本标准是为设计与制造焊膏及表面贴装粘合剂用模板提供指导。本文件大部分内容是基于模板设计者、制造厂商和用户的经验编写的。
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This guideline provides an overview of the design process flow for printed electronics based devices, modules and units, and final products.The intent of IPC/JPCA-2291 is to establish a design process flow that will facilitate and improve the practice of printed electronics design. IPC/JPCA-2291 identifies documents such as standards that can be used to assist during the design process flow. 24...
The IPC-4592 standard establishes the classification system, the qualification and quality conformance requirements for functional dielectric materials used in printed electronics applications. The intended applications include but are not limited to dielectric materials as protective dielectric or insulator/insulation layer(s), capacitive layer(s), crossovers and encapsulant(s) for devices in...
Cleaning of stencils and misprinted PCBs has taken an increasingly important role in surface mount technology. Fine and ultra-fine pitch lands, together with other advanced packages, place new demands on stencil cleaning. Paste volume is a critical issue for fine, ultra-fine, chip-scale, BGA and flip-chip components. Insufficient solder due to clogging of stencil apertures is a primary cause of...
This document provides tests that record changes in surface insulation resistance (SIR) on a representative sample of a printed circuit assembly. It quantifies any deleterious effects that might arise from solder flux or other process residues left on external surfaces after soldering, which can cause unwanted electrochemical reactions that grossly affect reliability. It uses test vehicles that...
While there are a variety of industry test vehicles for the examination of materials compatibility, most available test boards leave something to be desired as there is often a dramatic difference in materials between such test boards and produced assemblies. A test vehicle was needed which could be used for both ion chromatography and SIR testing that would be more representative of mainstream...
IPC-2292 standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on flexible substrates. Flexible substrates, as pertaining to IPC-2292 standard, are materials or devices which have some amount of flexibility or bendability (not rigid) but are not considered to be stretchable (e.g., fabrics...
This document provides comprehensive data to help users more easily determine material performance, capabilities, and compatibility of functional conductive materials for the manufacture of printed electronics. It includes: classification schemes based on composition, conductor type, and post-processing structure; functional conductive material specification sheets to present properties for the...
Surface mount pad cratering typically initiates prior to detection by existing electrical monitoring test methods. There are limited instrumentation techniques that are currently available that can identify non-electrical damage and its location to a high degree of accuracy. This guideline document establishes an acoustic emission (AE) method to evaluate the performance and reliability of surface...
This document provides comprehensive data to help users more easily determine both material capability and compatibility for flexible and rigid base dielectric materials for manufacture of printed electronics. It includes base material specification sheets that have been updated with the newest properties for the specification material types. It establishes the most current classification system...
This document has been created to help define criteria that will yield better test methods for use by the electronics and related industries. Key objectives to validating a new test method procedure are covered, including the usage of objective evidence to verify that the elements defined within a method fulfill the intended use and that the method yields repeatable and reproducible results when...
本标准建立了机械跌落和冲击测试指南，用于评估印刷电路板组件从系统到组件级别的焊点可靠性。 本文件介绍了定义机械冲击使用条件的方法，定义系统级别的方法；系统级印刷电路板以及与此类使用条件相关的元器件测试板级别的测试，以及使用实验测量机械冲击测试的指导。 正文42页。 2009年3月英文版发布。2019年3月翻译。
本文件旨在描述元器件板级互连的断裂强度特性，它详细说明了确定板级器件互连对非周期板组装和测试操作过程中可能发生的弯曲载荷的抗断裂力的常用方法。本文件适用于采用常规再流焊接技术连接到印制板上的表面贴装元器件，并补充了有关运输、装卸或现场操作过程中的机械冲击或撞击的现有标准。全文共14页，2004年6月正式发布英文版，2011年6月发布中文版 预览本标准
简要介绍 （英文） 对SMT组件定期进行机械弯曲和冲击测试，以确保它们能够承受预期的生产、搬运和最终使用条件。在弯曲和冲击测试过程中，加载于SMT组件的应变和应变率在焊点附近会导致各种失效模式。本文件提供了测试方法去评估印制板组装（PBA）材料的敏感性和关于表面贴装技术（SMT）的连接焊盘下方绝缘材料接合失效的设计。这些测试方法，包括引脚拉拔、焊球拉拔、焊球剪切测试，可以对不同的印制板的材料和设计参数进行排序和比较。全文共17页。2010年12月发布。2013年5月翻译。
中文描述 本文件为设计与制造焊膏及表面贴装胶用模板提供 指导以及采用通孔或者倒装芯片器件的混装技术模 板设计，其中包括锡铅和无铅焊膏、套印、二次印 刷和阶梯模板设计之间的差别。该文件同时提供了 样品定购单和用户检验检查表
本用户指南的目的是为如何更好地使用IPC-TM-650测试方法2.6.25耐导电阳极丝（CAF）测试提供指导，以评估机械应力、层压板材料断裂、离子污染、压合层压板前湿气含量以及其它材料加工特性对耐导电阳极丝（CAF）测试方法结果的影响。 本CAF测试方法提供了已经证实的标准，用于评估印制板内部而非其表面的温度、湿度和偏压（THB）的失效风险，通常细丝会沿着树脂和层压板增强材料之间的界面形成。共23页。2007年8月。2013年6月翻译.
This is the industry standard for qualification and quality conformance of conformal coating. Its intent is to show how to obtain maximum information with minimum test redundancy. Includes requirements and evaluations of material properties using standardized test vehicles. Amendment 1 updates include new qualification, retention and conformance inspection requirements for FTIR, MIR and hydrolytic...
Coming Soon
IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
J-STD-005B: Requirements for Soldering Pastes
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards
J-STD-004D: Requirements for Soldering Fluxes
IPC-4413: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards