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IPC-2221C: Generic Standard on Printed Board Design

J-STD-001J: Requirements for Soldered Electrical and Electronic Assemblies

IPC-A-610J: Acceptability of Electronic Assemblies

IPC-4922: Requirements for Sintering Materials for Electronics Assembly

J-STD-005B: Requirements for Soldering Pastes

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-4105: Speciﬁcation for Metal Base Copper Clad laminates for Rigid Printed Boards

IPC-4562B: Metal Foil for Printed Board Applications

J-STD-609C: Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes

IPC-7711/21D: Rework, Modification and Repair of Electronic Assemblies

J-STD-004D: Requirements for Soldering Fluxes