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IPC-T-50N Cover Image

IPC-T-50 - Revision N - Standard Only

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Document #:
IPC-T-50
Revision
N
Product Type
Standard Only
Released:  11/30/2021
Language
English
Current Revision
IPC-T-50N document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing English as a second language could understand the subtleties of the meaning. IPC-T-50N contains over 550 new or revised terms, including new terminology for via structures, surface mount device...
IPC-9797A Cover Image

IPC-9797 - Revision A - Standard Only

Press-fit Standard for Automotive Requirements and other High-Reliability Applications

Document #:
IPC-9797
Revision
A
Product Type
Standard Only
Released:  05/18/2023
Language
English
Current Revision
IPC-9797A is the only industry-consensus standard for Requirements and Acceptance of Press-fit Pins. IPC-9797 describes materials, methods, tests and acceptance criteria for solderless press-fit pin connections. IPC-9797 is supported by IPC-HDBK-9798 “Handbook for Press-fit Standard for Automotive Requirements and other High-Reliability Applications” for those wanting additional information and...
IPC-D-620A Cover Image

IPC-D-620 - Revision A - Standard Only

Design and Critical Process Requirements for Cable and Wiring Harnesses

Document #:
IPC-D-620
Revision
A
Product Type
Standard Only
Released:  02/28/2022
Language
English
Current Revision
The IPC-D-620A standard provides design and critical process requirements for cable and wire harness assemblies as well as military/space applications. IPC-D-620A is the design requirements companion to IPC/WHMA-A-620, "Requirements and Acceptance for Cable and Wire Harness Assemblies," and its associated Space Addendum. Three white papers are included to provide guidance on key topics discussed...

IPC-T-50 - Revision M - Standard Only

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Document #:
IPC-T-50
Revision
M
Product Type
Standard Only
Released:  05/26/2015
Language
English
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision M contains over 220 new or revised terms, including new terminology for conformal coatings, potting and encapsulation processes, stencil design, statistical process control, and flexible printed board...

IPC-T-50 - Revision K - Standard Only

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Document #:
IPC-T-50
Revision
K
Product Type
Standard Only
Released:  07/17/2013
Language
English
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision K contains more than 220 new or revised terms, including new terminology for thermal properties, etchback, assembly processing, hole drilling, and microvia technology. Also includes commonly used industry...
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IPC-T-50 - Revision J - Standard Only

SUPERSEDED BY T-50K

Document #:
IPC-T-50
Revision
J
Product Type
Standard Only
Released:  10/18/2011
Language
English
This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers. Revision J contains nearly 400 new or revised terms, including new terminology for chip scale and area array packaging, cable and wire harness technology, assembly processing, moisture sensitive components, and...
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IPC-TM-650 - Standard Only

Test Methods Manual

Document #:
IPC-TM-650
Revision
Original Version
Product Type
Standard Only
Language
English
Current Revision
Contains over 150 industry approved test techniques and procedures for chemical, mechanical, electrical, and environmental tests on all forms of printed boards and connectors. New and updated test methods are available for download at https://www.ipc.org/test-methods.

IPC-T-50 - Revision M - Standard Only

Termes et Définitions pour les Circuits Électroniques Imprimés et Assemblés

Document #:
IPC-T-50
Revision
M
Product Type
Standard Only
Released:  06/30/2015
Language
French
Current Revision
Ce document essentiel pour l’industrie fournit des descriptions et des illustrations de la terminologie de l’industrie d’assemblage électronique afin d’aider les utilisateurs et leur clients à casser les barrières linguistiques. La révision M contient plus de 220 termes nouveaux ou révisés, incluant la nouvelle terminologie pour les procédés de tropicalisation, d’enrobage et d’encapsulation, la...
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IPC-D-620 - Revision A - Standard Only

Design and Critical Process Requirements for Cable and Wiring Harnesses

Document #:
IPC-D-620
Revision
A
Product Type
Standard Only
Language
English
The IPC-D-620A standard provides design and critical process requirements for cable and wire harness assemblies as well as military/space applications. IPC-D-620A is the design requirements companion to IPC/WHMA-A-620, "Requirements and Acceptance for Cable and Wire Harness Assemblies," and its associated Space Addendum. Three white papers are included to provide guidance on key topics discussed...
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IPC-T-50 - Revision N - Standard Only

电子电路互连与封装术语及定义

Document #:
IPC-T-50
Revision
N
Product Type
Standard Only
Released:  01/13/2023
Language
Chinese
Current Revision
IPC-T-50N-CN文件旨在为电子行业中常用的词汇和术语提供其定义。本文件所规定的定义充分详细地阐明了术语，以便以英语为第二语言的读者能够理解含义的细微之处。IPC-T-50N-CN包含550多个新的或修订的术语，包括通孔结构、表面贴装器件类型、焊料凸点、焊料合金、焊接、退润湿、电路板制造工艺和测试的新术语。

IPC-T-50 - Revision K - Standard Only

Begriffe und Definitionen für Leiterplatten und elektronische Baugruppen

Document #:
IPC-T-50
Revision
K
Product Type
Standard Only
Released:  02/03/2015
Language
German
Current Revision
Das unentbehrliche Nachschlagewerk für alle Verantwortlichen entlang der Wertschöpfungskette von elektronischen Produkten. Die Revision K enthält auf mehr als 120 Seiten, mehr als 220 neue und überarbeitete Begriffe und bildliche Darstellungen. Beispiele: Access Hole, Accelerated Equivalent Soak, Capture Land, Micro Via Technology, Plating Thief, Etchback, Resin Recession, Tape Automated Bonding...
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IPC-9707 - Amendment 1

Spherical Bend Test Method for Characterization of Board Level Interconnects

Document #:
IPC/JEDEC-9707
Revision
Original Version
Product Type
Amendment
Released:  05/01/2018
Language
English
Current Revision
IPC/JEDEC-9707-AM1 is an amendment which clarifies that the standard is only applicable to transient bending during short-term test operations. The standard specifies a common method of establishing strain limits of board-level device interconnects under spherical transient bending conditions, the worst-case flexure condition that can occur during conventional printed board/system assembly...
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IPC-HDBK-9798 - Handbook

Handbook for Press-fit Standard for Automotive Requirements and other High-Reliability Applications

Document #:
IPC-HDBK-9798
Revision
Original Version
Product Type
Handbook
Released:  06/21/2022
Language
English
Current Revision
IPC-HDBK-9798 provides guidelines and supporting information for manufacturing electronic assemblies using compliant press-fit technology. The intent is to explain the ‘‘how-to’’ and ‘‘why’’ information, and fundamentals for these processes. This handbook is supporting the IPC-9797 standard.

IPC-9797 - Standard Only

Press-fit Standard for Automotive Requirements and other High-Reliability Applications

Document #:
IPC-9797
Revision
Original Version
Product Type
Standard Only
Released:  06/01/2020
Language
English
IPC-9797 is the only industry-consensus standard for Requirements and Acceptance of Press-fit Pins. IPC-9797 prescribes practices for the characterization, qualification and acceptance requirements of compliant press-fit technology for printed boards that cover the manufacturability and reliability needs for high reliability applications intended for use in harsh environments such as automotive...

IPC-D-620 - Standard Only

Design and Critical Process Requirements for Cable and Wiring Harnesses

Document #:
IPC-D-620
Revision
Original Version
Product Type
Standard Only
Released:  12/08/2015
Language
English
IPC-D-620 provides design and critical process requirements for the three product classes of cable and wire harness assemblies as well as military/space applications. It is the design requirements companion to IPC/WHMA-A-620, "Requirements and Acceptance for Cable and Wire Harness Assemblies," and its associated Space Addendum Three white papers are included to provide guidance on key topics...

IPC-9707 - Standard Only

Spherical Bend Test Method for Characterization of Board Level Interconnects

Document #:
IPC/JEDEC-9707
Revision
Original Version
Product Type
Standard Only
Released:  09/13/2011
Language
English
This standard on spherical transient bend testing is intended to characterize the maximum allowable strain that a surface mount component's board level interconnects can withstand in flexural loading. Whereas four-point monotonic bend test methods only address simple planar bending, spherical bend tests establish strain limits of board level interconnects under worst-case flexure conditions that...

IPC-1791 - Standard Only

Trusted Electronic Designer, Fabricator and Assembler Requirements

Document #:
IPC-1791
Revision
Original Version
Product Type
Standard Only
Released:  09/05/2018
Language
English
IPC-1791 provides minimum requirements, policies and procedures for printed board design, fabricating and assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. Demonstration of the ability to meet and maintain the requirements of IPC-1791 as trusted design, fabricator or assembly organization...

IPC-T-50 - Revision M - Standard Only

电子电路互连与封装术语及定义

Document #:
IPC-T-50
Revision
M
Product Type
Standard Only
Released:  09/19/2016
Language
Chinese
本文件是电子互连行业不可或缺的术语标准。该文件图文并茂，可帮助用户及其客户克服语言上的沟通障碍。M版本包含超过220多条新术语或修订术语，包括敷形涂覆、灌封和封装工艺、模板设计、统计工艺控制和挠性印制板技术。也包括通用行业缩写词。

IPC-T-50 - Revision H - Standard Only

电子电路互连与封装术语及定义

Document #:
IPC-T-50
Revision
H
Product Type
Standard Only
Released:  09/17/2009
Language
Chinese
Description in English 本文件是电子互连行业不可或缺的一份术语标准。该文件图文并茂，可帮助用户及其客户克服语言上的沟通障碍。H版本包含200多条新术语或修订术语，新术语涉及球栅阵列和芯片尺寸封装、导通孔保护、导体图形、组装工艺、基材和选择性电镀工艺等。还包括通用工业缩写词和根据技术分类排序的术语索引，以便于查找。全文276页，于 2008年7月公布。
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IPC-TM-650 - Standard Only

Method Development Packet

Document #:
IPC-TM-650
Revision
Original Version
Product Type
Development Packet
Released:  06/06/2012
Language
English
Current Revision
This document has been created to help define criteria that will yield better test methods for use by the electronics and related industries. Key objectives to validating a new test method procedure are covered, including the usage of objective evidence to verify that the elements defined within a method fulfill the intended use and that the method yields repeatable and reproducible results when...
IPC-9797 JP Cover

IPC-9797 - Standard Only

車載要求事項およびその他高信頼性用途のプレスフィット規格

Document #:
IPC-9797
Revision
Original Version
Product Type
Standard Only
Released:  07/28/2021
Language
Japanese
Current Revision
IPC-9797はプレスフィットピンの要求事項および許容基準に関する、業界合意による唯一の規格である。IPC-9797は、無はんだによるプレスフィットピン接続の材料、工法、試験、許容基準について記述するものである。
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IPC-D-620 - Standard Only

线缆及线束组件的设计与关键工艺要求

Document #:
IPC-D-620
Revision
Original Version
Product Type
Standard Only
Released:  03/24/2022
Language
Chinese
Current Revision
IPC-D-620 为线缆和线束组件以及军事/航空应用的三个产品类别提供了设计与关键工艺要求。 它是 IPC/WHMA-A-620“线缆及线束组件的要求与验收”及其相关航空附录的设计要求伴侣 包括三份白皮书，为标准中讨论的关键主题提供指导。 这些是： IPC-WP-113, Guidance for the Development and Implementation of a Red Plague Control Plan (RPCP) IPC-WP-114, Guidance for the Development and Implementation of a White Plague Control Plan (WPCP) IPC-WP-116, Guidance for the Development and Implementation of a Foreign Object...
no-image-available

IPC-9797 - Standard Only

符合汽车应用要求及其他高可靠性应用要求的压接标准

Document #:
IPC-9797
Revision
Original Version
Product Type
Standard Only
Released:  10/13/2020
Language
Chinese
Current Revision
IPC-9797是符合汽车应用要求及其他高可靠性应用要求的压接标准。IPC-9797规定了印刷电路板的符合压接技术的特性、鉴定和验收要求，涵盖了用于苛刻环境(如汽车和航空航天)的高可靠性应用的制造性和可靠性需求。
1-24 of 24

Coming Soon

IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

IPC-2294: Design Standard for Printed Electronics on Rigid Substrates

IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates

J-STD-005B: Requirements for Soldering Pastes

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards

J-STD-609C: Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

J-STD-004D: Requirements for Soldering Fluxes

IPC-4413: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards

IPC-HERMES-9852 Version 1.6: The Global Standard for Machine-to-Machine Communication in SMT Assembly