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Document #:

IPC-5701

Revision

Original Version

Product Type

Standard Only

Released: 07/01/2003

Language

English

Current Revision

Tackling PCB cleanliness is a tough job; residues on printed circuit boards are directly related to the reliability of the produced hardware and can result in serious failures if not known or monitored. But how do you measure "cleanliness"? How clean is "clean"? The IPC-5701 provides guidance into how these issues should be approached and specified in purchasing documents, addressing levels of...

Document #:

IPC-9241

Revision

Original Version

Product Type

Standard Only

Released: 01/13/2017

Language

English

Current Revision

This standard is intended as a guideline in the proper preparation of a metallographic sample (microsection) of a printed board. The finished microsection is used for evaluating the quality of the laminate system and plated structures (e.g. PTHs and vias). Microsection sample preparation is regarded by many as a highly developed skill. The guidelines in this standard discuss the many variables and...

Document #:

IPC-9708

Revision

Original Version

Product Type

Standard Only

Released: 12/14/2010

Language

English

Current Revision

Mechanical bend and shock tests are routinely performed on SMT assemblies to ensure that they can sustain anticipated production, handling and end use conditions. The strains and strain rates applied to SMT assemblies during bend and shock testing can lead to a variety of failure modes in the vicinity of the solder joints. This document provides test methods to evaluate the susceptibility of...

Document #:

IPC-8701

Revision

Original Version

Product Type

Standard Only

Released: 07/16/2014

Language

English

Current Revision

IPC-8701 presents acceptance guidelines for the solar panel in final module assembly. The intent of this standard is to cover crystalline solar modules.Some of the content may be applicable to other photovoltaic modules such as thin film. The standard reviews and includes acceptance guidelines for incoming and finished frames, frame assembly, sealant, tape, junction box assembly, and bus bar...

Document #:

IPC-CI-408

Revision

Original Version

Product Type

Standard Only

Released: 01/01/1994

Language

English

Current Revision

Provides information on design characteristics and the application of solderless surface mount connectors, including conductive adhesives to aid IC package and board interconnection. 34 pages. Released January 1994.

Document #:

IPC-SM-840

Revision

Product Type

Standard Only

Released: 04/30/2007

Language

English

Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system. IPC-SM-840 provides two classes of requirements, T and H, to reﬂect functional performance requirements and testing severity based on industry/end use requirements. Coverage is given to adhesion, material qualification...

Document #:

IPC-6903

Revision

Product Type

Standard Only

Released: 10/29/2015

Language

English

This standard provides industry-approved terms and definitions to create a common language for users and suppliers to develop electronics products that utilize printed electronics alone or as additive processes combined with traditional rigid, flexible and rigid-flex PWB assemblies Released October 2015.

Document #:

IPC-9702

Revision

Original Version

Product Type

Standard with amendment(s)

Released: 08/18/2015

Language

English

Current Revision

This publication is intended to characterize the frature strength of a component's board level-interconnect by providing a common method of establishing the fracture resistance to flexural loading that may occur during conventional non-cyclic board assembly and test operations. The document is applicable to surface mount components attached to printed wiring boards using conventional solder reflow...

Document #:

IPC-9706

Revision

Original Version

Product Type

Standard Only

Released: 01/14/2014

Language

English

Current Revision

Survey-based study presents data and analysis on the EMS industry, examining trends in sources of revenue, revenue per employee, services offered, markets served, manufacturing technology, capital investment, spending on equipment and materials and market size including forecasts and potential for market expansion. This study is based on data provided by a representative sample of 120 EMS...

Document #:

IPC-5702

Revision

Original Version

Product Type

Standard Only

Released: 06/01/2007

Language

English

Current Revision

Every electronics manufacturer, whether an original equipment manufacturer (OEM) or electronics manufacturing services (EMS) company, must determine if the unpopulated printed boards entering the assembly process have an adequate level of cleanliness. The question of “how clean is clean enough?” is one that has no definitive answer, as there is no "golden number" for board cleanliness. The issue...

Document #:

IPC-9701

Revision

Product Type

Standard Only

Released: 02/01/2006

Language

English

Provides specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies. Establishes levels of performance and reliability of the solder attachments of surface mount devices to rigid, flexible and rigid-flex circuit structures. When used with IPC-SM-785, it provides an understanding of the physics of SMT solder joint failure and an...

Document #:

IPC-1782

Revision

Product Type

Standard Only

Released: 01/13/2021

Language

English

The IPC-1782A standard establishes minimum requirements for manufacturing and supply chain traceability based on perceived risk. IPC-1782A applies to all products, processes, assemblies, parts, components, equipment and other items used in the manufacture of printed board assemblies and in mechanical assembly.

Document #:

IPC-CC-830

Revision

Product Type

Standard with amendment(s)

Released: 10/23/2008

Language

English

This is the industry standard for qualification and quality conformance of conformal coating. Its intent is to show how to obtain maximum information with minimum test redundancy. Includes requirements and evaluations of material properties using standardized test vehicles. Amendment 1 updates include new qualification, retention and conformance inspection requirements for FTIR, MIR and hydrolytic...

Document #:

IPC-2581

Revision

Product Type

Standard Only

Released: 09/01/2013

Language

English

This standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most useful...

Document #:

IPC-7525

Revision

Product Type

Standard Only

Released: 10/24/2011

Language

English

This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. This includes differences for tin lead and lead-free solder paste, overprint, two-print and step stencil designs. A sample order form and user inspection checklist are also included.

Document #:

IPC-2581

Revision

Product Type

Standard with amendment(s)

Language

English

Document #:

IPC-CC-830

Revision

Product Type

Amendment

Released: 09/01/2008

Language

English

IPC-CC-830B prescribes qualification and performance requirements of conformal coatings. Amendment 1 provides updated requirements for moisture and insulation resistance and temperature and humidity aging and additional information on coating classifications.

Document #:

IPC-SM-840

Revision

Product Type

Standard Only

Released: 11/20/2012

Language

Chinese

Current Revision

简要介绍（英文）建立了液态和干膜阻焊材料的评估要求，以及确定其用在一个标准的印制板系统上的可接受性要求。IPC-SM-840提供了两个等级的要求，T级和H级，以反映基于行业/最终用户要求对功能性的要求及测试严格程度的差别。覆盖了附着力、材料鉴定、耐溶剂、以及电气要求。E版本包含了挠性覆盖材料的要求，在已蚀刻的导体和其他导电图形上提供挠性的介质保护层。共19页。2010年12月发布。2012年10月翻

Document #:

IPC-9691

Revision

Product Type

Standard Only

Released: 04/11/2018

Language

Chinese

Current Revision

本文件是IPC电化学迁移（ECM）技术组的成果。本文件的目的是为如何更好地使用IPC-TM-650测试方法2.6.25《耐导电阳极丝（CAF）测试》以及其他内部电化学迁移（ECM）测试提供指南，以评估机械应力、层压板材料断裂、离子污染、压合层压板前湿气含量以及其它材料加工特性在层压材料中形成的导电路径，例如导电阳极丝（CAF），一种特殊类型的ECM失效模式，对测试结果的影响。该内部ECM测试方法提供了一个已经证实的标准，用于确定由于通孔偏移从而显著降低内部导体间绝缘电阻情况的风险，该现象发生在层压板内部，而不是在印制板的表面上

Document #:

IPC-9203

Revision

Product Type

Standard Only

Released: 01/02/2024

Language

Japanese

Current Revision

材料の適合性を検証するにあたり、業界では種々のテストビークルが存在し活用されている。IPC-B-52試験基板は実生産で用いられる材料と工程を具体的に表現したものであり、イオンクロマトグラフと表面絶縁抵抗(SIR)の両試験のニーズを満たすテストビークルである。IPC-9203Aに示す規格はIPC-B-52テストビークルに対応し、製造工程の評価や、選択した製造材料セットと工程が清浄度の観点から適合しているという客観的証拠を提供する場合に利用できる。またIPC-9203Aに示すユーザーガイドラインはIPC-9202の手引き文書として作成されており、製造者が材料と工程の適合性を実証する場合の規定「～することが望ましい」と「～すること(する必要がある)」という点について明確に提示している。

Document #:

IPC-9202

Revision

Product Type

Standard Only

Released: 09/22/2023

Language

Japanese

Current Revision

概説本書、IPC-9202A「材料・工程の特性評価/認定試験の方法」は、プリント回路組立品(PCA)の代表的なサンプル上の表面絶縁抵抗(SIR)の変化を記録するものである。この試験は、はんだ付後に外層に残るはんだ由来のフラックスまたはその他の工程残さが原因で不要な電気化学的反応を引き起こし、信頼性に重大な影響を及ぼす可能性について定量化するものである。この試験では、実際の生産工程において電子回路の代表的なものとなるような基板をテストビークルとして使用する。これは、定量的かつ定性的なデータの両方を得ることができる試験である。 IPC-9202Aに紹介する試験は、提案された製造工程や工程変更を用いた場合に、生産するハードウェア(製品)の最終的な性能が電気化学的リスクに対し許容可能であるということを示すための「工程認定」用として使用することができる。工程変更には組立工程の手順...