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IPC-WP-023 - White Paper

IPC Technology Solutions White Paper on Performance-Based Printed Board OEM Acceptance: The Hidden Reliability Threat

Document #:
IPC-WP-023
Revision
Original Version
Product Type
White Paper
Released:  05/01/2018
Language
English
Current Revision
IPC-WP-023 is an IPC Technology Solutions White Paper addressing reliability issues associated with stacked microvias. There is evidence that staggering vias can result in a more robust structure; however, staggering microvias is only a temporary solution to accommodate complex designs with microvias built with weak interface structures IPC-WP-023 white paper provides an investigation of these...

IPC-WP-026 - White Paper

IPC Technology Solutions White Paper on Blockchain and the Electronics Industry: A Review of the Current State of Blockchain Technology and Its Potential Applications in Electronics Manufacturing

Document #:
IPC-WP-026
Revision
Original Version
Product Type
White Paper
Released:  12/05/2019
Language
English
Current Revision
The IPC-WP-026 white paper explores blockchain as an emerging technology that has a core strength in providing an immutable, auditable, transparent and secure environment for data exchanges. These advantages make it a prime candidate for implementation in the electronics industry. The IPC-WP-026 white paper explores blockchain and its limitations and challenges. It also provides a few directions...

IPC-WP-024 - White Paper

IPC White Paper on Reliability and Washability of Smart Textile Structures – Readiness for the Market

Document #:
IPC-WP-024
Revision
Original Version
Product Type
White Paper
Released:  08/16/2018
Language
English
Current Revision
IPC-WP-024 is a white paper which discusses the issues associated with reliability of smart textiles (e-textiles structures) following multiple washing cycles and emphasizes efforts that industry and research laboratories must undertake to make e-textile structures more robust and able to be washed similarly to everyday textile products (e.g., underwear, clothing, home textiles and technical...

IPC-WP-025 - White Paper

IPC White Paper on A Framework for the Engineering and Design of E-Textiles

Document #:
IPC-WP-025
Revision
Original Version
Product Type
White Paper
Released:  04/01/2019
Language
English
Current Revision
This white paper is a benchmarking exercise of e-textile integrations, providing an introductory categorization of how the current market sector is using textile-based electrical components to achieve integrated functionality. This peer assessment provides a baseline understanding of e-textile process techniques, requirements and resources within this emerging sector.
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IPC/PERM-WP-022 - White Paper

Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow - Results of an Industry Round-Robin - Final Report

Document #:
IPC/PERM-WP-022
Revision
Original Version
Product Type
White Paper
Released:  09/05/2018
Language
English
Current Revision
Manufacturers of high reliability electronics have been working for many years to mitigate the deleterious effects of tin whisker formation. One highly effective means to suppress the growth of tin whiskers is to replace the pure tin plating with reflowed tin-lead solder. One approach is to fully consume the tin plating by tin-lead solder during the SMT reflow process. This phenomenon of tin...
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IPC-WP-004 - White Paper

Design for Success

Document #:
IPC-WP-004
Revision
Original Version
Product Type
White Paper
Released:  08/01/1994
Language
English
Current Revision
Addresses the complete process of reengineering new product development processes to incorporate DFX methodologies. Presents the case for a comprehensive analysis of the key business issues and definition of requirements before initiating work to refine or restructure processes. Editor, Dieter Bergman, IPC. 88 pages. Released by the Surface Mount Council, April 1997.
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IPC-WP-003 - White Paper

Chip Mounting Technology

Document #:
IPC-WP-003
Revision
Original Version
Product Type
White Paper
Released:  08/01/1993
Language
English
Current Revision
Status of the technology discussion on the various methodologies for mounting and interconnecting active devices to a variety of substrate materials is summarized in this document. Reviews mounting techniques of tape automated bonding (TAB), chip on board (COB) and flip chip. Examinations of the most commonly used substrate options of laminate, ceramic and silicon are also reviewed. Editor: John...
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IPC-MILMKT12-11-RFPDOA - White Paper

Is Your RFP D.O.A.

Document #:
IPC-RFP
Revision
Original Version
Product Type
White Paper
Released:  01/18/2012
Language
English
Current Revision
"Is Your RFP D.O. A." was presented at the IPC Conference for the PCB Industry: Critical Issues for the Military Market in December 2011 by Steve DeWaters, president, Penumbra Strategies, Inc. The author describes the procedures of the military in preparing an RFP and evaluating the proposals. He also describes the procedures to create an effective response to the RFP and some of the pitfalls of...
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IPC-EMB - White Paper

Embedded Capacitor Technology; Status, Opportunity and Challenges

Document #:
IPC-EMB
Revision
Original Version
Product Type
White Paper
Released:  01/25/2012
Language
English
Current Revision
"Embedded Capacitor Technology; Status, Opportunity and Challenges" was presented by John Andresakis, vice president of strategic technology, Oak-Mitsui at the IPC Conference for the PCB Industry: Critical Issues for the Military Market, Washington D.C., in December 2011.The author explains how the use of this technology improves the performance, reliability and assembly cost of printed boards and...
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IPC-582 - Study/Report

Cleaning & Cleanliness Test Program for Phase 3-Low Solids Fluxes & Pastes Processed in Ambiant Air

Document #:
IPC-TR-582
Revision
Original Version
Product Type
Study/Technical Report
Released:  10/02/2018
Language
English
Current Revision
This document details the test procedures, test results and team conclusions for the IPC Cleaning and Cleanliness Testing Program, Phase 3, Low Solids Flux in Ambient Air. This effort has been part of a multi-stage program to investigate material and process alternatives to the use of chlorofluorocarbons (CFCs) in electronics manufacturing. This Phase 3 effort has been dedicated to characterizing...

IPC-TR-583 - Study/Report

An In-Depth Look At Ionic Cleanliness Testing

Document #:
IPC-TR-583
Revision
Original Version
Product Type
Study/Technical Report
Released:  07/01/2002
Language
English
Current Revision
This original research was a cooperative effort between the EMPF and IPC, released as EMPF-RR-0013 in 1993 for better understanding of ionic cleanliness testing. The IPC Ionic Conductivity/Ion Chromatography Test Task Group has validated its continued importance and relevance to the cleaning community and IPC-TR-583 is the result. It includes how solvent temperature influences the final...

IPC-TR-486 - Study/Report

Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations

Document #:
IPC-TR-486
Revision
Original Version
Product Type
Study/Technical Report
Released:  07/01/2001
Language
English
Current Revision
This technical report provides full detail of the round robin study charged with assessing the use of Interconnect Stress Test (IST) as a test for incoming inspection in lieu of Thermal Stress in the detection of innerlayer separations in plated-through holes. Includes background on the Post Separation Task Group, test results, round robin test plan, conclusions and test methods used. 51 pages...
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IPC-TR-001 - Study/Report

An Introduction to Tape Automated Bonding Fine Pitch Technology

Document #:
IPC-TR-001
Revision
Original Version
Product Type
Study/Technical Report
Released:  01/01/2006
Language
English
Current Revision
This document, co-developed by the IPC, EIA and ASTM, represents a comprehensive report on fine pitch technology with an emphasis on tape-automated bonding and design rules. Subjects include land pattern design, types of encapsulation, TAB tape format, assembly techniques and the advantages and disadvantages of FPT. 54 pages. Released by the Surface Mount Council January 1989.

IPC-TR-579 - Study/Report

Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs

Document #:
IPC-TR-579
Revision
Original Version
Product Type
Study/Technical Report
Released:  09/01/1988
Language
English
Current Revision
Approximately 200,000 plated through-holes, covering primarily electroplated but also electroless technology, were exposed to several different thermal cycles. A number of PTH diameters, board constructions and plating thicknesses were evaluated. 80 pages. Released September 1988.
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IPC-TR-549 - Study/Report

Measles in Printed Wiring Boards

Document #:
IPC-TR-549
Revision
Original Version
Product Type
Study/Technical Report
Released:  12/02/2014
Language
English
Current Revision
An IPC Blue Ribbon Committee originally published this study. It provides extensive background and test results resolving methods to identify visible conditions such as measles in PWBs and that measles do not impact reliability. 81 Pages. Released November 1973.
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IPC-WP-024 - White Paper

IPC 智能织物结构的可靠性和可洗性白皮书——为市场做好准备

Document #:
IPC-WP-024
Revision
Original Version
Product Type
White Paper
Released:  04/16/2019
Language
Chinese
Current Revision
IPC-WP-024是一份白皮书，讨论了多次洗涤循环后智能织物（电子织物结构）可靠性相关的问题，并强调了工业和研究实验室必须做出的努力。以使电子织物结构更加坚固，能够像市场上的日常织物（例如，内衣、服装、家用织物和技术织物）一样被清洁或洗涤。 研究人员在商用洗衣机和家用洗衣机洗涤剂多次洗涤循环后，为电子织物提供实验室测试的初始可靠性结论。
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Coming Soon

IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

IPC-2294: Design Standard for Printed Electronics on Rigid Substrates

IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates

J-STD-005B: Requirements for Soldering Pastes

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards

J-STD-609C: Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

J-STD-004D: Requirements for Soldering Fluxes

IPC-4413: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards

IPC-HERMES-9852 Version 1.6: The Global Standard for Machine-to-Machine Communication in SMT Assembly