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This document addresses preconditioning of non-IC components used in electronic assembly. Will the components work with your process? The goal of these manufacturing process simulations is to ensure that the components chosen meet expected reliability requirements after exposure to factory processes. Developed for users and manufacturers, the procedure consists of a set of simulations for non-IC...
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IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards