requirements for rigid printed boards to survive vibration, extreme thermal cycling and ground...
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IPC-6013 - Revision E - Addendum - Medical

Medical Applications Addendum to IPC-6013E Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

Document #:
IPC-6013
Revision
E
Product Type
Addendum
Released:  04/12/2022
Language
English
Current Revision
The IPC-6013EM Addendum, when required by procurement documentation/drawings, supplements or replaces specifically identified requirements of IPC-6013E, for flexible/rigid-flexible printed boards that must meet requirements to high reliability medical device applications. IPC-6013EM is the only global industry-consensus standard addendum for Medical Applications to Qualification and Performance...

IPC-T-50 - Revision M - Standard Only

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Document #:
IPC-T-50
Revision
M
Product Type
Standard Only
Released:  05/26/2015
Language
English
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision M contains over 220 new or revised terms, including new terminology for conformal coatings, potting and encapsulation processes, stencil design, statistical process control, and flexible printed board...

IPC-T-50 - Revision K - Standard Only

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Document #:
IPC-T-50
Revision
K
Product Type
Standard Only
Released:  07/17/2013
Language
English
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision K contains more than 220 new or revised terms, including new terminology for thermal properties, etchback, assembly processing, hole drilling, and microvia technology. Also includes commonly used industry...
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IPC/WHMA-A-620 - Revision C - Addendum - Rail Transit

Rail Transit Addendum to IPC/WHMA-A-620C

Document #:
IPC/WHMA-A-620
Revision
C
Product Type
Addendum
Released:  05/31/2022
Language
English
Current Revision
IPC/WHMA-A-620C-R rail transit addendum provides additional requirements to IPC/WHMA-A-620C standard, describing materials, methods, tests, and acceptance criteria for producing crimped, mechanically secured, and soldered interconnections. It also provides the related assembly activities associated with cable and harness assemblies in rail transit industry, to ensure the high reliability and...
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IPC-T-50 - Revision J - Standard Only

SUPERSEDED BY T-50K

Document #:
IPC-T-50
Revision
J
Product Type
Standard Only
Released:  10/18/2011
Language
English
This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers. Revision J contains nearly 400 new or revised terms, including new terminology for chip scale and area array packaging, cable and wire harness technology, assembly processing, moisture sensitive components, and...

IPC-A-630 - Standard Only

Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

Document #:
IPC-A-630
Revision
Original Version
Product Type
Standard Only
Released:  10/04/2013
Language
English
Current Revision
This standard is the first of its kind for IPC; the first acceptability standard for electronic enclosures. It contains acceptability criteria that pertain to the "box build" of the assembly process. This standard has been written to direct manufacturers and end users of electronic enclosures of electrical and electronic equipment to understand the best practices to meet requirements, ensuring the...
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IPC/WHMA-A-620 - Revision E - Redline Standard

Requirements and Acceptance for Cable and Wire Harness Assemblies

Document #:
IPC/WHMA-A-620
Revision
E
Product Type
Redline Standard
Released:  03/06/2023
Language
English
Current Revision
IPC/WHMA-A-620E-RL is a redline document showing the difference from IPC/WHMA-A-620D to IPC/WHMA-A-620E. IPC/WHMA-A-620E-RL provides a side-by-side comparison of the two documents and includes the figures and tables. The document shows deleted/changed text in the IPC/WHMA-A-620D pages and new/revised text in the IPC/WHMA-A-620E pages. Due to the complexity of this document, it is only available in...
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IPC/WHMA-A-620 - Standard Only

IPC/WHMA-A-620 Test Data Tables

Document #:
IPC/WHMA-A-620
Revision
Original Version
Product Type
Standard Only
Released:  01/01/2012
Language
English
Current Revision
These tables are from IPC/WHMA-A-620 Revision B Chapter 19 Testing. They are provided in an electronic format that permits users to edit the tables to add user-specific criteria. These files are authorized for copying/reproduction.

IPC-SM-840 - Revision E - Standard Only

Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials

Document #:
IPC-SM-840
Revision
E
Product Type
Standard Only
Released:  12/22/2010
Language
English
Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system. IPC-SM-840 provides two classes of requirements, T and H, to reflect functional performance requirements and testing severity based on industry/end use requirements. Coverage is given to adhesion, material qualification...
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IPC-OI-645 - Standard Only

Standard for Visual Optical Inspection Aids

Document #:
IPC-OI-645
Revision
Original Version
Product Type
Standard Only
Released:  10/01/1993
Language
English
Current Revision
Establishes requirements, definitions and certification provisions for optical inspection aids. Defines inspection grades to be used as accept/reject criteria for optical inspection aids. 40 pages. Released October 1993.
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IPC/EIA-J-STD-028 - Standard Only

Performance Standard for Construction of Flip Chip and Chip Scale Bumps

Document #:
IPC/EIA-J-STD-028
Revision
Original Version
Product Type
Standard Only
Released:  08/01/1999
Language
English
Current Revision
This standard establishes construction detail requirements for bumps and other terminal structures used for Flip Chip Scale carriers. The specific standards for different terminations are appropriately matched to a particular interconnection process and include such diverse terminations as solder bumps, columns, non-melting stand-offs and conductive polymer deposits. The document articulates a set...

IPC/WHMA-A-620 - Revision D - Standard Only

Requirements and Acceptance for Cable and Wire Harness Assemblies

Document #:
IPC/WHMA-A-620
Revision
D
Product Type
Standard Only
Released:  01/21/2020
Language
English
IPC/WHMA-A-620D is the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies. IPC/WHMA-A-620D describes materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities associated with cable and harness assemblies. IPC/WHMA-A-620D was developed by IPC and...

IPC/JEDEC-J-STD-020 - Revision E - Standard Only

Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

Document #:
IPC/JEDEC-J-STD-020
Revision
E
Product Type
Standard Only
Released:  02/03/2015
Language
English
IPC JEDEC J-STD-020 is used to determine what moisture-sensitivity-level (MSL) classification level should be used so that surface mount devices (SMDs) can be properly packaged, stored and handled to avoid subsequent thermal and mechanical damage during the assembly solder reflow attachment and/or repair operation. J-STD-020 covers components to be processed at higher temperatures for lead-free...

IPC-6012 - Revision E - Standard Only

Qualification and Performance Specification for Rigid Printed Boards

Document #:
IPC-6012
Revision
E
Product Type
Standard Only
Released:  02/20/2020
Language
English
IPC-6012E specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical...
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IPC-TM-650 - Standard Only

Test Methods Manual

Document #:
IPC-TM-650
Revision
Original Version
Product Type
Standard Only
Language
English
Current Revision
Contains over 150 industry approved test techniques and procedures for chemical, mechanical, electrical, and environmental tests on all forms of printed boards and connectors. New and updated test methods are available for download at https://www.ipc.org/test-methods.

IPC-CA-821 - Standard Only

General Requirements for Thermally Conductive Adhesives

Document #:
IPC-CA-821
Revision
Original Version
Product Type
Standard Only
Released:  01/01/1995
Language
English
Current Revision
Covers requirements and test methods for thermally conductive dielectric adhesives used to bond components in place. Permanent, removable and self-shimming adhesives are addressed. 18 pages. Released January 1995.

IPC-5704 - Standard Only

Cleanliness Requirements for Unpopulated Printed Boards

Document #:
IPC-5704
Revision
Original Version
Product Type
Standard Only
Released:  01/27/2010
Language
English
Current Revision
Printed board quality encompasses many parameters, cleanliness being one important parameter. This document defines the recommended general requirements for the cleanliness of unpopulated (bare) single, double-sided and multilayer printed boards. Coverage is given to Ion Chromatography (IC) testing and Ionic cleanliness testing for process control. 6 pages. Released December 2009.

IPC-6015 - Standard Only

Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures

Document #:
IPC-6015
Revision
Original Version
Product Type
Standard Only
Released:  02/01/1998
Language
English
Current Revision
Establishes the specific requirements for organic mounting structures used to interconnect chip components, which in combination form the completed functional organic single-chip module (SCM-L) or organic multichip module (MCM-L) assembly. Includes the quality and reliability assurance requirements that must be met for their acquisition. For use with IPC-6011. 25 pages. Released February 1998.

IPC-D-279 - Standard Only

Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

Document #:
IPC-D-279
Revision
Original Version
Product Type
Standard Only
Released:  07/01/1996
Language
English
Current Revision
Establishes design concepts, guidelines and procedures for reliable printed wiring assemblies. Focuses on SMT or mixed technology PWAs, specifically addressing the interconnect structure and the solder joint itself. Discusses substrates, components, attachment materials, coatings and assembly processes and testing considerations. In addition, this document contains detailed appendices covering...

IPC-9641 - Standard Only

High Temperature Printed Board Flatness Guideline

Document #:
IPC-9641
Revision
Original Version
Product Type
Standard Only
Released:  07/10/2013
Language
English
Current Revision
Printed board flatness is largely affected by a change in intrinsic properties through exposure to variances in temperature. The worst case deviation of the printed board from flatness may be at room temperature, peak temperature during reflow, or at any temperature in between. Printed board flatness must therefore be characterized during the entire reflow thermal cycle, and not solely at room...
26-50 of 231

Coming Soon

IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)

IPC-2294: Design Standard for Printed Electronics on Rigid Substrates

IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards

J-STD-609C: Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-8401: Guidelines for In-Mold Electronics

IPC-HERMES-9852 Version 1.6: The Global Standard for Machine-to-Machine Communication in SMT Assembly