Products
Addresses the complete process of reengineering new product development processes to incorporate DFX methodologies. Presents the case for a comprehensive analysis of the key business issues and definition of requirements before initiating work to refine or restructure processes. Editor, Dieter Bergman, IPC. 88 pages. Released by the Surface Mount Council, April 1997.
Coming Soon
IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
J-STD-005B: Requirements for Soldering Pastes
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards
J-STD-004D: Requirements for Soldering Fluxes
IPC-4413: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards