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IPC-WP-023 - White Paper

IPC Technology Solutions White Paper on Performance-Based Printed Board OEM Acceptance: The Hidden Reliability Threat

Document #:
IPC-WP-023
Revision
Original Version
Product Type
White Paper
Released:  05/01/2018
Language
English
Current Revision
IPC-WP-023 is an IPC Technology Solutions White Paper addressing reliability issues associated with stacked microvias. There is evidence that staggering vias can result in a more robust structure; however, staggering microvias is only a temporary solution to accommodate complex designs with microvias built with weak interface structures IPC-WP-023 white paper provides an investigation of these...
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IPC/PERM-WP-022 - White Paper

Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow - Results of an Industry Round-Robin - Final Report

Document #:
IPC/PERM-WP-022
Revision
Original Version
Product Type
White Paper
Released:  09/05/2018
Language
English
Current Revision
Manufacturers of high reliability electronics have been working for many years to mitigate the deleterious effects of tin whisker formation. One highly effective means to suppress the growth of tin whiskers is to replace the pure tin plating with reflowed tin-lead solder. One approach is to fully consume the tin plating by tin-lead solder during the SMT reflow process. This phenomenon of tin...
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IPC-WP-003 - White Paper

Chip Mounting Technology

Document #:
IPC-WP-003
Revision
Original Version
Product Type
White Paper
Released:  08/01/1993
Language
English
Current Revision
Status of the technology discussion on the various methodologies for mounting and interconnecting active devices to a variety of substrate materials is summarized in this document. Reviews mounting techniques of tape automated bonding (TAB), chip on board (COB) and flip chip. Examinations of the most commonly used substrate options of laminate, ceramic and silicon are also reviewed. Editor: John...

IPC-WP-009 - White Paper

A Summary of Tin Whisker Research References

Document #:
IPC-WP-009
Revision
Original Version
Product Type
White Paper
Released:  05/14/2009
Language
English
Current Revision
As most of the world converts to lead-free manufacturing, the concern over tin whiskers as a reliability hazard has grown due to the emergence of pure tin as a dominate component surface finish. A significant amount of research on tin whisker formation and tin whisker mitigating strategies has been performed in both commercial and defense industries. This working paper is a summary of the...
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IPC-582 - Study/Report

Cleaning & Cleanliness Test Program for Phase 3-Low Solids Fluxes & Pastes Processed in Ambiant Air

Document #:
IPC-TR-582
Revision
Original Version
Product Type
Study/Technical Report
Released:  10/02/2018
Language
English
Current Revision
This document details the test procedures, test results and team conclusions for the IPC Cleaning and Cleanliness Testing Program, Phase 3, Low Solids Flux in Ambient Air. This effort has been part of a multi-stage program to investigate material and process alternatives to the use of chlorofluorocarbons (CFCs) in electronics manufacturing. This Phase 3 effort has been dedicated to characterizing...

IPC-TR-583 - Study/Report

An In-Depth Look At Ionic Cleanliness Testing

Document #:
IPC-TR-583
Revision
Original Version
Product Type
Study/Technical Report
Released:  07/01/2002
Language
English
Current Revision
This original research was a cooperative effort between the EMPF and IPC, released as EMPF-RR-0013 in 1993 for better understanding of ionic cleanliness testing. The IPC Ionic Conductivity/Ion Chromatography Test Task Group has validated its continued importance and relevance to the cleaning community and IPC-TR-583 is the result. It includes how solvent temperature influences the final...

IPC-TR-585 - Study/Report

Time, Temperature and Humidity Stress of Final Board Finish Solderability

Document #:
IPC-TR-585
Revision
Original Version
Product Type
Study/Technical Report
Released:  05/01/2006
Language
English
Current Revision
This Technical Report details the investigations into identifying stress tests that distinguish between robust and non-robust surface finishes. A robust finish will pass a test for solderability whereas a non-robust finish will fail. The stress tests identified do not necessarily duplicate real world environment (fabrication of the bare printed board through assembly), but they must correlate to...
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IPC-TR-001 - Study/Report

An Introduction to Tape Automated Bonding Fine Pitch Technology

Document #:
IPC-TR-001
Revision
Original Version
Product Type
Study/Technical Report
Released:  01/01/2006
Language
English
Current Revision
This document, co-developed by the IPC, EIA and ASTM, represents a comprehensive report on fine pitch technology with an emphasis on tape-automated bonding and design rules. Subjects include land pattern design, types of encapsulation, TAB tape format, assembly techniques and the advantages and disadvantages of FPT. 54 pages. Released by the Surface Mount Council January 1989.

IPC-WP-008 - White Paper

Setting Up Ion Chromatography Capability

Document #:
IPC-WP-008
Revision
Original Version
Product Type
White Paper
Released:  12/01/2005
Language
English
Ion chromatography has been recognized as a method for which the data output is ion specific and very precise in the quantification of ionic residues. This paper is intended for those contemplating the setup of an ion chromatography lab and provides many of the practical considerations that should be addressed, including the core components of an ion chromatograph system such as carrier solutions...
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IPC-TR-586 - Standard Only

Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

Document #:
IPC-TR-586
Revision
Original Version
Product Type
Study/Technical Report
Released:  03/01/2009
Language
English
This technical report provides the documentation of a round robin testing effort that generated data used by the 4-14 Plating Processes Subcommittee in developing the maximum immersion silver plating thickness requirement in the revision A of IPC-4553. This compendium of data resulted from three information sets: a) Test vehicle assembly report by Celestica, b) Thermal cycle test report by...
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Coming Soon

IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

IPC-2294: Design Standard for Printed Electronics on Rigid Substrates

IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards

J-STD-609C: Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-HERMES-9852 Version 1.6: The Global Standard for Machine-to-Machine Communication in SMT Assembly