Menu
Close
Contact IPC

Technical Reports & White Papers

Your results

Document #

Language

Products

no-image-available

IPC-WP-023 - White Paper

IPC Technology Solutions White Paper on Performance-Based Printed Board OEM Acceptance: The Hidden Reliability Threat

Document #:
IPC-WP-023
Revision
Original Version
Product Type
White Paper
Released:  05/01/2018
Language
English
Current Revision
IPC-WP-023 is an IPC Technology Solutions White Paper addressing reliability issues associated with stacked microvias. There is evidence that staggering vias can result in a more robust structure; however, staggering microvias is only a temporary solution to accommodate complex designs with microvias built with weak interface structures IPC-WP-023 white paper provides an investigation of these...

IPC-WP-026 - White Paper

IPC Technology Solutions White Paper on Blockchain and the Electronics Industry: A Review of the Current State of Blockchain Technology and Its Potential Applications in Electronics Manufacturing

Document #:
IPC-WP-026
Revision
Original Version
Product Type
White Paper
Released:  12/05/2019
Language
English
Current Revision
The IPC-WP-026 white paper explores blockchain as an emerging technology that has a core strength in providing an immutable, auditable, transparent and secure environment for data exchanges. These advantages make it a prime candidate for implementation in the electronics industry. The IPC-WP-026 white paper explores blockchain and its limitations and challenges. It also provides a few directions...
no-image-available

IPC/PERM-WP-022 - White Paper

Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow - Results of an Industry Round-Robin - Final Report

Document #:
IPC/PERM-WP-022
Revision
Original Version
Product Type
White Paper
Released:  09/05/2018
Language
English
Current Revision
Manufacturers of high reliability electronics have been working for many years to mitigate the deleterious effects of tin whisker formation. One highly effective means to suppress the growth of tin whiskers is to replace the pure tin plating with reflowed tin-lead solder. One approach is to fully consume the tin plating by tin-lead solder during the SMT reflow process. This phenomenon of tin...
no-image-available

IPC-EMB - White Paper

Embedded Capacitor Technology; Status, Opportunity and Challenges

Document #:
IPC-EMB
Revision
Original Version
Product Type
White Paper
Released:  01/25/2012
Language
English
Current Revision
"Embedded Capacitor Technology; Status, Opportunity and Challenges" was presented by John Andresakis, vice president of strategic technology, Oak-Mitsui at the IPC Conference for the PCB Industry: Critical Issues for the Military Market, Washington D.C., in December 2011.The author explains how the use of this technology improves the performance, reliability and assembly cost of printed boards and...
1-4 of 4

Coming Soon

IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

IPC-2294: Design Standard for Printed Electronics on Rigid Substrates

IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates

J-STD-005B: Requirements for Soldering Pastes

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards

J-STD-609C: Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

J-STD-004D: Requirements for Soldering Fluxes

IPC-4413: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards

IPC-HERMES-9852 Version 1.6: The Global Standard for Machine-to-Machine Communication in SMT Assembly