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IPC-7711/21 - Revision B - Standard Only

Přepracování, modifikace a opravy elektronických sestav

Document #:
IPC-7711/21
Revision
B
Product Type
Standard Only
Released:  01/27/2008
Language
Czech
Current Revision
Download an update to published IPC-7711B/7721B Part 3 Procedure 6.1.(English only) Základni aktualizace pro bezolovnatou technologii a zlepšené návody pro kontrolu oprav a modifikací Tento návod obsahuje vše, čeho je zapotřebí pro opravy a přepracování elektronických sestav a desek plošných spojů! IPC 7711/7721 Přepracování,modifikace a opravy elektronických sestav prošla kompletní aktualizaci...
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IPC/WHMA-A-620 - Revision B - Standard Only

Kablo ve Kablo Takımları için Kabul Gereklilikleri

Document #:
IPC/WHMA-A-620
Revision
B
Product Type
Standard Only
Released:  11/12/2014
Language
Turkish
Current Revision
Revizyon B, Kablo ve Kablo Takımlarının Kabul Gereklilikleri için endüstrinin ortak dökümanı olmayı sürdürmektedir. IPC ile Kablo Takımları Üreticileri Birliği (WHMA), bu önemli güncellemeyi geliştirmek için beraber çalışmışlardır. YENİ! Dolgu, kalıplı dolgu, ekleme, yalıtkan desteği olmayan krimp kontakları, sıralı yalıtkan yer değiştirme konnektörleri, konnektör bağlantısı, sert ve uyumlu kablo...

IPC/WHMA-A-620 - Revision B - Standard Only

Juhtme- ja kaablikoostude vastavusnõuded

Document #:
IPC/WHMA-A-620
Revision
B
Product Type
Standard Only
Released:  12/01/2014
Language
Estonian
Current Revision
IPC/WHMA-A-620B on ainus juhtme- ja kaablikoostude vastavusnõudeid sisaldav tööstuse konsensuslik standard ning see on väljatöötatud IPC ja Wire Harness Manufacturers Association (WHMA). UUS! Standard sisaldab laialdasi nõudeid survevalule, vormivalule, juhtmete jätkamisele, ilma isolatsiooni toeta juhtme pressimisele, isolatsiooni eemalduseta ühendustele, pistikutele, monoliitsetele ja tinatatud...
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IPC-7711/21 - Revision B - Standard Only

Elektronik Takımlarda Yeniden İşlem, Modifikasyon ve Onarım

Document #:
IPC-7711/21
Revision
B
Product Type
Standard Only
Released:  11/30/2007
Language
Turkish
Current Revision
IPC-7711/7721 Elektronik Takımlarda Yeniden İşlem, Modifikasyon ve Onarım, kurşunsuz ve geleneksel Kalay-Kurşun ile lehimli takımların her ikisi için de uygulanabilirliği sağlamak için prosedür bazında eksiksiz bir güncellemesi geçerli olmuştur. Bu tek cilt daha önce yayınlanan tüm değişiklikleri, BGA'lar için (topların yenilenmesini de içeren) yeni birkaç prosedürü ve esnek-baskı devre kartı...

IPC-2221 - Revision B - Standard Only

Basisrichtlinie für das Design von Leiterplatten

Document #:
IPC-2221
Revision
B
Product Type
Standard Only
Released:  11/11/2013
Language
German
Current Revision
BeschreibunginEnglisch IPC-2221B ist die Basisrichtlinie für das Design und bildet die Grundlage für alle Dokumente der IPC-2220-Serie. Sie legt die allgemeinen Anforderungen für das Design von Leiterplatten aus organischenMaterialien sowie anderen Formen der Bauteilbefestigung oder Verbindungsstrukturen fest. Die Materialien können homogen, verstärkt oder in Kombination mit anorganischen...

IPC-7525 - Revision B - Standard Only

Designrichtlinie für Druckschablonen

Document #:
IPC-7525
Revision
B
Product Type
Standard Only
Released:  04/15/2013
Language
German
Current Revision
Dieses Dokument unterstützt Richtlinien für das Design und die Herstellung von Druckschablonen für Lotpasten und Kleber für die Oberflächenmontage für THT- und THT/SMD-Technologie. Darin eingeschlossen sind die Unterschiede zwischen bleihaltigen und bleifreien Lotpasten, Überdruckung, Doppeldruck und Stufenschablonen Designs. Enthalten sind ebenfalls Beispiele für ein Bestellformular und die...

IPC-7711/21 - Revision B - Standard Only

Rework, Modification and Repair of Electronic Assemblies

Document #:
IPC-7711/21
Revision
B
Product Type
Standard Only
Released:  03/23/2009
Language
Swedish
Current Revision
This is the Swedish language translation of IPC-7711B/7721B IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure applicability to both lead free and traditional SnPb soldered assemblies. This single volume includes all previously published changes and several new procedures for BGAs (including reballing) and flex...

IPC-7711/21 - Revision B - Standard Only

Refacerea, Modificarea și Reparația Ansamblurilor Electronice

Document #:
IPC-7711/21
Revision
B
Product Type
Standard Only
Released:  08/06/2012
Language
Romanian
Current Revision
DESCRIERE engleză IPC-7711B/7721B Refacerea, Modificarea și Reparația Ansamblurilor Electronice a fost în mod total revizuit, procedură cu procedură, pentru a se asigura aplicabilitatea atât pentru ansamblurile lipite tradițional cu aliaje SnPb cât și pentru cele fără plumb. Acest unic volum include toate modificările anterior publicate și câteva proceduri noi pentru circuite BGA (inclusiv...
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IPC-2221 - Revision A - Standard Only

Generic Standard on Printed Board Design

Document #:
IPC-2221
Revision
A
Product Type
Standard Only
Released:  06/04/2007
Language
Chinese
Current Revision
This is the Chinese language translation of IPC-2221A. Only available in electronic format. IPC-2221A is the foundation design standard for all documents in the IPC-2220 series. It establishes the generic requirements for the design of printed boards and other forms of component mounting or interconnecting structures, whether single-sided, double-sided or multilayer. Among the many updates to...
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IPC-7525 - Revision C - Standard Only

模板设计指导 Stencil Design Guidelines

Document #:
IPC-7525
Revision
C
Product Type
Standard Only
Released:  11/01/2023
Language
Chinese
Current Revision
本标准是为设计与制造焊膏及表面贴装粘合剂用模板提供指导。本文件大部分内容是基于模板设计者、制造厂商和用户的经验编写的。

IPC-1601 - Standard Only

Handhabung und Lagerung von Leiterplatten

Document #:
IPC-1601
Revision
Original Version
Product Type
Standard Only
Released:  08/30/2010
Language
German
Current Revision
BeschreibunginEnglisch Der einzige Industrie-Standard für das Handling, die Verpackung und Lagerung von Leiterplatten. Die Anwendung dieser Richtlinie soll Leiterplatten schützen vor Verunreinigung, mechanischer Beschädigung, Verschlechterung der Lötbarkeit und Feuchteaufnahme. Berücksichtigt werden Verpackungsmaterialien- und methoden, Produktionsumgebung, Handling und Transport der Produkte...
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IPC-2231 - Standard Only

卓越设计（DFX）指南

Document #:
IPC-2231
Revision
Original Version
Product Type
Standard Only
Released:  04/09/2020
Language
Chinese
Current Revision
本文件提供了制定最佳实践方法的指南，用于在开发正式DFX（面向可制造性、可制作性、可组装性、可测试性、成本、可靠性、环境、重用性设计）的过程中对采用表面贴装和通孔器件的印制板组件进行布局。

IPC-7092 - Standard Only

埋入式元器件涉及和组装工艺的实施

Document #:
IPC-7092
Revision
Original Version
Product Type
Standard Only
Released:  01/20/2020
Language
Chinese
Current Revision
本标准描述了在印制板中以成形或放置方式实现的有源和无源元器件在设计和组装方面的挑战。包括内部电子元器件的完整结构可用于表面贴装和／或通孔元器件连接。在组装过程中，多层结构变成准备为进一步加工的完整产品，它可由有机、无机（陶瓷）或两类兼有的材料制成。
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IPC-D-620 - Standard Only

线缆及线束组件的设计与关键工艺要求

Document #:
IPC-D-620
Revision
Original Version
Product Type
Standard Only
Released:  03/24/2022
Language
Chinese
Current Revision
IPC-D-620 为线缆和线束组件以及军事/航空应用的三个产品类别提供了设计与关键工艺要求。 它是 IPC/WHMA-A-620“线缆及线束组件的要求与验收”及其相关航空附录的设计要求伴侣 包括三份白皮书，为标准中讨论的关键主题提供指导。 这些是： IPC-WP-113, Guidance for the Development and Implementation of a Red Plague Control Plan (RPCP) IPC-WP-114, Guidance for the Development and Implementation of a White Plague Control Plan (WPCP) IPC-WP-116, Guidance for the Development and Implementation of a Foreign Object...
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IPC-1782 - Standard Only

电子产品的制造和供应链可追溯性标准

Document #:
IPC-1782
Revision
Original Version
Product Type
Standard Only
Released:  04/12/2019
Language
Chinese
Current Revision
缺乏统一的元器件可追溯性标准已经导致不必要的资源消耗（例如时间、人力、金钱等）来跟踪事件或部件的来源，并补救相关质量、可靠性等问题。标准缺失也导致难以一致地创建和适当地执行必要的合同。 本标准建立了制造商和供应链可追溯性的最低要求，此要求是基于供需双方协商确定（AABUS）的感知风险。本标准适用于所有产品，制程，组件，部件，元器件，所使用的设备以及由供需双方在印制电路板组件制造以及机械组装中定义的其他项目。
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IPC-1602 - Standard Only

プリント基板の取扱いと保管に関する規格

Document #:
IPC-1602
Revision
Original Version
Product Type
Standard Only
Released:  08/11/2023
Language
Japanese
Current Revision
規格書「IPC-1602」はプリント基板を汚染や物理的損傷、はんだ付性の低下や吸湿から保護することを目的とし、その要求事項を取りまとめたものである。梱包資材の種類や梱包方法、製品の製造環境、取扱いと輸送、また、水分除去を目的としたベーキングプロファイルの策定などに関し、懸念事項が示されている。今回のIPC-1602では、調達文書に記載可能な要求事項についても触れている。本規格書「IPC-1602」では、防湿袋(MBB)、プリント基板をベーキングすることによるはんだ付性への影響、ESD問題、エッチング後のコア材・複合材の湿気に関する懸念事項、乾燥剤とHICカード、梱包/取扱いに関する要求事項のフローダウン例など幅広い内容を網羅している。

IPC-7093 - Standard Only

底部端子元器件(BTC)设计和组装工艺的实施

Document #:
IPC-7093
Revision
Original Version
Product Type
Standard Only
Released:  03/28/2011
Language
Chinese
Current Revision
本标准描述了采用底部端子表面贴装元器件(BTC)在设计和组装方面的挑战，BTC元器件外部连接由构成元器件整体一部分的金属端子组成。本文件中BTC包括了仅有底部端子并要实施表面贴装的所有类型元器件。包括QFN、 DFN、 SON、 LGA、MLP 和MLF等业界描述性术语。这里所含信息的焦点放在BTCs元器件的关键设计、组装、检验、维修以及和BTC相关的可靠性问题上。 这份文件的目标读者是与电子设计、组装、检验和维修等过程有关的经理、设计和工艺工程师、操作员和技术员。本文件的目的是给正考虑采用锡/铅、无铅、粘合剂或其它形式互连工艺来组装BTC类元器件的那些公司提供实际而有用的资讯。虽然本文件不是包含一切的秘方，但它识别了影响进行稳健和可靠组装的许多特性，可给正面临组装制程问题的元器件供应商提供指导性的信息。全文共68页。2011年3月发布。2014年5月翻译。

IPC-2152 - Standard Only

Designrichtlinie für die Bestimmung der Stromtragfähigkeit von Leiterplatten

Document #:
IPC-2152
Revision
Original Version
Product Type
Standard Only
Released:  08/30/2009
Language
German
Current Revision
Beschreibung in Englisch Der einzige Industrie-Standard zur Bestimmung der geeigneten Dimensionierung von Leitern auf Innen- und Aussenlagen von Leiterplatten, in Bezug auf die geforderte Stromtragfähigkeit und die zulässige Temperaturerhöhung von Leitern. Dieser Standard beschäftigt sich mit dem Einfluss von Thermischer Leitfähigkeit, Durchkontaktierungen, Kupferflächen, Verlustleistung und...

IPC-7530 - Standard Only

Útmutató tömegforrasztási (reflow és hullám) folyamatok hőmérsékleti profiljának kialakításához

Document #:
IPC-7530
Revision
Original Version
Product Type
Standard Only
Released:  04/19/2014
Language
Hungarian
Current Revision
MEGHATÁROZÁS> angolul MEGHATÁROZÁS angolul A tömegforrasztás során alapvető fontosságú, hogy mindegyik forraszkötés elérje a minimális forrasztási hőmérsékletet ezzel biztosítható, hogy a forraszanyag és az összeforrasztandó fémfelületek között diffúziós kötés jöjjön létre. A diffúziós kötésnek mindkét forrasztandó fémfelület és a forraszanyag között létre kell jönnie. Ehhez a minimális...
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IPC-1602 - Standard Only

印制板操作和储存标准

Document #:
IPC-1602
Revision
Original Version
Product Type
Standard Only
Released:  10/04/2023
Language
Chinese
Current Revision
IPC-1602 标准提供了保护印制板，避免其受到污染、物理损坏、可焊性降低和吸湿的要求。要考虑包装的材料类型和方法、生产环境、产品的操作和运输，以及为除水汽建立烘烤曲线。IPC-1602 提供了可在采购文件中列出的要求。IPC-1602 标准扩充了防潮袋 (MBB) 的覆盖范围、烘烤对印刷板可焊性的影响、ESD 问题、蚀刻的芯板和压合结构的的湿气关注、干燥剂材料和湿度指示卡（HIC），以及传递对包装和操作要求的范例。IPC-1602替代了原IPC-1601A即印制板操作和存储指南的许多建议性要求，而改为强制性要求
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Coming Soon

IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

IPC-7530B: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)

IPC-2294: Design Standard for Printed Electronics on Rigid Substrates

IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards

J-STD-609C: Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

IPC-8401: Guidelines for In-Mold Electronics

IPC-HERMES-9852 Version 1.6: The Global Standard for Machine-to-Machine Communication in SMT Assembly