The IPC-WP-114A white paper provides guidance to reduce and control exposure to environmental conditions and contamination that promote the development of White Plague. A template for developing a White Plague Control Plan (WPCP) is included.
Products
The IPC-WP-116A white paper provides guidance to control and mitigate risks associated with the introduction of Foreign Object Debris (FOD) in electrical and electronic assemblies. Guidance to control and mitigate risks associated with the introduction of Foreign Object Debris (FOD) in electrical and electronic assemblies is provided. A template for developing a Foreign Object Debris (FOD) Control...
The IPC-WP-113A white paper provides guidance to reduce and control exposure to environmental conditions and contamination that promote the development of Red Plague. A template for developing a Red Plague Control Plan (RPCP) is included.
Due to a concern in the electronic packaging industry about solderability problems, Foster Gray, PC Interconnects, developed this document for the Surface Mount Council. Areas covered are: design for the soldering process; solderable PWBs; solderable components and soldering process. Five different industry perspectives provide analysis of these issues. 35 pages. Released August 1991.
IPC-WP-023 is an IPC Technology Solutions White Paper addressing reliability issues associated with stacked microvias. There is evidence that staggering vias can result in a more robust structure; however, staggering microvias is only a temporary solution to accommodate complex designs with microvias built with weak interface structures IPC-WP-023 white paper provides an investigation of these...
Manufacturers of high reliability electronics have been working for many years to mitigate the deleterious effects of tin whisker formation. One highly effective means to suppress the growth of tin whiskers is to replace the pure tin plating with reflowed tin-lead solder. One approach is to fully consume the tin plating by tin-lead solder during the SMT reflow process. This phenomenon of tin...
Status of the technology discussion on the various methodologies for mounting and interconnecting active devices to a variety of substrate materials is summarized in this document. Reviews mounting techniques of tape automated bonding (TAB), chip on board (COB) and flip chip. Examinations of the most commonly used substrate options of laminate, ceramic and silicon are also reviewed. Editor: John...
The problem of counterfeit components continues to escalate. It is no longer limited to high value items like semiconductors. It can include connectors, resistors, passive components or anything that is in demand. What more could you be doing to ensure that the components you purchase are genuine? What can you do about component traceability? Jack Stradley, Manager, Business Development &...
Guidance to control and mitigate risks associated with the introduction of Foreign Object Debris (FOD) in electrical and electronic assemblies is provided. A template for developing a Foreign Object Debris (FOD) Control Plan is included.
Guidance to reduce and control exposure to environmental conditions and contamination that promote the development of White Plague is provided in this document. A template for developing a White Plague Control Plan (WPCP) is included.
Guidance to reduce and control exposure to environmental conditions and contamination that promote the development of Red Plague is provided in this document. A template for developing a Red Plague Control Plan (RPCP) is included.
Coming Soon
IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
J-STD-005B: Requirements for Soldering Pastes
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards
J-STD-004D: Requirements for Soldering Fluxes
IPC-4413: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards