简要介绍 （英文） 本标准规定了高质量焊接互连用助焊剂的分类和特性描述的通用要求。本标准可用于助焊剂的质量控制和采购用途。本标准的目的是对印制电路板组件中电子装联所用的锡/铅和无铅焊接助焊剂材料进行分类和描述。这些焊接助焊剂材料包括：液态助焊剂、膏状助焊剂、焊膏、外涂助焊剂以及含助焊剂芯的焊丝和预成形焊料。本标准无意排除任何可接受的助焊剂或焊接辅助材料；但是，这些材料必须能够形成所期望的电气和电子装联。共20页。2008年12月发布。2011年11月发布修订本1。2012年8月翻译。
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本手册包括了维修和返工电子组件及印制板所需的一切。《IPC-7711/7721B电子组件的返工、修改和维修》收录了一整套经修订的程序，以确保其即适用于无铅电子组件，又适用于传统的有铅电子组件。B版包括了之前发布的修订变化及几项新的BGA维修及返工程序（包括重新植球）及挠性印制电路的维修。第一部分--通用程序也进行了更新，更易使用，并对所有的程序提供了重要的基本信息和指南。第一部分包括了返工、维修和修改的通用程序。第二部分是IPC-7711B，其中的程序包括拆除和替换表面贴装元器件及通孔元器件时所采用的工具、材料及方法。第三部分是IPC-7721B，其中包括修改组件和维修层压板、导体时所采用的程序。本手册采用活页夹装订，易于更新。用户可将公司内部的特殊程序插入其中，或拆下某一项具体工作所需的单页放在工作台面上，保持工作区域整洁。B版本所做的一些修订可从IPC网站（www.ipc.org...
Umfangreiche Aktualisierung zur Bleifrei-Unterstützung und erweiterte Inspektionsrichtlinie für Reparaturen und Änderungen Diese Richtlinie beinhaltet alles was für die Reparatur und Nacharbeit von elektronischen Baugruppen und Leiterplatten benötigt wird. Die IPC-7711B/7721B, Nacharbeit, Änderung und Reparatur von elektronischen Baugruppen wurde in allen Verfahren aktualisiert und ist anwendbar...
简要介绍 （英文） 本标准列出了焊膏鉴定、特征描述的要求。本标准参考了有关金属含量、粘度、塌落、焊料球、粘附力、润湿等的测试方法及标准。IPC-HDBK-005 焊膏评估指南（不包含在本标准的购买中）提供了更多的支持。取代J-STD-005。共10页。于2012年2月发布。
简要介绍 英文） 本文件的目的是，针对潮湿/再流焊敏感表面贴装器件，向生产商和用户提供标准的操作、包装、运输及使用方法。所提供的这些方法可避免由于吸收湿气和暴露在再流焊温度下造成的封装损伤，这些损伤会导致合格率和可靠性的降低。一旦正确执行，这些工艺可以提供从密封时间算起12个月的最短保质期。由IPC和JEDEC开发。共18页。2012年2月出版。2013年8月翻译。
Die Revision B stellt die einzige, von der Industrie anerkannte Richtlinie für die Anforderungen und die Akzeptanz von Kabeln und Kabelbaum-Baugruppen dar. IPC und die Wire Harness Manufacturers Association (WHMA) haben ihre Zusammenarbeit fortgesetzt, um diese maßgebliche Aktualisierung zu erstellen. NEU! Diese Revision enthält stark erweiterte Kriterien für das Spritzgießen, das Vergießen, das...
J-STD-003C规定了用于评估印制板表面导体、连接盘和镀覆孔可焊性的测试方法和缺陷定义，并附有相关的图表。本标准适用于供应商和用户。本标准所规定的可焊性测试方法的目标是确定印制板表面导体、连接盘及镀覆孔被焊料润湿的难易程度和经受苛刻的印制板组装工艺的能力。描述了评定表面导体、连接盘和镀覆孔可焊性所采用的测试方法。C版本包含了可焊性量具可再现性和可重复性的最新信息，同时更新了插图 修订本1纠正了编辑错误并在文档许多地方增加了澄清声明。全文共27页，2014年发布。2015年11月
개정 B는 케이블과 와이어 하네스 어셈블리들의 요건들과 허용에 대한 업계-합의 표준으로만 남는다. IPC 및 와이어 하네스 제조자들 협회(WHMA)는 작업을 함께 계속하여, 이러한 의미 있는 최신사항들을 개발하였다. 새로운 사항들! 이것들은 몰딩(molding), 포팅(potting), 스플라이싱(splicing), 절연 보강(insulation support)이 없는 크림프 접촉부들, 인-라인 절연변위(inline insulation displacement) 커넥터들, 커넥터 형태로 변환(connectorization), 경성(rigid) 및 컨포머블 케이블(conformable cable), 연성(flexible) 슬리빙, 빗자루형 스티칭(broom stitching), 테스팅, 등에 대한 크게 확대된...
수리 및 수정들에 대한 무연 제품 지원과 향상된 검사 지침에 대한 주요 업데이트! 이 안내 문서는 전자 어셈블리와 PCB의 수리 및 리웍을 위한 모든 것을 포함한다! IPC-7711B /7721B의 전자 어셈블리의 리웍, 수정 및 수리는 절차적인 업데이트에 의한, 하나의 완전한 절차를 통해 무연 솔더와 전통적인 일반 솔더(SnPb)로 솔더링된 어셈블리 모두에 대해 적용 가능성을 보장하였다. 이 단일의 책은 BGAs (reballing을 포함하여) 및 flex-print 수리에 대한 이전에 발간된 변경사항과 몇 개의 새로운 절차를 포함한다. Part 1은 일반적인 요건들로서, 사용의 편의를 위해 업데이트되어 중요한 방향과 모든 절차에 대한 지침을 제공하였다. 이 섹션은 리웍, 수리 및 수정 등에 공통적인...
简要介绍 （英文） 本文件阐述了应用于电子焊接领域的电子级焊料合金、含助焊剂与不含助焊剂的棒状、带状、粉末状焊料及专用电子级焊料的命名原则、要求及测试方法。本文件是一个质量控制文件，无意直接关联制造工艺中材料的性能。对于应用于非电子领域的焊料，应该按照ASTM B-32的规定进行采购。 本文件是三项联合工业标准之一，这三项联合工业标准阐述了电子工业所用焊接材料的要求和测试方法。其它两份标准是：IPC/EIA J-STD-004 助焊剂要求；IPC/EIA J-STD-005 焊膏要求。全文共29页，2009年10月正式发布英文版； J-STD-006B附修订本1和2（2011年8月出版中文版）修改了以下内容： 1. 增加引用文件IPC/JEDEC J-STD-609《元器件、印制电路板和印制电路板组件的有铅、无铅及其它属性的标记和标签》。 2. 阐明指定为无铅合金的意思。 3...
Amendment 1 to IPC/WHMA-A-620B This amendment provides resolution to some internal conflicts, aligns common criteria to other IPC standards, and corrects some editorial errors. This amendment is only to be used in conjunction with IPC/WHMA-A-620 Revision B, October 2012. Follow your company policy and procedures to make pen and ink changes or notations to the published IPC/WHMA-A-620 Revision B...
对于线缆和线束组件的要求和验收，B版本是唯一的、行业一致认可的标准。IPC和导线线束制造商协会（WHMA）将继续合作推进这一重要的更新。 更新！标准更新内容包括: 压模、注模、衔接、没有绝缘支撑的连接器压接、绝缘穿刺连接、连接器连接、刚和柔性线缆、柔性套管、扫帚型固定、测试……。 新标准有682幅全彩插图，125幅插图做了修订。备线、端子焊接、机制和冲压成型端子的压接、绝缘穿刺连接器、超声熔接、衔接、连接器、压模、标记、同轴/双轴线缆、缠绕/连扎、屏蔽、装配及导线绕接，包括在19个章节中。
This is the Chinese language translation of IPC-WHMA-A-620A Includes testing requirements and lead free acceptance criteria. IPC/WHMA A-620 is the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies. IPC and the Wire Harness Manufacturers Association teamed to develop this significant update, adding lead free acceptance criteria, a new chapter...
This is the Chinese language version of J-STD-004A. Revision A covers requirements for qualification and classification of rosin, resin, organic and inorganic fluxes according to the activity level and halide content of the fluxes. It includes solder fluxes, flux-containing materials and low residue fluxes for no-clean processes. Associated test methods may have been updated and are available...
This is the Japanese language version of J-STD-004A. Revision A covers requirements for qualification and classification of rosin, resin, organic and inorganic fluxes according to the activity level and halide content of the fluxes. It includes solder fluxes, flux-containing materials and low residue fluxes for no-clean processes. Associated test methods may have been updated and are available...
This is the Chinese Language version of J-STD-002C. This standard prescribes test methods, defect definitions, acceptance criteria and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs and tabs. This standard addresses both visual acceptance and force measurement solderability criteria for both tin-lead as well as lead-free...
This is the Chinese language version of J-STD-003B. This standard prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes utilizing either tin/lead or lead-free solders. This standard is intended for use by both vendor and user. The objective of the solderability test methods...
IPC-7711B/7721B Wprowadzanie Poprawek, Modyfikacja i Naprawa Zespołów Elektronicznych zawiera zbiór zaktualizowanych procedur w celu zapewnienia właściwego stosowania zarówno do połączeń bezołowiowych jak tradycyjnych pakietów lutowanych spoiwem SnPb. Dokument ten zawiera wszystkie opublikowane wcześniej zmiany i kilka nowych procedur dotyczących elementów BGA (wliczając reballing) oraz naprawy...
This is the Japanese language version of J-STD-006B. This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering applications; and for ''special'' electronic grade solders. This is a quality control standard and is not intended to relate directly to the material's...
This is the Polish language translation of IPC-WHMA-A-620A Includes testing requirements and lead free acceptance criteria. IPC WHMA A620 is the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies. IPC and the Wire Harness Manufacturers Association (WHMA) teamed to develop this significant update, adding lead free acceptance criteria, a new chapter...
Amendment 1 to IPC/WHMA-A-620B This amendment provides resolution to some internal conflicts, aligns common criteria to other IPC standards, and corrects some editorial errors. This amendment is only to be used in conjunction with IPC/WHMA-A-620 Revision B, October 2012. Follow your company policy and procedures to make pen and ink changes or notations to the published IPC/WHMA-A-620 Revision B...
This is the Polish language version of IPC-7711/21A. IPC-7711A, Rework of Electronic Assemblies (with Change 1) and IPC-7721A, Repair and Modification of Printed Boards and Electronic Assemblies (with Changes 1 and 2) now includes additional support for BGAs and flex-print repair. IPC-7711A includes procedural requirements, tools, materials and methods to be used in removing and replacing...
Rewizja B jest standardem stosowanym w przemyśle dotyczącym Wymagań i Akceptacji dla Montażu Kabli i Wiązek Przewodów. IPC i Stowarzyszenie Producentów Wiązek Przewodów (WHMA) pracowało razem w celu zaktualizowania niniejszego standard. NOWOŚĆ! Zawiera rozbudowane kryteria dla wtryskiwania, zalewania, splotów, połączeń zagniatanych, połączeń przewodów izolowanych, montażu złącza, sztywnych i...
This is the Spanish language translation of IPC-WHMA-A-620A Includes testing requirements and lead free acceptance criteria. IPC/WHMA A-620 is the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies. IPC and the Wire Harness Manufacturers Association teamed to develop this significant update, adding lead free acceptance criteria, a new chapter...
This is the Spanish language translation of IPC-7711B/7721B IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure applicability to both lead free and traditional SnPb soldered assemblies. This single volume includes all previously published changes and several new procedures for BGAs (including reballing) and flex...
Coming Soon
IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards