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IPC-J-STD-005 - Standard Only

Requirements for Soldering Pastes

Document #:
IPC-J-STD-005
Revision
Original Version
Product Type
Standard Only
Released:  05/05/2008
Language
Japanese
This is the Japanese language version of J-STD-005. Lists requirements for qualification and characterization of solder paste. Test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes are included. Supersedes QQ-S-571. Developed by IPC and EIA. 24 pages. Released January 1995.
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