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Document #:

IPC-WP-023

Revision

Original Version

Product Type

White Paper

Released: 05/01/2018

Language

English

Current Revision

IPC-WP-023 is an IPC Technology Solutions White Paper addressing reliability issues associated with stacked microvias. There is evidence that staggering vias can result in a more robust structure; however, staggering microvias is only a temporary solution to accommodate complex designs with microvias built with weak interface structures IPC-WP-023 white paper provides an investigation of these...

Document #:

IPC-WP-024

Revision

Original Version

Product Type

White Paper

Released: 08/16/2018

Language

English

Current Revision

IPC-WP-024 is a white paper which discusses the issues associated with reliability of smart textiles (e-textiles structures) following multiple washing cycles and emphasizes efforts that industry and research laboratories must undertake to make e-textile structures more robust and able to be washed similarly to everyday textile products (e.g., underwear, clothing, home textiles and technical...

Document #:

IPC/PERM-WP-022

Revision

Original Version

Product Type

White Paper

Released: 09/05/2018

Language

English

Current Revision

Manufacturers of high reliability electronics have been working for many years to mitigate the deleterious effects of tin whisker formation. One highly effective means to suppress the growth of tin whiskers is to replace the pure tin plating with reﬂowed tin-lead solder. One approach is to fully consume the tin plating by tin-lead solder during the SMT reﬂow process. This phenomenon of tin...

Document #:

IPC-WP-025

Revision

Original Version

Product Type

White Paper

Released: 04/01/2019

Language

English

Current Revision

This white paper is a benchmarking exercise of e-textile integrations, providing an introductory categorization of how the current market sector is using textile-based electrical components to achieve integrated functionality. This peer assessment provides a baseline understanding of e-textile process techniques, requirements and resources within this emerging sector.

Document #:

IPC-SPVC-TAL

Revision

Original Version

Product Type

White Paper

Released: 11/12/2009

Language

English

Current Revision

The IPC Solder Products Value Council’s Technical Subcommittee Report “Take Action Limits (TAL) for SAC305 Lead Free Soldering Processes Utilizing Solder Baths/Pots” reports on research on take action limits of solder pot contamination for SAC305 lead-free solder. As opposed to one maximum contamination level, the IPC SPVC opted to identify three action levels: Normal operation defined as the...

Document #:

IPC-WP-024

Revision

Original Version

Product Type

White Paper

Released: 04/16/2019

Language

Chinese

Current Revision

IPC-WP-024是一份白皮书，讨论了多次洗涤循环后智能织物（电子织物结构）可靠性相关的问题，并强调了工业和研究实验室必须做出的努力。以使电子织物结构更加坚固，能够像市场上的日常织物（例如，内衣、服装、家用织物和技术织物）一样被清洁或洗涤。研究人员在商用洗衣机和家用洗衣机洗涤剂多次洗涤循环后，为电子织物提供实验室测试的初始可靠性结论。