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Document #:
Revision
Original Version
Product Type
Released:  10/02/2018
Language
English
Current Revision
This document details the test procedures, test results and team conclusions for the IPC Cleaning and Cleanliness Testing Program, Phase 3, Low Solids Flux in Ambient Air. This effort has been part of a multi-stage program to investigate material and process alternatives to the use of chlorofluorocarbons (CFCs) in electronics manufacturing. This Phase 3 effort has been dedicated to characterizing...
Document #:
Revision
Original Version
Product Type
Released:  07/01/2002
Language
English
Current Revision
This original research was a cooperative effort between the EMPF and IPC, released as EMPF-RR-0013 in 1993 for better understanding of ionic cleanliness testing. The IPC Ionic Conductivity/Ion Chromatography Test Task Group has validated its continued importance and relevance to the cleaning community and IPC-TR-583 is the result. It includes how solvent temperature influences the final...
Document #:
Revision
Original Version
Product Type
Released:  07/01/2001
Language
English
Current Revision
This technical report provides full detail of the round robin study charged with assessing the use of Interconnect Stress Test (IST) as a test for incoming inspection in lieu of Thermal Stress in the detection of innerlayer separations in plated-through holes. Includes background on the Post Separation Task Group, test results, round robin test plan, conclusions and test methods used. 51 pages...
Document #:
Revision
Original Version
Product Type
Released:  01/01/2006
Language
English
Current Revision
This document, co-developed by the IPC, EIA and ASTM, represents a comprehensive report on fine pitch technology with an emphasis on tape-automated bonding and design rules. Subjects include land pattern design, types of encapsulation, TAB tape format, assembly techniques and the advantages and disadvantages of FPT. 54 pages. Released by the Surface Mount Council January 1989.
Document #:
Revision
Original Version
Product Type
Released:  09/01/1988
Language
English
Current Revision
Approximately 200,000 plated through-holes, covering primarily electroplated but also electroless technology, were exposed to several different thermal cycles. A number of PTH diameters, board constructions and plating thicknesses were evaluated. 80 pages. Released September 1988.

IPC-TR-549 - Study/Report

Measles in Printed Wiring Boards

Document #:
Revision
Original Version
Product Type
Released:  12/02/2014
Language
English
Current Revision
An IPC Blue Ribbon Committee originally published this study. It provides extensive background and test results resolving methods to identify visible conditions such as measles in PWBs and that measles do not impact reliability. 81 Pages. Released November 1973.