Your results
Document #
Language
Products
IPC-WP-024 is a white paper which discusses the issues associated with reliability of smart textiles (e-textiles structures) following multiple washing cycles and emphasizes efforts that industry and research laboratories must undertake to make e-textile structures more robust and able to be washed similarly to everyday textile products (e.g., underwear, clothing, home textiles and technical...
This white paper is a benchmarking exercise of e-textile integrations, providing an introductory categorization of how the current market sector is using textile-based electrical components to achieve integrated functionality. This peer assessment provides a baseline understanding of e-textile process techniques, requirements and resources within this emerging sector.
Manufacturers of high reliability electronics have been working for many years to mitigate the deleterious effects of tin whisker formation. One highly effective means to suppress the growth of tin whiskers is to replace the pure tin plating with reflowed tin-lead solder. One approach is to fully consume the tin plating by tin-lead solder during the SMT reflow process. This phenomenon of tin...
This technical paper covers the testing and evaluation of polymeric conformal coatings for moisture and insulation resistance (MIR) and dielectric withstanding voltage (DWV). This effort was initiated by the IPC Conformal Coating Task Group to support technical decisions for IPC coating specification CC-830 as part of the Revision C process. MIR testing was done per a modified method of IPC-TM-650...
This document details the test procedures, test results and team conclusions for the IPC Cleaning and Cleanliness Testing Program, Phase 3, Low Solids Flux in Ambient Air. This effort has been part of a multi-stage program to investigate material and process alternatives to the use of chlorofluorocarbons (CFCs) in electronics manufacturing. This Phase 3 effort has been dedicated to characterizing...
This original research was a cooperative effort between the EMPF and IPC, released as EMPF-RR-0013 in 1993 for better understanding of ionic cleanliness testing. The IPC Ionic Conductivity/Ion Chromatography Test Task Group has validated its continued importance and relevance to the cleaning community and IPC-TR-583 is the result. It includes how solvent temperature influences the final...
Coming Soon
IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards