Standard with amendment(s)

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Document #:

IPC-7095

Revision

Product Type

Standard with amendment(s)

Released: 07/09/2019

Language

English

Current Revision

The IPC-7095D-AM1 standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095D-AM1 provides the useful and practical information to those who use or are considering using BGAs. IPC-7095D-AM1 provides...

Document #:

IPC-4101

Revision

Product Type

Standard with amendment(s)

Released: 04/14/2020

Language

English

Current Revision

IPC-4101E-WAM1 covers the requirements for base materials that are referred to as laminate or prepreg and listed in the specification sheets which are found after the main body of the standard. The specification sheets are to be used primarily for rigid and multilayer printed boards for electronic interconnections. The IPC-4101E-WAM1 standard contains 70 individual specification sheets that can be...

Document #:

IPC-4101

Revision

Product Type

Standard with amendment(s)

Released: 05/12/2014

Language

English

IPC-4101D-WAM1 covers the requirements for base materials that are referred to as laminate or prepreg. These are to be used primarily for rigid and multilayer printed boards for electrical and electronic circuits. This document contains 65 individual specification sheets that can be searched using keywords. These keywords allow the document's user to find materials of a similar nature, but with...

Document #:

IPC-4562

Revision

Product Type

Standard with amendment(s)

Released: 01/01/2016

Language

English

IPC-4562A-WAM1 covers metal foils supported by carrier films and unsupported foils suitable for subsequent use in printed boards. The Amendment 1 that has been inserted into the base document added back the light cold rolled-wrought copper foil (/6 [Cu-W6] that was previously removed during the revision A actions. Unless otherwise agreed upon between the user and supplier (AABUS), metal foils...

Document #:

IPC-4103

Revision

Product Type

Standard with amendment(s)

Released: 03/25/2014

Language

English

This specification covers the requirements for clad and unclad plastic laminate and bonding layer materials to be used for the fabrication of printed boards for microstrip, stripline, and high speed digital electrical and electronic circuits. In addition to updated testing parameters, inspection lot requirements, revised visual acceptance criteria, this revision incorporates a new specification...

Document #:

IPC-7095

Revision

Product Type

Standard with amendment(s)

Released: 09/19/2019

Language

Chinese

Current Revision

IPC-7095D在设计，组装，检查和维修过程中实施球栅阵列（BGA）和细节距球栅阵列（FBGA）技术提出了了一些独特的挑战。它为使用或正在考虑使用BGA的用户提供有用和实用的信息。它还介绍了如何使用BGA成功实现印刷电路板组件的稳健设计和装配流程，以及解决BGA组装过程中可能出现的一些常见异常的方法。由于焊球中合金，焊球形状，封装程序等的改变，许多问题变得尤为重要。D版主要重点是为组装后出现的一些新的机械失效问题如坑裂或层压缺陷提供信息。除了提供BGA检查和维修的指引外，本标准还解决了与BGA相关的可靠性问题和无铅焊点的使用标准。该标准中有许多X射线和内窥镜的照片和插图以确认行业中BGA组装工艺的实施中的遇到的一些情况。

Document #:

IPC-7095

Revision

Product Type

Standard with amendment(s)

Released: 06/17/2020

Language

Japanese

Current Revision

IPC-7095D-AM1は、ボールグリッドアレイ(BGA)およびファインピッチBGA(FBGA)技術の設計および組立の実施について記述するものであり、これらのパッケージを使用したプリント基板の設計と組立に関連する検査、リペアおよび信頼性の問題に焦点を当てている。 IPC-7095D-AM1は、BGAを使用している、もしくは使用を検討している本書読者に対し、有用で実用的な情報を提供するものである。またIPC-7095D-AM1では、BGAを使用するプリント基板組立のためのロバスト設計と組立プロセスの正しい方法について説明するとともに、BGAの組立中に発生する可能性のある一般的な異常について、トラブルシューティングの方法を説明している。