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IPC-4202 - Revision B - Standard Only

Flexible Base Dielectrics for Use in Flexible Printed Boards

Document #:
IPC-4202
Revision
B
Product Type
Standard Only
Released:  04/20/2017
Language
English
This document provides comprehensive data to help users more easily determine both material capability and compatibility for flexible base dielectric materials for manufacture of flexible printed boards. It includes flexible base material specification sheets that have been updated with the newest properties for the specification material types. It establishes the most current classification...

IPC-T-50 - Revision M - Standard Only

Termes et Définitions pour les Circuits Électroniques Imprimés et Assemblés

Document #:
IPC-T-50
Revision
M
Product Type
Standard Only
Released:  06/30/2015
Language
French
Current Revision
Ce document essentiel pour l’industrie fournit des descriptions et des illustrations de la terminologie de l’industrie d’assemblage électronique afin d’aider les utilisateurs et leur clients à casser les barrières linguistiques. La révision M contient plus de 220 termes nouveaux ou révisés, incluant la nouvelle terminologie pour les procédés de tropicalisation, d’enrobage et d’encapsulation, la...

IPC-7095 - Revision B - Standard Only

Design and Assembly Process Implementation for BGAs

Document #:
IPC-7095
Revision
B
Product Type
Standard Only
Released:  04/02/2008
Language
English
Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7095B delivers useful and practical information to anyone currently using BGAs or considering a conversion to area array packaging formats. This has become especially important due to the change in the alloys being used, both...
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IPC-7095 - Revision A - Standard Only

Design and Assembly Process Implementation for BGAs

Document #:
IPC-7095
Revision
A
Product Type
Standard Only
Released:  10/01/2004
Language
English
Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. Revision A of this document delivers useful and practical information to anyone who is currently using BGAs or is considering a conversion to area array packaging formats. In addition to providing guidelines for BGA inspection...

IPC-4203 - Revision A - Standard Only

Cover and Bonding Material for Flexible Printed Circuitry

Document #:
IPC-4203
Revision
A
Product Type
Standard Only
Released:  01/25/2013
Language
English
This standard establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides. These materials are to be used as cover material for flexible printed circuitry as well as supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry. The standard does not address...
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IPC-4101 - Revision C - Standard Only

Specification for Base Materials for Rigid and Multilayer Printed Boards

Document #:
IPC-4101
Revision
C
Product Type
Standard Only
Released:  08/26/2009
Language
English
This specification covers the requirements for base materials that are referred to as laminate or prepreg. These are to be used primarily for rigid and multilayer printed boards for electrical and electronic circuits. This document contains 66 individual specification sheets that can be searched using key words. These key words allow the document's user to find materials of a similar nature, but...
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IPC-T-50 - Revision N - Standard Only

电子电路互连与封装术语及定义

Document #:
IPC-T-50
Revision
N
Product Type
Standard Only
Released:  01/13/2023
Language
Chinese
Current Revision
IPC-T-50N-CN文件旨在为电子行业中常用的词汇和术语提供其定义。本文件所规定的定义充分详细地阐明了术语，以便以英语为第二语言的读者能够理解含义的细微之处。IPC-T-50N-CN包含550多个新的或修订的术语，包括通孔结构、表面贴装器件类型、焊料凸点、焊料合金、焊接、退润湿、电路板制造工艺和测试的新术语。

IPC-T-50 - Revision K - Standard Only

Begriffe und Definitionen für Leiterplatten und elektronische Baugruppen

Document #:
IPC-T-50
Revision
K
Product Type
Standard Only
Released:  02/03/2015
Language
German
Current Revision
Das unentbehrliche Nachschlagewerk für alle Verantwortlichen entlang der Wertschöpfungskette von elektronischen Produkten. Die Revision K enthält auf mehr als 120 Seiten, mehr als 220 neue und überarbeitete Begriffe und bildliche Darstellungen. Beispiele: Access Hole, Accelerated Equivalent Soak, Capture Land, Micro Via Technology, Plating Thief, Etchback, Resin Recession, Tape Automated Bonding...

IPC-4202 - Revision A - Standard Only

Flexible Base Dielectrics for Use in Flexible Printed Circuitry

Document #:
IPC-4202
Revision
A
Product Type
Standard Only
Released:  04/13/2010
Language
English
This document provides comprehensive data to help users more easily determine both material capability and compatibility for flexible base dielectric materials for manufacture of flexible printed circuitry and flexible flat cables. It includes flexible base material specification sheets that have been updated with the newest properties for the specification material types. It establishes the most...

IPC-4412 - Revision B - Standard Only

Specification for Finished Fabric Woven from "E" Glass for Printed Boards

Document #:
IPC-4412
Revision
B
Product Type
Standard Only
Released:  06/17/2013
Language
English
IPC-4412B exhaustively covers the classification and requirements for finished fabrics that are formed by plain woven glass fiber yarns. Simply, these yarns are appropriately sized bundles of continuous filament, electrical-grade ("E" glass) borosilicate glass. Bulk "E" glass, for ease of description, is composed of a blend of raw metal oxides that form a borosilicate glass upon melting. Once...
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IPC-4103 - Revision A - Standard with Amendment 1

Specification for Base Materials for High Speed/High Frequency Applications

Document #:
IPC-4103
Revision
A
Product Type
Standard with amendment(s)
Released:  03/25/2014
Language
English
This specification covers the requirements for clad and unclad plastic laminate and bonding layer materials to be used for the fabrication of printed boards for microstrip, stripline, and high speed digital electrical and electronic circuits. In addition to updated testing parameters, inspection lot requirements, revised visual acceptance criteria, this revision incorporates a new specification...
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IPC-4821 - Amendment 1

Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

Document #:
IPC-4821
Revision
Original Version
Product Type
Amendment
Released:  05/01/2006
Language
English
Current Revision
IPC-4821 Amendment 1 provides the update of IPC-CF-148 to the correct IPC-4563, references the IPC-TM-650, Method 2.5.7.2 for correct Hi-Pot testing of these thin materials, uses proper reference for visual inspection by inspectors and finally, updated the first five material specification sheets (IPC-4821/1 through IPC-4821/5) that now show Effective Dates of April 2010. The Specification Sheet...
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IPC-4412 - Revision B - Amendment 2

Specification for finished Fabric Woven from "E" Glass for Printed Boards

Document #:
IPC-4412
Revision
B
Product Type
Amendment
Released:  05/18/2018
Language
English
IPC-4421B-AM2 an amendment includes two extensive tables of finished fabric glass styles, one in SI (metric) units and the other in U.S. (English) units. IPC-4412B standard exhaustively covers the classification and requirements for finished fabrics that are formed by plain woven glass fiber yarns. Simply, these yarns are appropriately sized bundles of continuous filament, electrical-grade ("E"...
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IPC-4562 - Revision A - Amendment 1

Metal Foil for Printed Board Applications

Document #:
IPC-4562
Revision
A
Product Type
Amendment
Released:  02/01/2013
Language
English
Amendment 1 to IPC-4562A re-inserts the specification sheet IPC-4562/6 (CU-W6) back into the IPC-4562A document that was previously removed when the standard was revised to it's a revision from its original release in April 2008. Also included in this Amendment 1 are all references to the IPC-4562/6 (CU-W6) in section 1.2.4.1, the Table A1, the summary of all specification sheets as well as the...
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IPC-4202 - Revision A - Amendment 1

Flexible Base Dielectrics for Use in Flexible Printed Circuitry

Document #:
IPC-4202
Revision
A
Product Type
Amendment
Released:  03/01/2014
Language
English
Amendment 1 to IPC-4202A modifies the standard by correcting editorial errors; converts metric dimensional units of measure to those commonly used throughout industry; describes the flammability method of test and requirements for very thin materials (VTM); and corrects property requirement errors in all nine specification sheets contained in this standard.
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IPC-7095 - Revision D - Standard with Amendment 1

BGA设计与组装工艺的实施

Document #:
IPC-7095
Revision
D
Product Type
Standard with amendment(s)
Released:  09/19/2019
Language
Chinese
Current Revision
IPC-7095D在设计，组装，检查和维修过程中实施球栅阵列（BGA）和细节距球栅阵列（FBGA）技术提出了了一些独特的挑战。它为使用或正在考虑使用BGA的用户提供有用和实用的信息。 它还介绍了如何使用BGA成功实现印刷电路板组件的稳健设计和装配流程，以及解决BGA组装过程中可能出现的一些常见异常的方法。由于焊球中合金，焊球形状，封装程序等的改变，许多问题变得尤为重要。D版主要重点是为组装后出现的一些新的机械失效问题如坑裂或层压缺陷提供信息。除了提供BGA检查和维修的指引外，本标准还解决了与BGA相关的可靠性问题和无铅焊点的使用标准。该标准中有许多X射线和内窥镜的照片和插图以确认行业中BGA组装工艺的实施中的遇到的一些情况。

IPC-4101 - Revision E - Standard Only

刚性及多层印制板用基材规范

Document #:
IPC-4101
Revision
E
Product Type
Standard Only
Released:  11/16/2018
Language
Chinese
Current Revision
IPC-4101E涵盖了被称为层压板或粘结片的基材的要求，并列在主体最后一部分的规格单中。 这些要求主要用于电子互连的刚性和多层印刷电路板中。 本文档包含了65个单独的规格单，可以使用关键字搜索。 这些关键字允许本文档的用户查找类似性质的材料，但具有特定的不同特性，可以对其层压板和/或粘结片选择需求进行微调。 修订版E增加了附录A，提供补充检查要求，但仅在材料用户的采购订单或主图纸有要求时使用。 全文共152页。 于2017年3月发布。2018年10月翻译。
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IPC-7095 - Revision D - Standard with Amendment 1

ボールグリッドアレイ(BGA)の設計および組立プロセスの実施 – 改訂版1

Document #:
IPC-7095
Revision
D
Product Type
Standard with amendment(s)
Released:  06/17/2020
Language
Japanese
Current Revision
IPC-7095D-AM1は、ボールグリッドアレイ(BGA)およびファインピッチBGA(FBGA)技術の設計および組立の実施について記述するものであり、これらのパッケージを使用したプリント基板の設計と組立に関連する検査、リペアおよび信頼性の問題に焦点を当てている。 IPC-7095D-AM1は、BGAを使用している、もしくは使用を検討している本書読者に対し、有用で実用的な情報を提供するものである。またIPC-7095D-AM1では、BGAを使用するプリント基板組立のためのロバスト設計と組立プロセスの正しい方法について説明するとともに、BGAの組立中に発生する可能性のある一般的な異常について、トラブルシューティングの方法を説明している。

IPC-SM-840 - Revision E - Standard Only

永久性阻焊剂和挠性覆盖材料的鉴定和性能规范

Document #:
IPC-SM-840
Revision
E
Product Type
Standard Only
Released:  11/20/2012
Language
Chinese
Current Revision
简要介绍 （英文） 建立了液态和干膜阻焊材料的评估要求，以及确定其用在一个标准的印制板系统上的可接受性要求。IPC-SM-840提供了两个等级的要求，T级和H级，以反映基于行业/最终用户要求对功能性的要求及测试严格程度的差别。覆盖了附着力、材料鉴定、耐溶剂、以及电气要求。E版本包含了挠性覆盖材料的要求，在已蚀刻的导体和其他导电图形上提供挠性的介质保护层。共19页。2010年12月发布。2012年10月翻
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IPC-4412 - Revision B - Amendment 1

Specification for Finished Fabric Woven from "E" Glass for Printed Boards

Document #:
IPC-4412
Revision
B
Product Type
Amendment
Released:  04/01/2014
Language
English
Specification for Finished Fabric Woven from "E" Glass for Printed Boards The Amendment 1 to IPC-4412B adds a new glass yarn [either SI identification => (4 1.32 1X0) or US identification => (BC 3750 1/0)] and a new light weight weave style => (1010) to the standard

IPC-4103 - Revision A - Amendment 1

Specification for Base Materials for High Speed/High Frequency Applications

Document #:
IPC-4103
Revision
A
Product Type
Amendment
Released:  01/01/2014
Language
English
Specification for Base Materials for High Speed/High Frequency Applications Amendment 1 generates a formalized record, for document control purposes, of corrections to ten separate sections in the main body of the standard; to the first 16 "legacy" specification sheets (IPC-4103/1 through IPC-4103/16); and to the 10 "new format" specification sheets for bonding layer materials (IPC-4103/500...
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IPC-1601 - Revision A - Standard Only

印制板操作和储存指南

Document #:
IPC-1601
Revision
A
Product Type
Standard Only
Released:  04/12/2019
Language
Chinese
Current Revision
描述 关于印制板操作、包装和储存的行业指南。这些指南是为了保护印制板，避免其受到污染、物理损坏、可焊性降低、静电放电（必要时）和吸湿。本文件考虑了包装材料和方法、生产环境、操作和产品运输，建立了除湿烘烤曲线。修订本A扩大了覆盖范围，包括防潮袋（MBB）、烘烤对印刷板可焊性的影响、ESD问题、蚀刻芯和复合材料的湿度问题、干燥剂材料和HIC卡以及包装和处理要求的示例流程。2017年8月翻译。
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IPC-1601 - Revision A - Standard Only

プリント基板の取扱いと保管に関するガイドライン

Document #:
IPC-1601
Revision
A
Product Type
Standard Only
Released:  10/17/2022
Language
Japanese
Current Revision
概説 本書はプリント基板の取扱い、梱包、保管に関する、業界唯一のガイドラインである。このガイドラインはプリント基板を汚染、物理的損傷、はんだ付性の低下、吸湿から保護することを目的としている。梱包材の種類と方法、製造環境、製品の取扱いと輸送、水分除去のためのベーキングプロファイルの確立などについて懸念事項が示されている。本書(A版)では、防湿袋(MBB)、プリント基板をベーキングすることによるはんだ付性への影響、ESDの問題、エッチング後のコア材・サブコンポジットの湿気に関する懸念事項、乾燥剤とHICカード、梱包/取扱いに関する要求事項のフローダウンの事例についてより詳しく解説している。 翻訳年： 2022年7月。
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IPC-4202 - Revision B - Standard Only

挠性印制板用挠性基底电介质

Document #:
IPC-4202
Revision
B
Product Type
Standard Only
Released:  07/30/2019
Language
Chinese
Current Revision
本文档提供了全面的数据，帮助用户更轻松的确定挠性基底电介质材料的材料性能和兼容性，以制造挠性印制电路板。标准包括灵活的基础材料规格单，这些规格单针对已使用规格材料类型的最新属性进行了更新。标准建立了最新的分类体系、鉴定和质量符合性要求，其中包括高频介电特性。随着市场上的应用，标准还增加了碳氟化合物膜的新规格单。全文共23页。2017年3月发布。
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IPC-7093 - Revision A - Standard Only

底部端子元器件(BTCs)设计和组装工艺的实施

Document #:
IPC-7093
Revision
A
Product Type
Standard Only
Released:  09/14/2022
Language
Chinese
Current Revision
IPC-7093A 标准为实施底部端子元器件(BTCs)提供了基本的设计和组装指南。具体而言，IPC-7093A 提供了与 BTCs 相关的关键设计、材料、组装、检查、维修、质量和可靠性问题的指南。
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Coming Soon

IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)

IPC-2294: Design Standard for Printed Electronics on Rigid Substrates

IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards

J-STD-609C: Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-8401: Guidelines for In-Mold Electronics

IPC-HERMES-9852 Version 1.6: The Global Standard for Machine-to-Machine Communication in SMT Assembly