The IPC-1921A handbook provides problems, causes and possible corrective actions related to printed board manufacturing processes. Includes more than 200 photos and illustrations depicting common defects.
IPC-1782B establishes minimum requirements for manufacturing and supply chain traceability based on perceived risk. IPC-1782B applies to all products, processes, assemblies, parts, components, equipment used and other items as defined by users and suppliers in the manufacture of printed board assemblies, as well as mechanical assembly and printed board fabrication. IPC-1782B is applicable both for...
The IPC-1752B standard establishes the requirements for exhanging material and substance data between suppliers and their customers for electrical and electronics products and other produicts. IPC-1752B includes data fields to help supply chain members transfer materials data required for submission into the ECHA SCIP database.
Amendment 1 to IPC-1751A standard provides the principles and details for declarations necessary between members of a supply chain relationship. This standard is the first in a series of standards that permits segmentation of declaration details based on the subject and scope of the declaration as well as the manufacturing domain. This standard contains general information and is supplemented by...
This standard provides useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies. This revision expands the focus of the original standard from reflow profiling to include profiling for vapor phase, laser, selective soldering and wave soldering. The revision also includes a full-color troubleshooting guide for addressing common...
IPC-7526A handbook addresses understencil cleanliness during stencil printing, removal of solder paste from stencils following the cleaning process and misprint PCB board cleaning considerations.
This document includes lead free, no-clean, and environmental friendly chemistries. This is a collection of information on electronic board and assembly cleaning in a single location. This major revision explains the relationship between materials, processes, and contaminants in fabrication and assembly operations. It also addresses cleanliness assessment and process control in relation to...
This document standardizes the requirements for power conversion devices (PCDs) for the computer and telecommunications industries. The phrase “power conversion devices” refers to ac to dc and dc to dc modules, converters and power supplies. This specification sets the requirements for design; qualification testing; conformance testing and manufacturing quality/reliability processes, but does not...
IPC-7094A describes the design and assembly challenges for implementing flip chip technology in a direct chip attach (DCA) assembly. The effect of bare-die or die-size components in a flip chip format has an impact on component characteristics and dictates the appropriate assembly methodology. The IPC-7094A standard focuses on design, assembly methodology, critical inspection, repair and...
This document describes the design and assembly challenges and ways to address those challenges for implementing 3D component technology. Recognizing the effects of combining multiple uncased semiconductor die elements in a single-package format can impact individual component characteristics and can dictate suitable assembly methodology. The information contained in this standard focuses on...
While there are a variety of industry test vehicles for the examination of material compatibility, the IPC-B-52 test board was created to meet the needs for testing both ion chromatograph and surface insulation resistance (SIR) which would be more representative of the manufacturing materials and processes. IPC-9203A standard addresses the IPC-B-52 test vehicle, which can be used to evaluate a...
Strain gage testing allows for objective analysis of the strain and strain rate levels to which a surface mount package may be subjected to during assembly, test and operation. Excessive strain can result in various failure modes for different solder alloys, package types, surface finishes or laminate materials. This document describes specific guidelines for strain gage testing during the printed...
IPC-J-STD-004C - Revision C - Standard with Amendment 1
The IPC J-STD-004C WAM1 standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. The IPC J-STD-004C WAM1 standard may be used for quality control and procurement purposes. Soldering flux materials include the following: liquid flux, paste flux, solder paste, solder cream as well as flux-coated and flux-cored solder...
IPC-4203B establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry, as well as supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry. IPC-4203B does not cover non...
IPC-2231A provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability, Environment, Reuse) process for layout of printed boards.
The IPC-9701B standard establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be solder-attached to rigid, flexible or rigid-flex printed boards. The characterization results can be used to predict the field lifetime of solder attachments for the use environments and conditions of...
The IPC-A-640A standard provides acceptance requirements and technical insight that have been removed from acceptance standards for cable and wire harness assemblies incorporating optical fiber, optical cable and hybrid wiring technology. The IPC-A-640A is intended for use by the design engineer, manufacturing engineer, quality engineer and other individuals responsible for tailoring specific...
The IPC-4591A standard establishes the classification system and the qualification and quality conformance requirements for functional conductive materials used in printed electronics applications. It provides companies that procure functional materials for printed electronics with the necessary technical structure to design and manufacture products meeting conformance to industry-determined...
This document is the product of the IPC Electrochemical Migration (ECM) Task Group. It was drafted to provide guidance regarding implementation of the User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing to evaluate the effects of mechanical stress, laminate material fracturing, ionic contamination, moisture...
This standard provides and defines key characteristics and test methods for procuring printed electronics substrates. Includes six materials specification sheets.
Provides requirements for dielectric adhesives to hold components in place from the mounting to the soldering process and identifies test methods to ensure their long term properties. 9 pages. Released December 2014.
The IPC-4202C standard covers the requirements for flexible base materials, herein referred to as laminates, prepregs or films, to be used primarily for flexible printed boards for electrical and electronic circuits
IPC-4103B standard covers the requirements for clad and unclad plastic laminate and bonding layer materials to be used for the fabrication of printed boards for microstrip, stripline and high speed digital electrical and electronic circuits. In addition to better definitions of inclusions and how to properly classify them; redefine "substrates" as, "fabricated sheets"; and a more proper definition...
The IPC-9202A, Material and Process Characterization/Qualification Test Protocol that records changes in Surface Insulation Resistance (SIR) on a representative sample of a printed circuit assembly (PCA). It quantifies any deleterious effects that might arise from solder flux or other process residues left on external surfaces after soldering, which can cause unwanted electro-chemical reactions...
The IPC-2581C standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most...