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Document #:

IPC-9203

Revision

Product Type

Standard Only

Released: 01/02/2024

Language

Japanese

Current Revision

材料の適合性を検証するにあたり、業界では種々のテストビークルが存在し活用されている。IPC-B-52試験基板は実生産で用いられる材料と工程を具体的に表現したものであり、イオンクロマトグラフと表面絶縁抵抗(SIR)の両試験のニーズを満たすテストビークルである。IPC-9203Aに示す規格はIPC-B-52テストビークルに対応し、製造工程の評価や、選択した製造材料セットと工程が清浄度の観点から適合しているという客観的証拠を提供する場合に利用できる。またIPC-9203Aに示すユーザーガイドラインはIPC-9202の手引き文書として作成されており、製造者が材料と工程の適合性を実証する場合の規定「～することが望ましい」と「～すること(する必要がある)」という点について明確に提示している。

Document #:

IPC-9202

Revision

Product Type

Standard Only

Released: 09/22/2023

Language

Japanese

Current Revision

概説本書、IPC-9202A「材料・工程の特性評価/認定試験の方法」は、プリント回路組立品(PCA)の代表的なサンプル上の表面絶縁抵抗(SIR)の変化を記録するものである。この試験は、はんだ付後に外層に残るはんだ由来のフラックスまたはその他の工程残さが原因で不要な電気化学的反応を引き起こし、信頼性に重大な影響を及ぼす可能性について定量化するものである。この試験では、実際の生産工程において電子回路の代表的なものとなるような基板をテストビークルとして使用する。これは、定量的かつ定性的なデータの両方を得ることができる試験である。 IPC-9202Aに紹介する試験は、提案された製造工程や工程変更を用いた場合に、生産するハードウェア(製品)の最終的な性能が電気化学的リスクに対し許容可能であるということを示すための「工程認定」用として使用することができる。工程変更には組立工程の手順...

Document #:

IPC-6903

Revision

Product Type

Standard Only

Released: 12/18/2018

Language

Chinese

Current Revision

IPC-6903A标准提供了62个印刷电子行业设计和制造相关的术语及定义。IPC-6903A标准为全球印刷电子行业提供一个共同的语言和知识

Document #:

IPC-7525

Revision

Product Type

Standard Only

Released: 10/17/2022

Language

Japanese

Current Revision

本書は、ソルダペーストの印刷および表面実装用接着剤の塗布に用いるステンシルについて、その設計と製造に関するガイダンスを提供するものである。内容の多くはステンシル設計者、製造者、およびユーザーの経験に基づくものである。

Document #:

IPC-SM-817

Revision

Product Type

Standard Only

Released: 09/14/2022

Language

Japanese

Current Revision

本書は、実装からはんだ付工程までにおける部品固定用として、また、プリント配線板の一部として長期的に適用される誘電体接着剤に関し、その要求事項と試験方法を提供するものである。9ページ。2014年12月発行。翻訳年 <2022年7月> 目次を見る。

Document #:

IPC-9204

Revision

Product Type

Standard Only

Released: 06/18/2019

Language

Chinese

Current Revision

本指南描述了可用于评估柔性的、可拉伸的和可穿戴的应用中所采用的印刷电子器件的柔性和拉伸性能的测试。26页。2017年3月发布。2019年3月翻译.

Document #:

IPC-7525

Revision

Product Type

Standard Only

Released: 04/15/2013

Language

German

Current Revision

Dieses Dokument unterstützt Richtlinien für das Design und die Herstellung von Druckschablonen für Lotpasten und Kleber für die Oberflächenmontage für THT- und THT/SMD-Technologie. Darin eingeschlossen sind die Unterschiede zwischen bleihaltigen und bleifreien Lotpasten, Überdruckung, Doppeldruck und Stufenschablonen Designs. Enthalten sind ebenfalls Beispiele für ein Bestellformular und die...

Document #:

IPC-SM-817

Revision

Product Type

Standard Only

Released: 10/29/2015

Language

Chinese

Current Revision

涵盖了从贴装到焊接制程用于固定元器件的绝缘粘合剂的要求和测试方法并作为印制板的一部分的长期性能。共9页。2014年12月发布。2015年6月翻译。

Document #:

IPC-7525

Revision

Product Type

Standard Only

Released: 11/01/2023

Language

Chinese

Current Revision

本标准是为设计与制造焊膏及表面贴装粘合剂用模板提供指导。本文件大部分内容是基于模板设计者、制造厂商和用户的经验编写的。

Document #:

IPC-2591

Revision

1.2

Product Type

Standard Only

Released: 10/08/2020

Language

English

IPC-2591 version 1.2 (CFX) standard establishes the requirements for the omni-directional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. IPC-2591 version 1.2 (CFX) standard applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semi-automated and manual, and is applicable...

Document #:

IPC-7526

Revision

Original Version

Product Type

Standard Only

Released: 02/13/2007

Language

English

Cleaning of stencils and misprinted PCBs has taken an increasingly important role in surface mount technology. Fine and ultra-fine pitch lands, together with other advanced packages, place new demands on stencil cleaning. Paste volume is a critical issue for fine, ultra-fine, chip-scale, BGA and flip-chip components. Insufficient solder due to clogging of stencil apertures is a primary cause of...

Document #:

IPC-9202

Revision

Original Version

Product Type

Standard Only

Released: 10/20/2011

Language

English

This document provides tests that record changes in surface insulation resistance (SIR) on a representative sample of a printed circuit assembly. It quantifies any deleterious effects that might arise from solder flux or other process residues left on external surfaces after soldering, which can cause unwanted electrochemical reactions that grossly affect reliability. It uses test vehicles that...

Document #:

IPC-2591

Revision

1.3

Product Type

Standard Only

Released: 03/08/2021

Language

English

The IPC-2591v1.3 standard establishes the requirements for the omni-directional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. This standard applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semi-automated and manual, and is applicable to related mechanical assembly...

Document #:

IPC-9203

Revision

Original Version

Product Type

Standard Only

Released: 04/27/2012

Language

English

While there are a variety of industry test vehicles for the examination of materials compatibility, most available test boards leave something to be desired as there is often a dramatic difference in materials between such test boards and produced assemblies. A test vehicle was needed which could be used for both ion chromatography and SIR testing that would be more representative of mainstream...

Document #:

IPC-2591

Revision

1.5

Product Type

Standard Only

Released: 08/04/2022

Language

English

IPC-2591, CFX standard establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. IPC-2591, CFX standard applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semiautomated and manual, and is applicable to related mechanical...

Document #:

IPC-2591

Revision

1.4

Product Type

Standard Only

Released: 01/10/2022

Language

English

IPC-2591 CFX standard establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. IPC-2591 CFX standard applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semi automated and manual, and is applicable to related mechanical...

Document #:

IPC-2591

Revision

1.6

Product Type

Standard Only

Released: 03/20/2023

Language

English

IPC-2591, Version 1.6 establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. IPC-2591, Version 1.6 applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semiautomated and manual, and is applicable to related mechanical assembly...

Document #:

IPC-2591

Revision

1.1

Product Type

Standard Only

Released: 01/20/2020

Language

English

IPC-2591 version 1.1 provides updates to several CFX messages since the original IPC-2591 version release. IPC-2591 standard establishes the requirements for the omni-directional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. IPC-2591 standard applies to communication between all executable processes in the manufacture of printed...

Document #:

IPC-2591

Revision

Original Version

Product Type

Standard Only

Released: 04/11/2019

Language

English

IPC-2591 standard establishes the requirements for the omni-directional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. The IPC-2591 standard applies to communication between all executable processes in the manufacture of printed board assemblies, automated, semi-automated and manual, and is applicable to related mechanical assembly...

Document #:

IPC/HERMES-9852

Revision

Original Version

Product Type

Standard Only

Released: 06/01/2019

Language

English

IPC-HERMES-9852 an open industry standard, developed by The Hermes Standard Initiative and approved by IPC, provides a state-of-the-art communication protocol for machine-to-machine communication between equipment units in electronics assembly lines for surface-mount technology (SMT). Thus IPC-HERMES-9852 represents a next generation standard to the technology documented in IPC-SMEMA-9851...

Document #:

IPC-1782

Revision

Original Version

Product Type

Standard Only

Released: 11/01/2016

Language

English

The lack of a uniform component traceability standard has caused an unnecessary consumption of resources (e.g., time, people, money, etc.) to track events or parts to their sources and to remedy any quality, reliability, etc., issues. Lack of a standard has also made it difficult to uniformly create and appropriately enforce the necessary contracts. This standard establishes minimum requirements...

Document #:

IPC-9709

Revision

Original Version

Product Type

Standard Only

Released: 09/13/2011

Language

English

Surface mount pad cratering typically initiates prior to detection by existing electrical monitoring test methods. There are limited instrumentation techniques that are currently available that can identify non-electrical damage and its location to a high degree of accuracy. This guideline document establishes an acoustic emission (AE) method to evaluate the performance and reliability of surface...

Document #:

IPC-1072

Revision

Original Version

Product Type

Standard Only

Released: 02/10/2016

Language

English

The purpose of this standard is to provide requirements and best practices for EMS companies to ensure protection of intellectual property for their customers. By using this standard, EMS companies can provide their customers assurance that the intellectual property built into their circuit boards is protected. The document is also a companion to IPC-1071 for printed circuit board manufacturers...

Document #:

IPC-T-50

Revision

Product Type

Standard Only

Released: 09/19/2016

Language

Chinese

本文件是电子互连行业不可或缺的术语标准。该文件图文并茂，可帮助用户及其客户克服语言上的沟通障碍。M版本包含超过220多条新术语或修订术语，包括敷形涂覆、灌封和封装工艺、模板设计、统计工艺控制和挠性印制板技术。也包括通用行业缩写词。

Document #:

IPC-T-50

Revision

Product Type

Standard Only

Released: 09/17/2009

Language

Chinese

Description in English 本文件是电子互连行业不可或缺的一份术语标准。该文件图文并茂，可帮助用户及其客户克服语言上的沟通障碍。H版本包含200多条新术语或修订术语，新术语涉及球栅阵列和芯片尺寸封装、导通孔保护、导体图形、组装工艺、基材和选择性电镀工艺等。还包括通用工业缩写词和根据技术分类排序的术语索引，以便于查找。全文276页，于 2008年7月公布。