IPC-FINFIN - White Paper
Final Finish for Connectivity
"Final Finish for Connectivity" was presented by George Milad of Uyemura International Corporation at the IPC Conference for the PCB Industry: Critical Issues for the Military Market, in December 2011. The author describes surface finishes applied to printed circuit boards to enhance their reliability, solderability, shelf life and the applicability to wire bonding. He also mentions the IPC standards where they apply to the materials. This presentation includes the synchronized slides and audio. 24 minutes. Released 2012.