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Document #:

IPC-TR-587

Revision

Original Version

Product Type

Study/Technical Report

Released: 08/04/2020

Language

English

Current Revision

IPC-TR-587 technical report delivers results of a major study on conformal coating. In most manufacturing specifications, conformal coating thickness is defined as the thickness of the final polymer film on a flat, unencumbered surface of the assembly, however conformal coating thickness on other assembly and component surfaces is not characterized. IPC-TR-587 is a report outlining an IPC study of...

Document #:

IPC-TR-582

Revision

Original Version

Product Type

Study/Technical Report

Released: 10/02/2018

Language

English

Current Revision

This document details the test procedures, test results and team conclusions for the IPC Cleaning and Cleanliness Testing Program, Phase 3, Low Solids Flux in Ambient Air. This effort has been part of a multi-stage program to investigate material and process alternatives to the use of chlorofluorocarbons (CFCs) in electronics manufacturing. This Phase 3 effort has been dedicated to characterizing...

Document #:

IPC-TR-583

Revision

Original Version

Product Type

Study/Technical Report

Released: 07/01/2002

Language

English

Current Revision

This original research was a cooperative effort between the EMPF and IPC, released as EMPF-RR-0013 in 1993 for better understanding of ionic cleanliness testing. The IPC Ionic Conductivity/Ion Chromatography Test Task Group has validated its continued importance and relevance to the cleaning community and IPC-TR-583 is the result. It includes how solvent temperature influences the final...

Document #:

IPC-TR-486

Revision

Original Version

Product Type

Study/Technical Report

Released: 07/01/2001

Language

English

Current Revision

This technical report provides full detail of the round robin study charged with assessing the use of Interconnect Stress Test (IST) as a test for incoming inspection in lieu of Thermal Stress in the detection of innerlayer separations in plated-through holes. Includes background on the Post Separation Task Group, test results, round robin test plan, conclusions and test methods used. 51 pages...

Document #:

IPC-TR-465

Revision

Original Version

Product Type

Study/Technical Report

Released: 07/01/1996

Language

English

Current Revision

Details the results of a two-year study to determine the effect of steam aging exposure on components. A variety of solderable finishes were used. A small production simulation utilized preconditioned and as-received samples and tested a total of 2,000 joints. 15 pages. Released July 1996.

Document #:

IPC-TR-467

Revision

Original Version

Product Type

Study/Technical Report

Released: 10/01/1996

Language

English

Current Revision

This addendum to J-STD-001, originally developed for Revision B but also applicable to Revision C, proposes solutions for cost-effective testing and increased implementation. Also covers other assembly test methods that are not addressed in J-STD-001. 12 pages. Released October 1996. Now available in electronic format.

Document #:

IPC-TP-1113

Revision

Original Version

Product Type

Study/Technical Report

Released: 01/01/1994

Language

English

Current Revision

A Technical Paper by Dr. Jack Brous discussing ionic cleanliness measurement, testing methods and cleanliness standards in relation to product reliability. Also includes a brief discussion of no-clean fluxes. 8 pages. Released 1994

Document #:

IPC-TR-587

Revision

Original Version

Product Type

Study/Technical Report

Language

English

Current Revision

Document #:

IPC-TR-586

Revision

Original Version

Product Type

Study/Technical Report

Released: 03/01/2009

Language

English

This technical report provides the documentation of a round robin testing effort that generated data used by the 4-14 Plating Processes Subcommittee in developing the maximum immersion silver plating thickness requirement in the revision A of IPC-4553. This compendium of data resulted from three information sets: a) Test vehicle assembly report by Celestica, b) Thermal cycle test report by...