Products
This handbook is a compilation of the conformal coating industry's practical experience, and will assist the designers and users of conformal coatings in making informed choices. Users will better understand the properties of the various conformal coatings, the results to be achieved by its application and how to verify that these goals have been met. Use this document as a supplement in...
IPC-HDBK-620 is a companion reference to IPC-D-620 ‘‘Design and Critical Process Requirements for Cable and Wiring Harnesses’’ and IPC/WHMA-A-620 ‘‘Requirements and Acceptance for Cable and Wire Harness Assemblies” and provides supporting information and technical rationale for requirements in those standards. This guidance document is highly recommended for anyone who wants to learn the “how” and...
This standard is the companion document to IPC-A-630. IPC-HDBK-630 is an in-depth guideline to the design, manufacture, inspection and testing of the high level assembly, or "box" that encloses electronics assemblies. This document was written to help designers, manufacturers and end users of electronic enclosures of electrical and electronic equipment understand the industry's best practices to...
IPC-DR-DES-2022 document is intended to guide PCB designers in the use of IPC PCB Design standards as they define processes and parameters for use in CAD tools. The IPC-DR-DES-2022 is an excellent hands on desk reference manual for use by every designer.
This handbook assists individuals who make choices regarding adhesive bonding or who must work in adhesive bonding operations for electronic assemblies. The full-color guide also provides guidelines for design, selection and application of adhesive bonding.
This handbook has been written to assist the designers and users of potting and encapsulation in understanding the characteristics of various materials, as well as the factors that can modify those characteristics when the potting or encapsulation is applied. The equipment and processes involved in the preparation and application of potting and encapsulation are also covered. The challenge in...
IPC-HDBK-840 supplements the solder mask requirements established in IPC specifications such as IPC-SM-840 and IPC-6012 by providing detailed information on solder mask types, application processes, pre- and post- assembly processes, characteristics and properties that are useful in the selection and use of the most appropriate mask type for a given application. Applicable to solder mask...
This document helps establish guidance for the formation of due diligence programs for supply chain conflict minerals tracking, management, disclosure and reporting. This document is not, and should not be used as, a guide to legal compliance with Section 1502 of the Dodd-Frank Act. This document is intended to provide a guide for establishing and implementing a conflict minerals program to meet...
This document provides an overview of the Registration, Evaluation, and Authorization of Chemicals regulation that will impact the electronics interconnect industry. Specifically, this document provides an Executive Overview, a timetable of activities and a review of the implications and obligations for each segment of the supply chain. 27 pages. Released October 2008.
This handbook is a compilation of the conformal coating industry's practical experience, and will assist the designers and users of conformal coatings in making informed choices. Users will better understand the properties of the various conformal coatings, the results to be achieved by its application and how to verify that these goals have been met. Use this document as a supplement in...
该标准是 IPC-A-630 的配套文件。 IPC-HDBK-630 是高级组件或包含电子组件的“盒子”的设计、制造、检查和测试的深入指南。 本文档旨在帮助电气和电子设备的电子外壳的设计人员、制造商和最终用户了解行业的最佳实践以满足要求——确保最终项目组件在其预期设计寿命内的可靠性和功能。 2014 年 6 月发行,168 页。
IPC-HDBK-620 是 IPC-D-620“线缆及线束的设计和关键工艺要求”和 IPC/WHMA-A-620“线缆及线束组件的要求与验收”的配套参考文件和为这些标准中的要求提供支持信息和技术原理。 强烈建议任何想要了解要求背后的“方式”和“原因”的人都强烈推荐本指南文件,并且是从事线缆和线束工艺的工艺和制造工程师的必备文件。
IPC-HDBK-9798は、コンプライアントプレスフィット技術を用いて電子組立品を製造するためのガイドラインおよび補足情報を提供するものである。本書は、これらの工法の「ハウツー」と「理由」に関する情報、および原理について説明することを意図している。 このハンドブックは、規格書「IPC-9797」を補足するものである。
Coming Soon
IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards