Your results
- 2
Language
Products
This addendum to IPC-TR-464 was released in April 1987 and represents the results of the task group study to evaluate and determine if the aging period recommended in the original Technical Report could be shortened and still provide the appropriate information on solderability retention.
This technical report was developed to meet the growing need for a standard method of evaluating the solderability retention capability of printed boards during inventory storage. 21 Pages. Released April 1984. IPC-TR-464 Addendum The addendum to IPC-TR-464 represents the results of the task group study to evaluate and determine if the aging period recommended in the original Technical Report...
Coming Soon
IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
J-STD-005B: Requirements for Soldering Pastes
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards
J-STD-004D: Requirements for Soldering Fluxes
IPC-4413: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards