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If not completely characterized, many of the early lead-free alloys’ reliability properties are better understood than those of the new alloys being introduced today. Therefore, it can be quite difficult to compare alloy properties. The lack of reliability characterization of new materials introduces uncertainty for the user. To address this problem, the IPC Solder Products Value Council (IPC SPVC...
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IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
J-STD-005B: Requirements for Soldering Pastes
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards
J-STD-004D: Requirements for Soldering Fluxes
IPC-4413: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards