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Pb-free materials are considered a major technology disruption to traditional Pb-based interconnect materials for electronics, which is of particular concern for the aerospace, defense, and high performance products (ADHP) industries where safety cannot be compromised and applicable reliability data remains scarce. Until validated data and modelling methods are developed, projects considering Pb...
Ion chromatography has been recognized as a method for which the data output is ion specific and very precise in the quantification of ionic residues. This paper is intended for those contemplating the setup of an ion chromatography lab and provides many of the practical considerations that should be addressed, including the core components of an ion chromatograph system such as carrier solutions...
This technical report provides the documentation of a round robin testing effort that generated data used by the 4-14 Plating Processes Subcommittee in developing the maximum immersion silver plating thickness requirement in the revision A of IPC-4553. This compendium of data resulted from three information sets: a) Test vehicle assembly report by Celestica, b) Thermal cycle test report by...
This technical report was developed to meet the growing need for a standard method of evaluating the solderability retention capability of printed boards during inventory storage. 21 Pages. Released April 1984. IPC-TR-464 Addendum The addendum to IPC-TR-464 represents the results of the task group study to evaluate and determine if the aging period recommended in the original Technical Report...
Coming Soon
IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
J-STD-005B: Requirements for Soldering Pastes
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards
J-STD-004D: Requirements for Soldering Fluxes
IPC-4413: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards