Technical Reports & White Papers

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Document #:

IPC-WP-019

Revision

Product Type

White Paper

Released: 10/07/2020

Language

English

Current Revision

The IPC-WP-019B white paper was created to support the IPC-J-STD-001H standard and provides additional guidance, examples, and understanding of Section 8.0 Cleaning and Residue Requirements. The IPC-WP-019B has information on how to meet the requirements of IPC-J-STD-001H chapter 8. Recommentded for those looking to implement the requirements of IPC-J-STD-001H standard, chapter 8. 0..

Document #:

IPC-WP-021

Revision

Original Version

Product Type

White Paper

Released: 12/16/2019

Language

English

Current Revision

The IPC-WP-021 white paper considers conformal coatings, like many high-performance materials, have evolved considerably since the 1990s. New coatings, such as fluoropolymers or hybrid coatings, have come on the market, many of which offer superior protection characteristics, but do not fit into the existing classifications of either MIL-I-46058 or IPC-CC-830. The IPC-WP-021 white paper discusses...

Document #:

IPC-WP-023

Revision

Original Version

Product Type

White Paper

Released: 05/01/2018

Language

English

Current Revision

IPC-WP-023 is an IPC Technology Solutions White Paper addressing reliability issues associated with stacked microvias. There is evidence that staggering vias can result in a more robust structure; however, staggering microvias is only a temporary solution to accommodate complex designs with microvias built with weak interface structures IPC-WP-023 white paper provides an investigation of these...

Document #:

IPC-WP-026

Revision

Original Version

Product Type

White Paper

Released: 12/05/2019

Language

English

Current Revision

The IPC-WP-026 white paper explores blockchain as an emerging technology that has a core strength in providing an immutable, auditable, transparent and secure environment for data exchanges. These advantages make it a prime candidate for implementation in the electronics industry. The IPC-WP-026 white paper explores blockchain and its limitations and challenges. It also provides a few directions...

Document #:

IPC-WP-024

Revision

Original Version

Product Type

White Paper

Released: 08/16/2018

Language

English

Current Revision

IPC-WP-024 is a white paper which discusses the issues associated with reliability of smart textiles (e-textiles structures) following multiple washing cycles and emphasizes efforts that industry and research laboratories must undertake to make e-textile structures more robust and able to be washed similarly to everyday textile products (e.g., underwear, clothing, home textiles and technical...

Document #:

IPC/PERM-WP-022

Revision

Original Version

Product Type

White Paper

Released: 09/05/2018

Language

English

Current Revision

Manufacturers of high reliability electronics have been working for many years to mitigate the deleterious effects of tin whisker formation. One highly effective means to suppress the growth of tin whiskers is to replace the pure tin plating with reﬂowed tin-lead solder. One approach is to fully consume the tin plating by tin-lead solder during the SMT reﬂow process. This phenomenon of tin...

Document #:

IPC-WP-025

Revision

Original Version

Product Type

White Paper

Released: 04/01/2019

Language

English

Current Revision

This white paper is a benchmarking exercise of e-textile integrations, providing an introductory categorization of how the current market sector is using textile-based electrical components to achieve integrated functionality. This peer assessment provides a baseline understanding of e-textile process techniques, requirements and resources within this emerging sector.

Document #:

IPC-WP-004

Revision

Original Version

Product Type

White Paper

Released: 08/01/1994

Language

English

Current Revision

Addresses the complete process of reengineering new product development processes to incorporate DFX methodologies. Presents the case for a comprehensive analysis of the key business issues and definition of requirements before initiating work to refine or restructure processes. Editor, Dieter Bergman, IPC. 88 pages. Released by the Surface Mount Council, April 1997.

Document #:

IPC-WP-003

Revision

Original Version

Product Type

White Paper

Released: 08/01/1993

Language

English

Current Revision

Status of the technology discussion on the various methodologies for mounting and interconnecting active devices to a variety of substrate materials is summarized in this document. Reviews mounting techniques of tape automated bonding (TAB), chip on board (COB) and flip chip. Examinations of the most commonly used substrate options of laminate, ceramic and silicon are also reviewed. Editor: John...

Document #:

IPC-RFP

Revision

Original Version

Product Type

White Paper

Released: 01/18/2012

Language

English

Current Revision

"Is Your RFP D.O. A." was presented at the IPC Conference for the PCB Industry: Critical Issues for the Military Market in December 2011 by Steve DeWaters, president, Penumbra Strategies, Inc. The author describes the procedures of the military in preparing an RFP and evaluating the proposals. He also describes the procedures to create an effective response to the RFP and some of the pitfalls of...

Document #:

IPC-EMB

Revision

Original Version

Product Type

White Paper

Released: 01/25/2012

Language

English

Current Revision

"Embedded Capacitor Technology; Status, Opportunity and Challenges" was presented by John Andresakis, vice president of strategic technology, Oak-Mitsui at the IPC Conference for the PCB Industry: Critical Issues for the Military Market, Washington D.C., in December 2011.The author explains how the use of this technology improves the performance, reliability and assembly cost of printed boards and...

Document #:

IPC-WP-016

Revision

Original Version

Product Type

White Paper

Released: 02/07/2013

Language

English

Current Revision

A discussion was held in the 5-33AWG (ad hoc working group), on things that conformal coat professionals (materials and processes) wish designers knew about conformal coating. The 5-33AWG group is comprised of individuals from OEMs, coating suppliers, and test lab personnel.

Document #:

IPC-WP-017

Revision

Original Version

Product Type

White Paper

Released: 10/30/2015

Language

English

Current Revision

This technical paper covers the testing and evaluation of polymeric conformal coatings for moisture and insulation resistance (MIR) and dielectric withstanding voltage (DWV). This effort was initiated by the IPC Conformal Coating Task Group to support technical decisions for IPC coating specification CC-830 as part of the Revision C process. MIR testing was done per a modified method of IPC-TM-650...

Document #:

IPC-WP-009

Revision

Original Version

Product Type

White Paper

Released: 05/14/2009

Language

English

Current Revision

As most of the world converts to lead-free manufacturing, the concern over tin whiskers as a reliability hazard has grown due to the emergence of pure tin as a dominate component surface finish. A significant amount of research on tin whisker formation and tin whisker mitigating strategies has been performed in both commercial and defense industries. This working paper is a summary of the...

Document #:

IPC-WP-019

Revision

Product Type

White Paper

Released: 10/12/2018

Language

English

IPC-WP-019A a revised white paper provides an overview of ionic cleanliness requirements, providing examples of tests and requirements for acceptability from a residue/cleanliness standpoint. The history of ROSE testing is also provided, with explanations of the shortcomings of that testing.

Document #:

IPC-TR-587

Revision

Original Version

Product Type

Study/Technical Report

Released: 08/04/2020

Language

English

Current Revision

IPC-TR-587 technical report delivers results of a major study on conformal coating. In most manufacturing specifications, conformal coating thickness is defined as the thickness of the final polymer film on a flat, unencumbered surface of the assembly, however conformal coating thickness on other assembly and component surfaces is not characterized. IPC-TR-587 is a report outlining an IPC study of...

Document #:

IPC-TR-582

Revision

Original Version

Product Type

Study/Technical Report

Released: 10/02/2018

Language

English

Current Revision

This document details the test procedures, test results and team conclusions for the IPC Cleaning and Cleanliness Testing Program, Phase 3, Low Solids Flux in Ambient Air. This effort has been part of a multi-stage program to investigate material and process alternatives to the use of chlorofluorocarbons (CFCs) in electronics manufacturing. This Phase 3 effort has been dedicated to characterizing...

Document #:

IPC-TR-583

Revision

Original Version

Product Type

Study/Technical Report

Released: 07/01/2002

Language

English

Current Revision

This original research was a cooperative effort between the EMPF and IPC, released as EMPF-RR-0013 in 1993 for better understanding of ionic cleanliness testing. The IPC Ionic Conductivity/Ion Chromatography Test Task Group has validated its continued importance and relevance to the cleaning community and IPC-TR-583 is the result. It includes how solvent temperature influences the final...

Document #:

IPC-TR-486

Revision

Original Version

Product Type

Study/Technical Report

Released: 07/01/2001

Language

English

Current Revision

This technical report provides full detail of the round robin study charged with assessing the use of Interconnect Stress Test (IST) as a test for incoming inspection in lieu of Thermal Stress in the detection of innerlayer separations in plated-through holes. Includes background on the Post Separation Task Group, test results, round robin test plan, conclusions and test methods used. 51 pages...

Document #:

IPC-TR-585

Revision

Original Version

Product Type

Study/Technical Report

Released: 05/01/2006

Language

English

Current Revision

This Technical Report details the investigations into identifying stress tests that distinguish between robust and non-robust surface finishes. A robust finish will pass a test for solderability whereas a non-robust finish will fail. The stress tests identified do not necessarily duplicate real world environment (fabrication of the bare printed board through assembly), but they must correlate to...

Document #:

IPC-TR-001

Revision

Original Version

Product Type

Study/Technical Report

Released: 01/01/2006

Language

English

Current Revision

This document, co-developed by the IPC, EIA and ASTM, represents a comprehensive report on fine pitch technology with an emphasis on tape-automated bonding and design rules. Subjects include land pattern design, types of encapsulation, TAB tape format, assembly techniques and the advantages and disadvantages of FPT. 54 pages. Released by the Surface Mount Council January 1989.

Document #:

IPC-TP-1113

Revision

Original Version

Product Type

Study/Technical Report

Released: 01/01/1994

Language

English

Current Revision

A Technical Paper by Dr. Jack Brous discussing ionic cleanliness measurement, testing methods and cleanliness standards in relation to product reliability. Also includes a brief discussion of no-clean fluxes. 8 pages. Released 1994

Document #:

IPC-TR-579

Revision

Original Version

Product Type

Study/Technical Report

Released: 09/01/1988

Language

English

Current Revision

Approximately 200,000 plated through-holes, covering primarily electroplated but also electroless technology, were exposed to several different thermal cycles. A number of PTH diameters, board constructions and plating thicknesses were evaluated. 80 pages. Released September 1988.

Document #:

IPC-TR-549

Revision

Original Version

Product Type

Study/Technical Report

Released: 12/02/2014

Language

English

Current Revision

An IPC Blue Ribbon Committee originally published this study. It provides extensive background and test results resolving methods to identify visible conditions such as measles in PWBs and that measles do not impact reliability. 81 Pages. Released November 1973.